My Inquiry
My Account
Texas Instruments PCI2050BIGHK
- Part No.:
- PCI2050BIGHK
- Manufacturer:
- Texas Instruments
- Category:
- Specialized
- Package:
- 257-LFBGA
- Datasheet:
-
PCI2050BIGHK.pdf
- Description:
- IC INTERFACE SPECIALIZED 257BGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,689
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PCI2050BIGHK from Texas Instruments is a PCI-to-PCI bridge IC enabling high-performance interconnection between two 32-bit, 66-MHz PCI buses. It supports concurrent bidirectional burst transfers, write combining, and internal two-tier arbitration for up to nine secondary bus masters. Its −40°C to 85°C industrial temperature range and 257-terminal MicroStar BGA package make it suitable for rugged embedded systems requiring hot-swap-capable CompactPCI expansion.
For engineers reviewing the PCI2050BIGHK datasheet, PCI2050BIGHK pinout, PCI2050BIGHK application, or PCI2050BIGHK equivalent, key selection criteria include 66-MHz dual-bus timing compliance, CompactPCI hot-swap support, JTAG boundary-scan testability, and industrial-grade thermal operation with universal 3.3-V/5-V tolerant I/Os.
Technical Context
The PCI2050BIGHK implements a fully compliant PCI-to-PCI Bridge Specification Revision 1.1 architecture with independent read/write buffers and pipeline forwarding. It supports Type 0 and Type 1 configuration cycles, frame-to-frame latency of only four PCI clocks, and programmable decode options for VGA/palette memory and I/O address spaces.
Its power management conforms to PCI Bus Power Management Interface Specification Revision 1.1, supporting D0–D3 states with predictable latency behavior. Secondary bus arbitration includes both internal two-tier logic and external arbiter interface capability, while CompactPCI hot-swap functionality is enabled via dedicated HSLED, HSENUM, and HSSWITCH/GPIO3 signals.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Bus Interface | Two independent 32-bit PCI buses, each supporting 33-MHz or 66-MHz operation |
| Core Voltage | 3.3-V core logic with universal I/Os compatible with both 3.3-V and 5-V PCI signaling environments |
| Operating Temperature | −40°C to +85°C industrial grade, validated for continuous operation in extended thermal environments |
| Package | 257-terminal MicroStar BGA (GHK/ZHK footprint), RoHS-compliant variant available as PCI2050BIZHK |
| Hot-Swap Support | Fully compliant with PICMG CompactPCI Hot-Swap Specification Revision 1.0, including HSLED, HSENUM, and switch control |
| JTAG Test Access | IEEE 1149.1-compliant boundary-scan architecture with TCK, TMS, TDI, TDO, and TRST terminals |
| Arbitration | Internal two-tier arbitration supporting up to nine secondary bus masters; external arbiter interface via S_REQ/S_GNT signals |
Pinout & Package
The PCI2050BIGHK is housed in a 257-terminal MicroStar BGA package (GHK footprint), mechanically and electrically identical to the PCI2050BGHK variant but rated for −40°C to +85°C operation. Pin assignments follow Table 2−3 (GHK/ZHK Signal Names Sorted Alphabetically) in the SCPS076G datasheet.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P_CLK / S_CLK | Primary/Secondary PCI clock input | Accepts 33-MHz or 66-MHz PCI clock; enables synchronous bridging with precise timing alignment |
| P_RST / S_RST | Primary/Secondary reset input | Asynchronous active-low reset; secondary bus driven low during assertion per PCI specification |
| P_AD[31:0] / S_AD[31:0] | Primary/Secondary address/data multiplexed bus | 32-bit time-multiplexed AD bus supporting burst transfers and configuration cycles |
| P_C/BE[3:0] / S_C/BE[3:0] | Primary/Secondary command/byte enable | Four-cycle command encoding and per-byte write enable control for aligned memory/I/O access |
| S_CLKOUT[0:9] | Secondary PCI clock outputs | Ten buffered clock outputs for driving multiple secondary slot devices with matched skew |
| HSSWITCH/GPIO3 | Hot-swap switch control / general-purpose I/O | Configurable GPIO supporting hot-swap insertion detection and board-level control sequencing |
| MS0 / MS1 | Mode select inputs | Strap pins defining bridge operating mode (e.g., configuration via MS0/MS1 per Table 3−3) |
| TCK / TMS / TDI / TDO / TRST | JTAG boundary-scan interface | Full IEEE 1149.1 test access port enabling production testing and debug visibility |
Key Features
| Feature | Design Value |
|---|---|
| Write Combining | Aggregates multiple small writes into larger bursts, reducing bus occupancy and improving throughput for memory-mapped I/O |
