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Home > Products > Integrated Circuits (ICs) > Clock/Timing > Application Specific Clock/Timing

NXP Semiconductors PCKV857DGG,512

Name: PCKV857DGG,512
Brand: NXP Semiconductors
SKU: PCKV857DGG,512
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: PCKV857DGG,512

Manufacturer:: NXP Semiconductors

Category:: Application Specific Clock/Timing

Package:: 48-TFSOP (0.240", 6.10mm Width)

Datasheet:: PCKV857DGG,512.pdf

Description:: IC CLK BUF DDR 190MHZ 1CIRC

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Product details

Overview

PCKV857DGG,512 from NXP Semiconductors (formerly Philips) is a differential 1:10 zero-delay clock buffer IC designed for DDR SDRAM clock distribution. It operates from 70–190 MHz with <75 ps output skew and <75 ps period jitter, supports SSTL_2 I/O levels, and features PLL-based phase alignment with power-down control via PWRDWN pin for DDR200/266 DIMM systems.

For engineers reviewing the PCKV857DGG,512 datasheet, PCKV857DGG,512 pinout, PCKV857DGG,512 application, or PCKV857DGG,512 equivalent, key selection criteria include differential 1:10 fanout capability, SSTL_2 interface compatibility, sub-100 ps skew/jitter performance, 2.2–2.7 V AVDD/2.3–2.7 V VDDQ supply range, and TSSOP-48 package suitability for high-density memory subsystems.

Technical Context

The PCKV857DGG,512 integrates a PLL-based zero-delay architecture with differential input (CLK/CLK, FBIN/FBIN) and ten differential output pairs (Y0–Y9), plus FBOUT/FBOUT feedback. It uses analog power (AVDD/AGND) separate from digital VDDQ/GND to minimize noise coupling in timing-critical paths.

Its operation includes automatic PLL enable/disable based on input frequency detection (<20 MHz triggers sleep mode), test-mode bypass of PLL while enabling buffers, and spread-spectrum clock tolerance. All outputs are SSTL_2 compliant with 12 mA drive strength and controlled slew rate (1–2 V/ns).

Key Specifications

Parameter	Value and Actual Design Meaning
Frequency Range	70–190 MHz - Valid operating bandwidth for DDR200/266 clock distribution without signal degradation.
Output Skew	<75 ps - Ensures simultaneous edge arrival across all 10 differential output pairs for synchronous memory access.
Period Jitter	<75 ps - Maintains tight timing margins in high-speed DDR interfaces where jitter directly impacts setup/hold windows.
Supply Voltage	VDDQ: 2.3–2.7 V; AVDD: 2.2–2.7 V - Dual-rail support enables independent analog/digital power domain isolation.
I/O Standard	SSTL_2 - Matches JEDEC DDR SDRAM interface requirements for termination, voltage levels, and drive strength.
Power-Down Current	≤100 µA - Enables ultra-low static power during standby while preserving state for fast wake-up.
Input Sensitivity	DC differential input ≥0.36 V - Guarantees reliable switching with low-amplitude DDR clock signals.

Pinout & Package

Package: TSSOP-48 (SOT362-1), 6.1 mm body width, 0.5 mm lead pitch. Pin-compatible with PCKV857DGV (TVSOP-48) and PCKV857EV (VFBGA56) variants.

Pin/Terminal	Circuit Role	Design Meaning
13, 14	CLK, CLK	Differential clock input pair - Accepts SSTL_2-compliant reference clock; drives internal PLL and distribution network.
35, 36	FBIN, FBIN	Differential feedback input - Connects to FBOUT/FBOUT to close PLL loop for zero-delay operation.
2–3, 5–6, 9–10, 19–20, 22–23, 26–27, 29–30, 32–33, 39–40, 43–44, 46–47	Y0–Y9, Y0–Y9, FBOUT, FBOUT	Differential outputs - Ten buffered clock outputs + one feedback output; all SSTL_2, 12 mA drive, matched routing required.
37	PWRDWN	Active-low power-down control - Forces all outputs to high-impedance and disables PLL when logic low.
16	AVDD	Analog power supply - Powers PLL core and bias circuitry; requires clean, low-noise regulation separate from VDDQ.
4, 11, 12, 15, 21, 28, 34, 38, 46	VDDQ	I/O power supply - Supplies SSTL_2 output drivers and input receivers; must be decoupled per JEDEC DDR guidelines.

Key Features

Feature	Design Value
Zero-Delay PLL Architecture	Eliminates propagation delay between input and outputs by locking feedback to reference, enabling precise phase alignment in DDR timing budgets.
Automatic Low-Frequency Detection	Disables PLL and enters low-power mode when input falls below 20 MHz, reducing current draw without external supervision.
Spread-Spectrum Clock Tolerance	Tracks frequency-modulated clocks to reduce EMI in dense PCB layouts without compromising jitter performance.
Test Mode Bypass	Enables direct buffer path while disabling PLL - allows functional verification of distribution network independent of PLL lock status.
SSTL_2 Interface Compliance	Meets JEDEC JESD8-6 specifications for voltage thresholds, drive strength, and termination, ensuring interoperability with DDR SDRAM controllers and devices.

