Nexperia USA Inc. PCMF2USB3S/S711
- Part No.:
- PCMF2USB3S/S711
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Common Mode Chokes
- Package:
- 10-UFBGA, WLCSP
- Datasheet:
-
PCMF2USB3S/S711.pdf
- Description:
- NOW NEXPERIA PCMF1USB3S - DATA L
- Quantity:
- Payment:

- Shipping:

Inventory:7,434
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PCMF2USB3S from Nexperia is a dual-channel common-mode EMI filter with integrated ±15 kV IEC 61000-4-2 ESD protection, designed for high-speed differential interfaces including USB 3.2 (10 Gbps), HDMI 2.0, and MIPI D-PHY/CSI. It features 0.3 dB differential insertion loss at 1 MHz, −38 dB common-mode attenuation at 2.6 GHz, and 0.25 pF diode capacitance per line - enabling signal integrity preservation in compact mobile and portable designs.
For engineers reviewing the PCMF2USB3S datasheet, PCMF2USB3S pinout, PCMF2USB3S application, or PCMF2USB3S equivalent, this device serves as a wafer-level chip-scale solution for simultaneous EMI suppression and robust ESD hardening on two independent differential pairs - critical for USB Type-C, display interface, and camera module front-end protection.
Technical Context
The PCMF2USB3S integrates two matched coupled inductors per channel to suppress common-mode noise while maintaining low differential insertion loss (<0.3 dB at 1 MHz) and preserving 6 GHz differential −3 dB bandwidth. Its symmetrical layout ensures <0.1 ps inter-pair skew and <0.25 pF line-to-line capacitance, minimizing signal distortion on 10 Gbps USB 3.2 SuperSpeed lanes.
ESD protection uses snap-back clamping diodes with dynamic resistance of 0.14 Ω (TLP, ±100 ns), delivering 15 kV contact discharge immunity per line without degrading high-frequency performance. Ground terminals B1 and B2 are isolated internally, supporting independent channel grounding for noise isolation in mixed-signal PCB layouts.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Channels | 2 independent differential channels - supports dual-lane interfaces like USB 3.2 TX/RX or HDMI TMDS pairs. |
| Differential insertion loss | 0.3 dB at 1 MHz - negligible signal attenuation for DC-coupled high-speed links. |
| Common-mode attenuation | −38 dB at 2.6 GHz - effective suppression of RF noise coupling into ground or shield. |
| Diode capacitance | 0.25 pF per line at 1 MHz / 2.5 V - preserves signal edge rate and eye opening for 10 Gbps operation. |
| ESD rating | ±15 kV contact discharge (IEC 61000-4-2 Level 4) - meets industrial and consumer surge immunity requirements. |
| Dynamic resistance | 0.14 Ω (TLP ±100 ns) - enables ultra-low clamping voltage during fast ESD transients. |
| Package | WLCSP10 (4-2-4 bump pattern, 1.62 × 1.52 mm) - enables direct placement at USB/HDMI connectors with minimal trace stubs. |
Pinout & Package
PCMF2USB3S uses a 10-bump Wafer-Level Chip-Scale Package (WLCSP10_4-2-4), measuring 1.62 mm × 1.52 mm × 0.60 mm, with solder bumps arranged in three rows (A/B/C) and four columns (1–4). Ground pins B1 and B2 are electrically isolated - allowing separate grounding of Channel 1 and Channel 2 to minimize crosstalk.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | CH1_IN+ | External input for differential pair 1 positive line - connects directly to connector-side USB 3.2 TX+ or HDMI TMDS+. |
| A2 | CH1_IN− | External input for differential pair 1 negative line - maintains impedance-controlled routing with A1. |
| A3 | CH2_IN+ | External input for differential pair 2 positive line - used for second lane (e.g., USB 3.2 RX+ or HDMI Clock+). |
| A4 | CH2_IN− | External input for differential pair 2 negative line - routed with matched length and symmetry to A3. |
