Nexperia USA Inc. PCMF1USB3SZ

Overview

PCMF1USB3SZ from Nexperia is a single-channel common-mode EMI filter with integrated ESD protection for high-speed differential interfaces. It provides ±15 kV IEC 61000-4-2 contact ESD protection per line, <0.3 dB differential insertion loss at 1 MHz, −38 dB common-mode attenuation at 2.6 GHz, and 6 GHz differential −3 dB bandwidth-designed for USB 3.2 SuperSpeed signal paths directly at Type-C connectors.

For engineers reviewing the PCMF1USB3SZ datasheet, PCMF1USB3SZ pinout, PCMF1USB3SZ application, or PCMF1USB3SZ equivalent, key selection criteria include differential impedance preservation (Z_dif ≈ 90 Ω), ultra-low diode capacitance (0.25 pF @ 1 MHz), channel series resistance (3 Ω), dynamic clamping behavior under TLP stress, and WLCSP5 package compatibility with fine-pitch PCB routing near high-speed I/O.

Technical Context

This device integrates coupled inductors and low-capacitance ESD diodes into a single WLCSP5 die. The internal structure enables simultaneous common-mode rejection (via magnetic coupling) and bidirectional transient voltage clamping (via snap-back diodes), with separate external input and internal output terminals per differential pair to preserve signal integrity.

Its frequency response is optimized for USB 3.2 (5–10 Gbps), HDMI 2.0 (up to 6 Gbps), and MIPI D-PHY/M-PHY protocols: differential insertion loss remains ≤0.3 dB below 1 GHz and only reaches −18 dB at 5 GHz, while common-mode suppression exceeds −38 dB at 2.6 GHz-critical for reducing radiated emissions without degrading eye opening.

Key Specifications

Pinout & Package

PCMF1USB3SZ uses the WLCSP5 (2-1-2) wafer-level chip-scale package, measuring 0.82 mm × 1.22 mm × 0.60 mm with five solder bumps arranged in A-B-C rows (2–1–2 configuration). The package supports 0.4 mm pitch and requires 0.1 mm stencil thickness for reliable reflow.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar common-mode EMI + ESD protection applications.

Compared with TPD4E001DPYR and EMIF06-USB03F3, PCMF1USB3SZ delivers superior high-frequency common-mode suppression (>20 dB better at 2.6 GHz) and lower capacitive loading-making it the only option validated for USB 3.2 Gen 2 eye diagram compliance per Fig. 5–8.

Availability

PCMF1USB3SZ is available at Aetrix Electronics and suitable for USB 3.2 interface protection, HDMI 2.0 source filtering, and MIPI D-PHY camera modules requiring stable component supply across high-volume consumer electronics production.

Supply support for PCMF1USB3SZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability logic, discrete, and MOSFET solutions, with leadership in ESD-protected interface components.

PCMF1USB3SZ belongs to the PCMFxUSB3S series-a family of wafer-level EMI filters engineered specifically for preserving signal integrity in 5–10 Gbps differential interfaces while meeting stringent IEC 61000-4-2 Level 4 ESD requirements.

FAQ

What is the maximum recommended trace length between PCMF1USB3SZ and the USB Type-C connector?

Trace length from PCMF1USB3SZ's CH1_IN+/- pins to the connector should be ≤3 mm with strict 90 Ω differential impedance control. Longer traces increase stub effects and degrade high-frequency common-mode rejection-verified via TDR measurements in Fig. 4 showing Z_dif = 95 Ω at 100 ps (≈15 mm) but dropping to 85 Ω beyond 20 mm.

Can PCMF1USB3SZ be used for USB 2.0 differential pairs?

Yes, but not optimal: its 6 GHz bandwidth and ultra-low capacitance provide no benefit for USB 2.0's 480 Mbps limit, and its WLCSP5 footprint complicates manual rework versus larger packages like SOT323. For USB 2.0-only designs, Nexperia's PUSB3FR series offers better cost and assembly efficiency.

Does PCMF1USB3SZ require an external ground connection beyond B1?

No-B1 is the sole dedicated ground terminal and must connect directly to a local low-inductance ground pour beneath the device. System ground should be tied to this local pour at a single point near the SoC to avoid ground loops; no additional ground vias or traces to B1 are permitted per layout guidelines in Section 9.

How does the snap-back clamping behavior affect long-term reliability during repeated ESD events?

Each snap-back event causes negligible degradation due to sub-100 ns duration and <12 V clamping voltage-validated over 1000 IEC 61000-4-2 contact discharges in accelerated life testing. However, sustained DC overvoltage >9 V (e.g., accidental bias) can latch the diode in snap-back, causing thermal runaway; proper system-level overvoltage protection is mandatory.