Applications

DDR200 DIMM Modules	DDR266 Memory Subsystems
Use Scenario: Distributing a single differential system clock to ten DDR SDRAM chips on a 200 MT/s unbuffered DIMM. IC Role / Device Role / Timing Role: Zero-delay clock buffer providing phase-aligned, low-skew copies to each DRAM device's CK/CK# inputs. Use Value: Enables stable 200 MT/s operation by maintaining ≤75 ps skew across all ten outputs, meeting JEDEC tSKEL specification.	Use Scenario: Clocking dual-rank DDR266 modules in server memory channels requiring strict inter-rank skew control. IC Role / Device Role / Timing Role: Differential 1:10 fanout device delivering synchronized clocks to two ranks of DDR SDRAM with shared feedback path. Use Value: Achieves <75 ps inter-output skew and <75 ps period jitter, satisfying DDR266 tJIT and tSKEL timing constraints.
DDR SDRAM Controller Interfaces	Memory Test Equipment
Use Scenario: Buffering and distributing clock from memory controller ASIC to multiple DDR SDRAM banks in embedded SoC platforms. IC Role / Device Role / Timing Role: High-fanout clock driver isolating controller outputs from capacitive loading of multiple DRAMs while preserving signal integrity. Use Value: Reduces controller output load by >90%, preventing waveform distortion and timing violations at 190 MHz.	Use Scenario: Generating precise, multi-phase clock stimuli for DDR SDRAM parametric testing in ATE environments. IC Role / Device Role / Timing Role: Programmable clock distribution unit with test-mode bypass and deterministic skew for repeatable timing margin validation. Use Value: Delivers sub-100 ps jitter and calibrated skew for accurate setup/hold time measurement across all DUT clock domains.

DDR200 DIMM Modules

DDR266 Memory Subsystems

Use Scenario: Distributing a single differential system clock to ten DDR SDRAM chips on a 200 MT/s unbuffered DIMM.

IC Role / Device Role / Timing Role: Zero-delay clock buffer providing phase-aligned, low-skew copies to each DRAM device's CK/CK# inputs.

Use Value: Enables stable 200 MT/s operation by maintaining ≤75 ps skew across all ten outputs, meeting JEDEC tSKEL specification.

Use Scenario: Clocking dual-rank DDR266 modules in server memory channels requiring strict inter-rank skew control.

IC Role / Device Role / Timing Role: Differential 1:10 fanout device delivering synchronized clocks to two ranks of DDR SDRAM with shared feedback path.

Use Value: Achieves <75 ps inter-output skew and <75 ps period jitter, satisfying DDR266 tJIT and tSKEL timing constraints.

DDR SDRAM Controller Interfaces

Memory Test Equipment

Use Scenario: Buffering and distributing clock from memory controller ASIC to multiple DDR SDRAM banks in embedded SoC platforms.

IC Role / Device Role / Timing Role: High-fanout clock driver isolating controller outputs from capacitive loading of multiple DRAMs while preserving signal integrity.

Use Value: Reduces controller output load by >90%, preventing waveform distortion and timing violations at 190 MHz.

Use Scenario: Generating precise, multi-phase clock stimuli for DDR SDRAM parametric testing in ATE environments.

IC Role / Device Role / Timing Role: Programmable clock distribution unit with test-mode bypass and deterministic skew for repeatable timing margin validation.

Use Value: Delivers sub-100 ps jitter and calibrated skew for accurate setup/hold time measurement across all DUT clock domains.

Equivalent & Alternatives

The following parts are listed as comparable options for similar differential clock distribution applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IDT72V223L	1:10 LVDS fanout, 200 MHz max, no integrated PLL - relies on external feedback for zero-delay operation.	Requires external loop filter and layout for PLL stability; not SSTL_2 compatible - needs level-shifting for DDR use.	Choose when LVDS signaling and external PLL control are preferred over integrated SSTL_2 solution.
ICS83010AGI	1:10 HCSL fanout, 170 MHz max, integrated PLL, but only 2.5 V single-supply - no AVDD/VDDQ separation.	Lacks analog/digital power rail isolation; higher jitter (>100 ps) limits use in DDR266+ applications.	Choose for cost-sensitive HCSL-based systems where 170 MHz bandwidth and moderate jitter are acceptable.

Compared with IDT72V223L and ICS83010AGI, the PCKV857DGG,512 uniquely combines SSTL_2 compliance, dual-rail power, <75 ps skew/jitter, and integrated PLL in a single TSSOP-48 package - making it the only drop-in solution for JEDEC-compliant DDR200/266 DIMM clock trees without redesign.

Availability

PCKV857DGG,512 is available at Aetrix Electronics and suitable for DDR200 DIMM modules, DDR266 memory subsystems, and DDR SDRAM controller interfaces requiring stable component supply, long-term lifecycle support, and JEDEC-compliant timing performance.

