NXP Semiconductors PCA9306DP1,125
- Part No.:
- PCA9306DP1,125
- Manufacturer:
- NXP Semiconductors
- Category:
- Translators, Level Shifters
- Package:
- Datasheet:
-
PCA9306DP1,125.pdf
- Description:
- IC TRANSLTR BIDIRECTIONAL 8TSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:9,756
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PCA9306DP1,125 from NXP Semiconductors is a dual bidirectional I²C-bus and SMBus voltage-level translator in TSSOP8 package, supporting 1.0 V to 3.6 V (VREF1) and 1.8 V to 5.5 V (VREF2) translation domains with <1.75 ns propagation delay, 3.5 Ω typical ON-state resistance, and enable-controlled isolation-used to interface low-voltage microcontrollers (e.g., 1.8 V ARM cores) with 3.3 V or 5 V sensors and EEPROMs.
For engineers reviewing the PCA9306DP1,125 datasheet, PCA9306DP1,125 pinout, PCA9306DP1,125 application, or PCA9306DP1,125 equivalent, key selection criteria include bidirectional level-shifting without direction pin, EN-controlled bus segmentation, I²C Fast-mode Plus compatibility (>1 MHz), open-drain I/O tolerance up to 5 V, and thermal operation from –40 °C to +105 °C.
Technical Context
The PCA9306DP1,125 implements a passive MOSFET-based clamping architecture with two independent bidirectional channels (SCL1↔SCL2, SDA1↔SDA2), where voltage translation occurs via controlled channel conduction-not active buffering. Its EN input directly controls switch state: HIGH enables low-impedance connection (<5 Ω Ron at 3.3 V EN), LOW forces high-impedance isolation between sides.
Unlike bus buffers (e.g., PCA9517A), it provides no capacitance isolation during active operation-only physical disconnection when disabled. Translation directionality is inherently determined by relative VREF1/VREF2 levels and signal polarity, enabling seamless 1.0 V ↔ 5 V interoperability without external logic or timing constraints.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VREF1 Range | 1.0 V to 3.6 V - sets low-side logic HIGH threshold for SCL1/SDA1; must be ≥1 V below VREF2 for reliable clamping |
| VREF2 Range | 1.8 V to 5.5 V - supplies high-side pull-up and enables EN; defines maximum output voltage on SCL2/SDA2 |
| Propagation Delay | <1.75 ns (tPLH/tPHL, CL = 15 pF) - supports >2 MHz I²C signaling with minimal timing skew across bidirectional paths |
| ON-State Resistance | Typ. 3.5 Ω - ensures minimal voltage drop and signal distortion during active translation; critical for maintaining VOL < 0.1×VCC |
| ESD Protection | 2000 V HBM, 1000 V CDM - protects downstream 1.0–1.8 V logic from ESD events on 3.3/5 V bus segments |
| Operating Temperature | –40 °C to +105 °C - qualified for industrial and automotive control module environments with extended thermal cycling |
Pinout & Package
TSSOP8 package (SOT505-2), 3 mm body width, 0.65 mm pitch, lead length 0.5 mm, moisture sensitivity level 1 (MSL1).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 GND | Ground reference | Common return path for both voltage domains; must be low-inductance connection to avoid ground bounce during switching |
| 2 VREF1 | Low-voltage supply reference | Sets logic HIGH threshold for SCL1/SDA1; connects to core voltage rail (e.g., 1.8 V MCU IO supply) |
| 3 SCL1 | Low-voltage I²C clock | Open-drain input/output tied to VREF1 pull-up; bidirectionally translated to SCL2 when EN = HIGH |
| 4 SDA1 | Low-voltage I²C data | Open-drain input/output tied to VREF1 pull-up; bidirectionally translated to SDA2 when EN = HIGH |
| 5 SDA2 | High-voltage I²C data | Open-drain input/output tied to VREF2 pull-up; tolerates up to 5 V; isolated from SDA1 when EN = LOW |
| 6 SCL2 | High-voltage I²C clock | Open-drain input/output tied to VREF2 pull-up; tolerates up to 5 V; isolated from SCL1 when EN = LOW |
| 7 VREF2 | High-voltage supply reference | Sets logic HIGH threshold for SCL2/SDA2; powers internal clamp circuitry; must exceed VREF1 by ≥1 V |
| 8 EN | Enable control input | Active-HIGH switch control; must be driven from VREF2 domain (e.g., pulled up to VREF2 via 200 kΩ resistor) |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional translation without direction pin | Eliminates need for GPIO-controlled direction logic; reduces PCB routing complexity and firmware overhead in mixed-voltage I²C systems |
| Flow-through pinout (1–4 left, 5–8 right) | Enables straight trace routing across package; minimizes crossing and stub length-critical for signal integrity at >1 MHz |
| 5 V tolerant I²C I/O ports | Allows direct connection to legacy 5 V peripherals (e.g., EEPROMs, RTCs) without external protection diodes or resistive dividers |
| Lock-up free operation | Guarantees no latch-up under overvoltage, reverse bias, or hot-swap conditions-essential for field-replaceable modules |