| 66-MHz Dual-Bus Operation | Enables full-bandwidth bridging at maximum PCI specification speed without throttling either bus |
| Frame-to-Frame Latency | Fixed four-PCI-clock delay between primary and secondary bus transactions ensures deterministic timing for real-time systems |
| CompactPCI Hot-Swap | Dedicated hardware signals (HSENUM, HSLED, HSSWITCH) and register support simplify implementation of safe card insertion/removal |
| Power Management Compliance | Full D0–D3 state support per PCI Bus Power Management Interface Specification enables system-level energy optimization |
Applications
| Industrial CompactPCI Systems | Multi-Slot Embedded Controllers |
|---|---|
Use Scenario: Ruggedized industrial control chassis with hot-swappable I/O modules requiring electrical isolation between slots. IC Role / Device Role / Timing Role: PCI-to-PCI bridge providing hierarchical bus segmentation, load isolation, and hot-swap coordination. Use Value: Enables >10-device PCI topologies while maintaining signal integrity and supporting field-replaceable module maintenance without system shutdown. | Use Scenario: High-density embedded controller with multiple PCI mezzanine cards (e.g., motion control, vision capture, communication). IC Role / Device Role / Timing Role: Interconnect bridge managing concurrent DMA traffic between CPU host and peripheral cards across separate PCI domains. Use Value: Delivers predictable sub-4-clock latency and burst-mode throughput to sustain real-time data acquisition and deterministic control loops. |
| Medical Imaging Subsystems | Test & Measurement Equipment |
Use Scenario: Modular MRI or CT scanner backplane where imaging processors and sensor interfaces require isolated, high-bandwidth PCI interconnect. IC Role / Device Role / Timing Role: Bridge enforcing strict timing boundaries between safety-critical and non-critical subsystems. Use Value: Supports 66-MHz operation and write combining to handle high-volume pixel data streaming without bus contention or timeout errors. | Use Scenario: Automated test equipment with mixed-vendor PCI instruments requiring electrical loading mitigation and synchronized trigger distribution. IC Role / Device Role / Timing Role: Hierarchical bus manager providing clock fanout (S_CLKOUT[0:9]), configuration space isolation, and delayed transaction buffering. Use Value: Ten secondary clock outputs ensure phase-aligned timing across instruments; internal arbitration prevents resource starvation during multi-instrument parallel testing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PCI-to-PCI bridge applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| PCI2050BGHK | Identical functionality and pinout; rated for 0°C to +70°C commercial temperature range | Suitable for non-industrial environments where extended thermal operation is not required | Select PCI2050BGHK when ambient operating conditions remain within commercial temperature limits and cost sensitivity favors standard-grade parts |
| PLX Technology PCI9052 | PCI-to-Local Bus bridge (not PCI-to-PCI); lacks secondary bus arbitration, clock fanout, and CompactPCI hot-swap logic | Designed for host-to-peripheral interfacing rather than bus hierarchy expansion | Choose PCI9052 only for simple add-in card designs needing local bus peripherals-not for multi-slot, hot-swap, or bus-isolation use cases |
Compared with PCI2050BGHK, the PCI2050BIGHK provides guaranteed operation over −40°C to +85°C without derating, making it essential for outdoor, automotive under-hood, or factory-floor deployments; versus PCI9052, it delivers true dual-PCI-domain bridging with integrated arbitration and hot-swap infrastructure-neither of which is present in local bus bridge architectures.
Availability
PCI2050BIGHK is available at Aetrix Electronics and suitable for industrial CompactPCI systems, ruggedized embedded controllers, and medical imaging subsystems requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for PCI2050BIGHK includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and connectivity solutions for industrial, automotive, and communications markets.
The PCI2050BIGHK belongs to TI's Connectivity Solutions product line, designed specifically to enable scalable, standards-compliant PCI bus expansion in harsh-environment embedded systems requiring hot-swap, power management, and deterministic latency.
FAQ
What is the operating temperature range of the PCI2050BIGHK?
