Nexperia USA Inc. PCMF2USB3BA/CZ

Overview

PCMF2USB3BA/C from Nexperia is a dual-channel common-mode EMI filter with integrated bidirectional ESD protection for high-speed differential interfaces. It supports USB3.2 (10 Gbps), HDMI2.1 (12 Gbps FRL), and MIPI D-PHY/CSI-2, featuring 2.2 Ω channel series resistance, 0.3 pF diode capacitance per line, ±15 kV IEC 61000-4-2 contact ESD rating, and >10 GHz differential -3 dB bandwidth. It is deployed at USB Type-C connectors to suppress common-mode noise while preserving signal integrity.

For engineers reviewing the PCMF2USB3BA/C datasheet, PCMF2USB3BA/C pinout, PCMF2USB3BA/C application, or PCMF2USB3BA/C equivalent, key selection criteria include differential insertion loss ≤−1 dB up to 10 GHz, common-mode attenuation >30 dB at 1 GHz, symmetric TDR impedance matching (85–105 Ω), ultra-low crosstalk (<−40 dB), and WLCSP10 footprint compatibility with high-density mobile PCB layouts.

Technical Context

This device integrates coupled inductors per differential pair to provide common-mode rejection without degrading differential signal fidelity. Each channel uses snap-back clamping diodes with 0.29 Ω dynamic resistance (TLP, ±100 ns) to clamp ESD transients to <8 V while maintaining sub-2.2 Ω DC path resistance.

The WLCSP10 package implements four external input pins (CH1_IN±, CH2_IN±), two isolated ground terminals (GND_CH1, GND_CH2), and four internal output pins (CH1_OUT±, CH2_OUT±), enabling independent grounding per channel to minimize inter-channel coupling and improve EMI suppression across 100 MHz–3 GHz.

Key Specifications

Pinout & Package

PCMF2USB3BA/C is housed in a 1.62 mm × 1.52 mm WLCSP10 package (4-2-4 bump configuration) with 0.4 mm pitch, optimized for ultra-thin mobile PCBs and automated placement. The package features solder bumps on underside only; no exposed leads or wire bonds.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-channel differential ESD+EMI filtering applications.

Compared with TPD2EUSB30DR and IP4283CZ10, PCMF2USB3BA/C uniquely combines dual-channel integration, 0.3 pF capacitance, and monolithic common-mode filtering in a 1.6 mm footprint-enabling single-device 10 Gbps interface protection without layout compromises.

Availability

PCMF2USB3BA/C is available at Aetrix Electronics and suitable for smartphone, tablet, and AR/VR headset designs requiring stable component supply for high-volume USB3.2, HDMI2.1, and MIPI D-PHY interfaces.

Supply support for PCMF2USB3BA/C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-performance, reliable standard products including ESD protection, logic, discretes, and MOSFETs for mobile, computing, and automotive markets.

The PCMFxUSB3BA/C series was developed specifically for ultra-compact, high-speed differential interface protection in space-constrained portable electronics-balancing ESD robustness, RF performance, and manufacturability in WLCSP.

FAQ

What is the maximum data rate supported by PCMF2USB3BA/C?

PCMF2USB3BA/C supports differential signaling up to 10 Gbps, validated via USB3.2 Gen 2 (10 Gbps) and HDMI2.1 FRL (12 Gbps) eye diagram testing. Its ≥10 GHz differential −3 dB bandwidth and <0.3 pF capacitance ensure minimal intersymbol interference and jitter accumulation at these rates.

Can PCMF2USB3BA/C be used for MIPI M-PHY applications?

Yes - PCMF2USB3BA/C is qualified for MIPI M-PHY v4.1 HS-Gear3 (5.8 Gbps) and D-PHY v2.5 (2.5 Gbps) due to its low capacitance (0.3 pF), symmetric TDR response (85–105 Ω), and <−40 dB crosstalk. It is deployed in camera and display modules where ESD immunity and signal fidelity are critical.

How does the dual-ground architecture improve performance?

The separate GND_CH1 and GND_CH2 terminals prevent ground-loop coupling between channels, reducing inter-channel crosstalk by >15 dB and improving common-mode rejection above 500 MHz. This architecture is essential for simultaneous USB3.2 and DisplayPort Alt Mode operation on shared Type-C connectors.

Is reflow soldering compatible with the WLCSP10 package?

Yes - PCMF2USB3BA/C is qualified for lead-free reflow per J-STD-020 (MSL3). Recommended stencil thickness is 0.1 mm, with solder paste deposit dimensions of 0.40 mm × 1.40 mm per bump. The WLCSP10 footprint matches IPC-7351B LCC-10W standards for automated assembly yield >99.95%.