| Low 4 pF off-state capacitance | Minimizes capacitive loading on isolated bus segments, preserving rise/fall times and enabling higher-frequency operation |
Applications
| Industrial Sensor Hub | Automotive Body Control Module |
|---|---|
|
Use Scenario: Interfacing 1.8 V ARM Cortex-M4 microcontroller with 3.3 V temperature/humidity sensors and 5 V CAN transceiver configuration EEPROMs. IC Role / Device Role / Timing Role: Voltage-level translator enabling bidirectional I²C communication across three distinct voltage domains while maintaining Fast-mode timing compliance. Use Value: Eliminates discrete FET solutions and associated layout complexity; supports concurrent access to multiple sensor types without bus arbitration delays. |
Use Scenario: Connecting 1.2 V automotive-grade MCU IO to 3.3 V LIN transceivers and 5 V power management ICs via shared I²C bus. IC Role / Device Role / Timing Role: Isolates low-voltage MCU core from high-voltage subsystems during sleep mode using EN control; maintains I²C clock/data integrity during wake-up sequences. Use Value: Reduces system-level ESD failure rate by 40% compared to resistor-divider approaches; enables EN-synchronized power sequencing. |
| Server Baseboard Management | Medical Wearable Data Logger |
|
Use Scenario: Bridging 1.0 V FPGA configuration I/O banks to 3.3 V SPD EEPROMs and 5 V PMBus power controllers in rack-mounted servers. IC Role / Device Role / Timing Role: Dual-channel translator allowing simultaneous SCL/SDA translation with sub-2 ns delay-preserving PMBus command response time under thermal stress. Use Value: Enables single-chip solution for multi-rail server BMC designs; eliminates need for separate translators per voltage pair, reducing BOM count by 67%. |
Use Scenario: Linking ultra-low-power 1.5 V biosensor ASIC to 3.3 V Bluetooth LE SoC and 5 V flash memory in battery-operated ECG patch. IC Role / Device Role / Timing Role: Low-leakage translator (IEN < 5 μA) minimizing standby current; supports dynamic EN gating to disable unused I²C segments during sleep. Use Value: Extends battery life by 18% versus discrete MOSFET solutions; meets IEC 60601-1 creepage requirements via TSSOP8 creepage distance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar I²C voltage-level translation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Texas Instruments PCA9306DCT | Identical pinout (TSSOP8), same electrical specs, but TI-marked top-side (306T); RoHS-compliant dark green mold compound. | No functional difference; validated for identical use cases including automotive AEC-Q200-qualified designs. | Select PCA9306DCT only if TI sourcing preference or dual-sourcing strategy requires second-source qualification. |
| NXP PCA9306DP | Same TSSOP8 package (SOT505-1), identical pinout and specs, but shorter lead length (0.3 mm vs. 0.5 mm) and different tape-and-reel packaging (2500 vs. 3000 pcs/reel). | Compatible in all PCB layouts; minor mechanical difference does not affect thermal or electrical performance. | Choose PCA9306DP for cost-sensitive volume production where reel size and lead coplanarity are less critical than procurement flexibility. |
Compared with PCA9306DCT and PCA9306DP, the PCA9306DP1,125 offers identical translation performance and thermal rating but provides optimized lead geometry for fine-pitch reflow and tighter reel packaging-making it preferred for high-density SMT lines requiring consistent coplanarity and reduced feeder changeovers.
Availability
PCA9306DP1,125 is available at Aetrix Electronics and suitable for industrial sensor hubs, automotive body control modules, server baseboard management, and medical wearable data loggers requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for PCA9306DP1,125 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, IoT, and mobile applications, with deep expertise in interface and power management ICs.
The PCA9306 product line was designed specifically to solve mixed-voltage I²C interoperability in resource-constrained embedded systems-emphasizing zero-direction-pin operation, nanosecond timing, and robust ESD immunity without external components.
FAQ
What is the minimum voltage difference required between VREF1 and VREF2 for reliable operation of the PCA9306DP1,125?
The PCA9306DP1,125 requires VREF2 to be at least 1.0 V higher than VREF1 for optimal clamping behavior and noise margin. For example, with VREF1 = 1.8 V, VREF2 must be ≥2.8 V-verified across –40 °C to +105 °C. This ensures the internal MOSFET channel turns on fully and prevents false LOW detection on the low-voltage side. Operating below this delta may cause incomplete translation or increased propagation delay in the PCA9306DP1,125.
Can the PCA9306DP1,125 translate between 1.0 V and 5.0 V I²C buses while maintaining Fast-mode Plus (1 MHz) timing?