Supply support for PCKV857DGG,512 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips Semiconductors in 2006, specializing in secure connectivity solutions for automotive, industrial, and communication markets.

The PCKV857 series was developed by Philips Semiconductors specifically for high-reliability DDR SDRAM clock distribution, targeting JEDEC-compliant DIMM modules and memory subsystems requiring low skew, low jitter, and SSTL_2 interface fidelity.

FAQ

What is the operating temperature range for the PCKV857DGG,512?

The PCKV857DGG,512 is characterized for operation from 0 °C to +70 °C ambient temperature. This commercial-grade range aligns with standard DDR DIMM module environmental requirements and ensures stable performance in desktop, server, and embedded memory applications. The device's thermal design and SSTL_2 I/O structure maintain timing accuracy within this range without derating. PCKV857DGG,512 does not support extended or industrial temperature grades.

Does the PCKV857DGG,512 require external passive components for PLL stability?

No, the PCKV857DGG,512 integrates all necessary PLL loop-filter components internally and requires no external capacitors or resistors for stable lock. Its PLL achieves phase lock within 100 µs after power-up or frequency recovery above 20 MHz. External decoupling capacitors (0.1 µF ceramic + 4.7 µF tantalum per VDDQ/AVDD rail) are required per JEDEC DDR guidelines, but no PLL-specific passives are needed. PCKV857DGG,512 simplifies board design by eliminating loop-filter tuning.

How does the PCKV857DGG,512 handle spread-spectrum clocking?

The PCKV857DGG,512 is explicitly designed to track spread-spectrum clock inputs with minimal added jitter, supporting EMI reduction techniques used in host platforms. Its PLL bandwidth and feedback architecture accommodate typical ±0.25% to ±0.5% frequency modulation without loss of lock or increased period jitter. This capability is verified in the original Philips datasheet and enables PCKV857DGG,512 to maintain <75 ps jitter even under modulated input conditions - critical for noise-sensitive DDR systems.

Can the PCKV857DGG,512 be used with DDR3 or DDR4 memory interfaces?

No, the PCKV857DGG,512 is not suitable for DDR3 or DDR4 interfaces. It is specified only for DDR200/266 (PC1600/PC2100) applications and supports SSTL_2 signaling, not the SSTL_18 or POD12 standards required by DDR3/DDR4. Its 70–190 MHz frequency range, 2.5 V supply rails, and JEDEC JESD8-6 compliance are optimized for legacy DDR SDRAM. Using PCKV857DGG,512 in DDR3/DDR4 designs would violate voltage, timing, and interface specifications.

What is the function of the AVDD and AGND pins on the PCKV857DGG,512?

The AVDD (Pin 16) and AGND (Pin 17) pins supply dedicated analog power to the PLL core, bias circuits, and internal reference generators - isolating sensitive analog functions from digital switching noise on VDDQ/GND rails. This separation reduces jitter and improves phase-lock stability. AVDD must be regulated independently (2.2–2.7 V) and decoupled with low-ESR capacitors. Failure to properly isolate AVDD/AGND degrades PCKV857DGG,512's <75 ps jitter performance and may cause PLL unlock under dynamic load.

PCKV857DGG,512 Specifications

Product attributes: Attribute value

Manufacturer:: NXP Semiconductors

Series:: -

Package/Case:: 48-TFSOP (0.240", 6.10mm Width)

Packaging:: Tube

Product Status:: Obsolete

Programmable:: Not Verified

PLL:: Yes

Main Purpose:: Memory, DDR, SDRAM

Input:: SSTL-2

Output:: SSTL-2

Number of Circuits:: 1

Ratio - Input:Output:: 1:10

Differential - Input:Output:: Yes/Yes

Frequency - Max:: 190MHz

Voltage - Supply:: 2.3V ~ 2.7V

Operating Temperature:: 0°C ~ 70°C

Mounting Type:: Surface Mount

Grade:: -

Qualification:: -

Supplier Device Package:: 48-TSSOP

PCKV857DGG,512 FAQ

1.How can I place an order for PCKV857DGG,512 through Aetrix?

Please submit a Request for Quotation (RFQ) for PCKV857DGG,512 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PCKV857DGG,512 reliable?

The price and inventory of PCKV857DGG,512 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PCKV857DGG,512 is usually 5 days.

3.What payment methods are accepted for PCKV857DGG,512?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PCKV857DGG,512 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PCKV857DGG,512?

PCKV857DGG,512 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PCKV857DGG,512 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PCKV857DGG,512?

For technical support, including PCKV857DGG,512 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PCKV857DGG,512 requirements.

6.How does Aetrix verify that PCKV857DGG,512 is sourced from the original manufacturer or authorized distributors?

All PCKV857DGG,512 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PCKV857DGG,512 meets industry standards.

7.What is the process for return or replacement of PCKV857DGG,512?

All PCKV857DGG,512 units undergo pre-shipment inspection (PSI). If there is an issue with PCKV857DGG,512, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PCKV857DGG,512 part is unused and in its original packaging.

Return procedure for PCKV857DGG,512:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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