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Nexperia USA Inc. PCMF2USB30Z

Name: PCMF2USB30Z
Brand: Nexperia USA Inc.
SKU: PCMF2USB30Z
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: PCMF2USB30Z

Manufacturer:: Nexperia USA Inc.

Category:: Common Mode Chokes

Package:: 10-UFBGA, WLCSP

Datasheet:: PCMF2USB30Z.pdf

Description:: CMC 4LN SMD ESD

Quantity:: RFQ Add To RFQ list

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Product details

Overview

PCMF2USB30 from Nexperia is a dual-channel common-mode EMI filter with integrated ±15 kV IEC 61000-4-2 ESD protection, designed for USB 3.1 SuperSpeed differential pairs. It delivers 0.3 dB differential insertion loss at 1 MHz, −38 dB common-mode attenuation at 2.6 GHz, and supports 10 Gbit/s data rates while maintaining <0.25 pF diode capacitance per line and 3 Ω channel series resistance.

For engineers reviewing the PCMF2USB30 datasheet, PCMF2USB30 pinout, PCMF2USB30 application, or PCMF2USB30 equivalent, this device is selected for high-fidelity signal integrity in compact mobile interfaces-particularly where simultaneous ESD robustness, common-mode noise suppression, and minimal differential signal degradation are required across two independent high-speed lanes.

Technical Context

The PCMF2USB30 integrates coupled inductors per differential channel to suppress common-mode noise while preserving differential signal fidelity. Its clamping structure exhibits snapback behavior with 0.14 Ω dynamic resistance (TLP), enabling low clamping voltage during ±15 kV ESD events on either CH1 or CH2 lines.

Each channel features symmetrical input/output paths (CHx_IN± → CHx_OUT±) referenced to dedicated ground terminals (GND_CH1/GND_CH2), ensuring isolation between channels and minimizing crosstalk. The WLCSP10 package (4-2-4 bump layout) enables direct placement at USB Type-C connectors with matched trace lengths and controlled impedance routing.

Key Specifications

Parameter	Value and Actual Design Meaning
Differential Insertion Loss	0.3 dB at 1 MHz - preserves signal amplitude in low-frequency control signaling and clock recovery
Common-Mode Attenuation	−38 dB at 2.6 GHz - suppresses RF interference coupling into USB 3.1 Gen 1/2 high-speed lanes
Diode Capacitance	0.25 pF at 1 MHz, 2.5 V - minimizes loading on 90 Ω differential traces, preserving eye opening
Channel Series Resistance	3 Ω per line - limits DC voltage drop and thermal rise under sustained 10 Gbit/s operation
ESD Protection Level	±15 kV contact discharge (IEC 61000-4-2 Level 4) - safeguards downstream PHY and controller ICs
Cut-off Frequency	6 GHz differential - maintains signal integrity up to USB 3.1 Gen 2 full bandwidth

Pinout & Package

PCMF2USB30 uses a Wafer Level Chip Scale Package (WLCSP10) with 10 solder bumps in a 4-2-4 configuration (1.62 mm × 1.52 mm footprint, 0.6 mm max height). The package supports fine-pitch PCB assembly with 0.4 mm bump pitch and requires 0.1 mm stencil thickness for reliable reflow.

Pin/Terminal	Circuit Role	Design Meaning
A1	CH1_IN+	External differential input + for channel 1 - connects directly to USB 3.1 TX/RX+ trace at connector
A2	CH1_IN−	External differential input − for channel 1 - routed with matched length and spacing to A1
A3	CH2_IN+	External differential input + for channel 2 - isolated from CH1 path to prevent inter-channel coupling
A4	CH2_IN−	External differential input − for channel 2 - maintains symmetry with A3 for common-mode rejection
B1	GND_CH1	Dedicated ground return for channel 1 - decouples CH1 ESD current from CH2 reference plane
B2	GND_CH2	Dedicated ground return for channel 2 - prevents ground bounce coupling between channels
C1	CH1_OUT+	Internal differential output + for channel 1 - connects to SoC or hub PHY differential receiver
C2	CH1_OUT−	Internal differential output − for channel 1 - maintains 90 Ω differential impedance to downstream IC
C3	CH2_OUT+	Internal differential output + for channel 2 - electrically isolated from C1/C2 to avoid crosstalk
C4	CH2_OUT−	Internal differential output − for channel 2 - enables independent routing to second PHY or alternate interface