The PCI2050BIGHK is rated for continuous operation from −40°C to +85°C, meeting industrial-grade thermal requirements. This extended range distinguishes it from the commercial-grade PCI2050BGHK (0°C to +70°C) and ensures reliable performance in demanding environments such as factory automation, transportation systems, and outdoor infrastructure where ambient temperatures fluctuate widely. The device maintains full PCI 66-MHz timing compliance across this entire range.
Does the PCI2050BIGHK support 66-MHz operation on both PCI buses?
Yes, the PCI2050BIGHK supports simultaneous 66-MHz operation on both primary and secondary PCI buses, as confirmed in Section 1.1 Features and Section 6.4 AC parameters of the SCPS076G datasheet. It meets all timing requirements for 66-MHz PCI Local Bus Specification Revision 2.2, including setup/hold margins and clock-to-output delays. The device uses advanced submicron CMOS to sustain this performance without thermal throttling.
How does the PCI2050BIGHK implement CompactPCI hot-swap functionality?
The PCI2050BIGHK implements CompactPCI hot-swap via dedicated hardware signals - HSENUM (hot-swap enumeration), HSLED (hot-swap status LED control), and HSSWITCH/GPIO3 (insertion detection switch input) - along with corresponding registers in the Hot-Swap Control Status Register (Section 5.18). These features comply with PICMG CompactPCI Hot-Swap Specification Revision 1.0 and enable safe, software-coordinated card insertion and removal without disrupting other system components.
What package type and pin count does the PCI2050BIGHK use?
The PCI2050BIGHK uses a 257-terminal MicroStar BGA package with GHK footprint, as specified in Section 1.4 Ordering Information and Figure 2−1 of the SCPS076G datasheet. This package is mechanically and electrically identical to the PCI2050BGHK variant but qualified for −40°C to +85°C operation. Pin assignments match Table 2−3 (GHK/ZHK Signal Names Sorted Alphabetically) and support full PCI signaling, JTAG, hot-swap, and power management functions.
Is the PCI2050BIGHK compatible with PCI Local Bus Specification Revision 2.2?
Yes, the PCI2050BIGHK is fully compliant with PCI Local Bus Specification Revision 2.2, as explicitly stated in Section 1.1 Features and Section 1 Introduction of the SCPS076G datasheet. It supports all mandatory commands (Memory Read/Write, I/O Read/Write, Configuration Read/Write), Type 0/Type 1 configuration cycles, parity reporting, error handling (SERR, PERR), and bus locking propagation - ensuring interoperability with standard PCI hosts and endpoints across diverse system configurations.
PCI2050BIGHK Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 257-LFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Applications:
- PCI-to-PCI Bridge
- Interface:
- PCI
- Voltage - Supply:
- 3V ~ 3.6V
- Supplier Device Package:
- 257-BGA MICROSTAR (16x16)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
PCI2050BIGHK FAQ
1.How can I place an order for PCI2050BIGHK through Aetrix?
Please submit a Request for Quotation (RFQ) for PCI2050BIGHK on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PCI2050BIGHK reliable?
The price and inventory of PCI2050BIGHK are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PCI2050BIGHK is usually 5 days.
3.What payment methods are accepted for PCI2050BIGHK?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PCI2050BIGHK transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PCI2050BIGHK?
PCI2050BIGHK orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PCI2050BIGHK order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PCI2050BIGHK?
For technical support, including PCI2050BIGHK datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PCI2050BIGHK requirements.
6.How does Aetrix verify that PCI2050BIGHK is sourced from the original manufacturer or authorized distributors?
All PCI2050BIGHK products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PCI2050BIGHK meets industry standards.
7.What is the process for return or replacement of PCI2050BIGHK?
All PCI2050BIGHK units undergo pre-shipment inspection (PSI). If there is an issue with PCI2050BIGHK, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PCI2050BIGHK part is unused and in its original packaging.
Return procedure for PCI2050BIGHK:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PCI2050BIGHK Tags
-
NVT4857UKAZ
NXP Semiconductors
-
TCA8418RTWR
Texas Instruments
-
PCA9546APWR
Texas Instruments
-
MD0100N8-G
Microchip Technology
-
PCA9548APW,118
NXP Semiconductors
-
PCA9540BDP,118
NXP Semiconductors
-
PCA9548APWR
Texas Instruments
-
PCA9546APW,118
NXP Semiconductors
-
PTN3360DBS,518
NXP Semiconductors
-
PCA9546ABS,118
NXP Semiconductors
-
PCA9518PWR
Texas Instruments
-
PCA9545APW,118
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