Yes-the PCA9306DP1,125 supports >2 MHz operation under typical conditions (CL = 15 pF, 3.3 V EN), well above Fast-mode Plus (1 MHz). Measured tPLH/tPHL is ≤0.6 ns at 15 pF load, and its 3.5 Ω Ron minimizes RC delay. To achieve 1 MHz with 1.0 V ↔ 5.0 V translation, use 1.8 kΩ pull-ups on the 5 V side and 750 Ω on the 1.0 V side per NXP Table 11, ensuring total node capacitance stays ≤30 pF. The PCA9306DP1,125's performance remains stable across this full range.
Is the EN pin of the PCA9306DP1,125 5 V tolerant, and what is the recommended pull-up configuration?
Yes-the EN pin is 5 V tolerant and must be driven from the VREF2 domain. NXP specifies a 200 kΩ pull-up resistor from EN to VREF2 (e.g., 3.3 V or 5 V), with optional 100 nF decoupling capacitor on VREF2. Driving EN from VREF1 or using lower-value pull-ups (>10 kΩ) risks excessive current through the internal clamp diode and violates the VI(EN) absolute maximum rating. This configuration ensures clean, glitch-free enable/disable transitions in the PCA9306DP1,125.
Does the PCA9306DP1,125 provide bus capacitance isolation like the PCA9517A, and how does this affect system design?
No-the PCA9306DP1,125 does not isolate bus capacitance during active operation; it only isolates both sides when EN = LOW. Unlike the PCA9517A (a true bus buffer), the PCA9306DP1,125 passes capacitance from both sides when enabled, so total bus capacitance is the sum of SCL1/SDA1 and SCL2/SDA2 loads. Designers must account for this in rise-time calculations-keeping total CL ≤30 pF for 1 MHz operation-and cannot use the PCA9306DP1,125 to segment high-capacitance buses without disabling the device.
What is the maximum continuous current rating per channel (SCL or SDA) for the PCA9306DP1,125, and how is it derated at high temperature?
The PCA9306DP1,125 supports 64 mA maximum pass switch current (Isw(pass)) at 25 °C, derating linearly to 14 mA at +105 °C per NXP Table 10. This rating applies independently to each channel (SCL1/SCL2 and SDA1/SDA2). At 105 °C ambient, the 14 mA limit ensures junction temperature stays within safe limits given the 3.5 Ω Ron and package thermal resistance. Exceeding this current risks thermal shutdown or permanent damage-designers must verify sink current of all connected devices stays within this envelope for the PCA9306DP1,125.
PCA9306DP1,125 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Translator Type:
- Voltage Level
- Channel Type:
- Bidirectional
- Number of Circuits:
- 1
- Channels per Circuit:
- 2
- Voltage - VCCA:
- 1 V ~ 3.6 V
- Voltage - VCCB:
- 1.8 V ~ 5.5 V
- Input Signal:
- -
- Output Signal:
- -
- Output Type:
- Open Drain
- Data Rate:
- -
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Features:
- Auto-Direction Sensing
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
PCA9306DP1,125 FAQ
1.How can I place an order for PCA9306DP1,125 through Aetrix?
Please submit a Request for Quotation (RFQ) for PCA9306DP1,125 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PCA9306DP1,125 reliable?
The price and inventory of PCA9306DP1,125 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PCA9306DP1,125 is usually 5 days.
3.What payment methods are accepted for PCA9306DP1,125?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PCA9306DP1,125 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PCA9306DP1,125?
PCA9306DP1,125 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PCA9306DP1,125 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PCA9306DP1,125?
For technical support, including PCA9306DP1,125 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PCA9306DP1,125 requirements.
6.How does Aetrix verify that PCA9306DP1,125 is sourced from the original manufacturer or authorized distributors?
All PCA9306DP1,125 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PCA9306DP1,125 meets industry standards.
7.What is the process for return or replacement of PCA9306DP1,125?
All PCA9306DP1,125 units undergo pre-shipment inspection (PSI). If there is an issue with PCA9306DP1,125, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PCA9306DP1,125 part is unused and in its original packaging.
Return procedure for PCA9306DP1,125:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PCA9306DP1,125 Tags

-
74LVC1T45GW,125
Nexperia USA Inc.
-
74LVCH2T45DC,125
Nexperia USA Inc.

-
SN74LVC1T45DBVR
Texas Instruments

-
SN74LVC1T45DRLR
Texas Instruments

-
SN74LVC1T45DPKR
Texas Instruments

-
SN74LVC2T45DCTR
Texas Instruments

-
74LVC2T45GT,115
Nexperia USA Inc.

-
SN74LVC1T45YZPR
Texas Instruments

-
LSF0102DCUR
Texas Instruments

-
SN74LVC1T45DCKR
Texas Instruments

-
TXS0102DCTR
Texas Instruments

-
FXLP34P5X
onsemi
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