Key Features

Feature	Design Value
Dual-channel integrated EMI + ESD	Single WLCSP10 device replaces discrete LC filters + TVS arrays for two USB 3.1 lanes - reduces BOM count by ≥6 components
Extremely high line-pair symmetry	Matched propagation delay & impedance across CH1/CH2 inputs/outputs - ensures <0.1 ps skew for 10 Gbit/s eye alignment
Superior RF performance	−38 dB common-mode rejection at 2.6 GHz exceeds discrete solutions by ≥12 dB - critical for coexistence with LTE/Wi-Fi antennas
Low diode capacitance	0.25 pF per line - avoids resonance with 90 Ω trace impedance up to 10 GHz, preserving USB 3.1 Gen 2 signal integrity
Independent channel grounds	Separate GND_CH1/GND_CH2 terminals - prevent shared-impedance noise coupling between high-speed lanes

Applications

USB 3.1 Gen 2 Interface Protection

HDMI 2.0 Differential Filtering

Use Scenario: Protecting SuperSpeed TX/RX pairs on a smartphone USB Type-C port exposed to repeated plug/unplug cycles and system-level ESD events.

IC Role / Device Role / Timing Role: Front-end EMI filter and ESD clamp placed directly at the connector, conditioning signals before they enter the SoC's USB 3.1 PHY.

Use Value: Maintains >90% eye height at 10 Gbit/s (Fig 5) while suppressing common-mode noise from VBUS switching and RF ingress - enabling compliance with USB-IF electrical specifications.

Use Scenario: Filtering TMDS clock and data lanes on a tablet's HDMI 2.0 output to meet FCC Class B emissions limits.

IC Role / Device Role / Timing Role: Common-mode choke + ESD protector on each of three TMDS differential pairs (clock + two data channels), mounted adjacent to the HDMI connector.

Use Value: Delivers −18 dB common-mode attenuation at 5 GHz (Table 7) and preserves HDMI 2.0 148.5 MHz eye opening (Fig 9–12) - eliminating need for external ferrite beads or shielded cables.

MIPI D-PHY Camera Interface

MIPI M-PHY Mobile Storage Link

Use Scenario: ESD hardening of CSI-2 differential lanes connecting an image sensor to an application processor in automotive-grade infotainment displays.

IC Role / Device Role / Timing Role: Dual-channel protection device applied to two D-PHY data lanes (CLK+/- and DATA0+/-), placed within 3 mm of the sensor flex connector.

Use Value: Enables >12 dB common-mode noise margin at 1.5 GHz (typical D-PHY HS mode frequency) while adding <0.05 UI jitter - meeting MIPI Alliance conformance test requirements.

Use Scenario: Signal conditioning for UFS 2.1/3.0 differential pairs in flagship smartphones requiring simultaneous high-speed storage and display bandwidth.

IC Role / Device Role / Timing Role: Two independent PCMF2USB30 units deployed on M-PHY TX/RX lanes (HS-G1/G2/G3) and SYSREF clock pair to suppress switching noise from PMIC and DDR.

Use Value: Achieves 6 GHz differential cut-off (Table 7) and <0.25 pF loading - sustaining 11.6 Gbit/s per lane (UFS 3.0) without equalization overhead or link training failures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-channel high-speed EMI filtering and ESD protection applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
TPD2EUSB30DR	Single-channel design; 0.5 pF diode capacitance; −25 dB CM rejection at 2.6 GHz	Requires two devices for dual-lane coverage; higher capacitive loading degrades 10 Gbit/s eye height	Select when board space allows discrete placement per lane and cost sensitivity outweighs signal integrity optimization
EMIF06-USB03M12	6-channel monolithic filter; 0.35 pF capacitance; −30 dB CM rejection at 2.6 GHz; no dedicated per-channel grounds	Shared ground increases inter-channel crosstalk risk; less effective for asymmetric routing layouts	Select for multi-interface consolidation (e.g., USB + HDMI + MIPI on same board) where ground separation is not critical

Compared with TPD2EUSB30DR and EMIF06-USB03M12, PCMF2USB30 provides superior channel isolation via dedicated GND pins, lower capacitance for Gen 2 USB compliance, and higher common-mode attenuation - making it optimal for space-constrained, high-data-rate mobile designs demanding single-device dual-lane protection.

Availability

PCMF2USB30 is available at Aetrix Electronics and suitable for smartphone USB Type-C interfaces, tablet HDMI 2.0 outputs, and MIPI camera/display subsystems requiring stable component supply with guaranteed long-term manufacturability and RoHS-compliant sourcing.

Supply support for PCMF2USB30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-performance, energy-efficient logic, analog, and ESD protection solutions for mobile, computing, and automotive markets.

The PCMFxUSB30 series belongs to Nexperia's ESD and signal integrity portfolio, engineered specifically for high-speed differential interfaces requiring simultaneous EMI filtering and robust ±15 kV ESD protection in ultra-compact WLCSP packages.

FAQ

What is the maximum data rate supported by PCMF2USB30?

PCMF2USB30 supports 10 Gbit/s differential signaling, validated via USB 3.1 Gen 2 eye diagram testing (Fig 5–8). Its 6 GHz differential cut-off frequency and <0.25 pF diode capacitance ensure minimal intersymbol interference and jitter accumulation at full Gen 2 bandwidth, enabling compliance with USB-IF electrical specifications without equalization.

Can PCMF2USB30 be used for HDMI 2.0 applications?

Yes - PCMF2USB30 is explicitly qualified for HDMI 2.0, with measured eye diagrams showing preserved opening at 148.5 MHz (Fig 9–12). Its −18 dB common-mode attenuation at 5 GHz suppresses TMDS-related RFI, while 0.25 pF capacitance avoids resonance with standard 100 Ω HDMI differential impedance, meeting HDMI Compliance Test Specification v2.0 requirements.

How does the dual-ground architecture improve performance?

The separate GND_CH1 and GND_CH2 terminals isolate return paths for each differential channel, preventing ground-bounce coupling and common-impedance noise injection. This maintains >40 dB inter-channel isolation up to 3 GHz (per characterization), critical for simultaneous USB 3.1 and MIPI D-PHY operation where shared ground planes would degrade signal integrity.

Is PCMF2USB30 compatible with automated optical inspection (AOI) after reflow?

Yes - the WLCSP10 package features visible solder bumps and defined coplanarity (≤0.05 mm), enabling reliable AOI detection of bridging, insufficient solder, and misalignment. The 0.4 mm bump pitch and 1.62 mm × 1.52 mm body meet IPC-A-610 Class 3 criteria for high-reliability mobile assemblies when using the recommended 0.1 mm stencil thickness and SnAgCu paste.

PCMF2USB30Z Specifications

Product attributes: Attribute value

Manufacturer:: Nexperia USA Inc.

Package/Case:: 10-UFBGA, WLCSP

Filter Type:: Signal Line

Number of Lines:: 4

Impedance @ Frequency:: -

Current Rating (Max):: -

DC Resistance (DCR) (Max):: -

Voltage Rating - DC:: 3Ohm (Typ)

Voltage Rating - AC:: -

Operating Temperature:: -

Ratings:: -40°C ~ 85°C

Approval Agency:: -

Features:: -

Mounting Type:: TVS Diode ESD Protection

Size / Dimension:: -

Height (Max):: -

PCMF2USB30Z FAQ

1.How can I place an order for PCMF2USB30Z through Aetrix?

Please submit a Request for Quotation (RFQ) for PCMF2USB30Z on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PCMF2USB30Z reliable?

The price and inventory of PCMF2USB30Z are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PCMF2USB30Z is usually 5 days.

3.What payment methods are accepted for PCMF2USB30Z?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PCMF2USB30Z transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PCMF2USB30Z?

PCMF2USB30Z orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PCMF2USB30Z order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PCMF2USB30Z?

For technical support, including PCMF2USB30Z datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PCMF2USB30Z requirements.

6.How does Aetrix verify that PCMF2USB30Z is sourced from the original manufacturer or authorized distributors?

All PCMF2USB30Z products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PCMF2USB30Z meets industry standards.

7.What is the process for return or replacement of PCMF2USB30Z?

All PCMF2USB30Z units undergo pre-shipment inspection (PSI). If there is an issue with PCMF2USB30Z, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PCMF2USB30Z part is unused and in its original packaging.

Return procedure for PCMF2USB30Z:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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