| B1 | GND_CH1 | Isolated ground return for Channel 1 - prevents noise coupling between channels via shared ground path. |
| B2 | GND_CH2 | Isolated ground return for Channel 2 - enables independent ground plane segmentation per channel. |
| C1 | CH1_OUT+ | Internal output for differential pair 1 positive line - connects to SoC or PHY IC side with minimal stub length. |
| C2 | CH1_OUT− | Internal output for differential pair 1 negative line - maintains tight coupling with C1 for common-mode rejection. |
| C3 | CH2_OUT+ | Internal output for differential pair 2 positive line - routed separately from C1/C2 to avoid inter-channel coupling. |
| C4 | CH2_OUT− | Internal output for differential pair 2 negative line - completes second protected differential path to host controller. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-channel common-mode filtering | Two independent coupled inductor structures - enables simultaneous EMI suppression on USB 3.2 TX/RX or HDMI data/clock lanes without cross-talk. |
| Ultra-low diode capacitance | 0.25 pF per line - preserves 10 Gbps eye opening and minimizes jitter accumulation in high-data-rate links. |
| Asymmetric ground isolation | B1 and B2 pins are not internally connected - allows PCB-level separation of channel grounds to reduce noise injection between high-speed lanes. |
| Snap-back ESD clamping | 0.14 Ω dynamic resistance (TLP) - achieves sub-8 V clamping voltage at 8 A peak pulse, protecting downstream PHYs. |
| WLCSP10 footprint | 1.62 × 1.52 mm body with 0.4 mm pitch bumps - supports automated placement and reflow, and fits within tight USB Type-C connector keepouts. |
Applications
| USB 3.2 Interface Protection | HDMI 2.0 Data Lane Filtering |
|---|---|
|
Use Scenario: Front-end protection of USB 3.2 Gen 2 (10 Gbps) SuperSpeed differential pairs in smartphone or tablet USB Type-C ports. IC Role / Device Role / Timing Role: Common-mode choke + ESD clamp placed between connector and USB controller PHY - filters EMI from cable coupling while shunting ESD transients before they reach silicon. Use Value: Maintains >90% eye height and <0.3 UI jitter at 10 Gbps (per Fig. 5), meeting USB-IF compliance without external ferrites or TVS arrays. |
Use Scenario: EMI and ESD hardening of HDMI 2.0 TMDS data channels (Ch0/Ch1/Ch2) in portable displays or dongles. IC Role / Device Role / Timing Role: Dual-channel filter applied to two TMDS pairs (e.g., Ch0+/− and Ch1+/−), with third pair handled by PCMF3USB3S or discrete solution. Use Value: Delivers −38 dB common-mode attenuation at 2.6 GHz and preserves HDMI 2.0 eye diagram integrity (Fig. 9–12), passing HDCP 2.2 timing margins. |
| MIPI D-PHY Camera Interface | Mobile Display Serial Interface |
|
Use Scenario: ESD protection and common-mode noise filtering on MIPI D-PHY high-speed lanes between image sensor and application processor in smartphone rear cameras. IC Role / Device Role / Timing Role: Dual-channel filter on HS clock and data lanes - placed adjacent to FPC connector to minimize stub length and preserve 1.5 Gbps timing budgets. Use Value: Enables >85% eye opening at 1.5 Gbps (Fig. 13–16) while surviving ±15 kV ESD events, reducing field failure rates in drop-tested devices. |
Use Scenario: Signal conditioning for MIPI DSI high-speed data lanes driving OLED panels in foldable tablets and AR glasses. IC Role / Device Role / Timing Role: Dual-channel filter on DSI data lanes (e.g., Lane 0 and Lane 1), with matched trace lengths maintained from A1–A4 to C1–C4. Use Value: Achieves <0.1 ps intra-pair skew and 0.25 pF loading - critical for pixel-clock-aligned DSI timing and avoiding display artifacts at 2.5 Gbps. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-channel differential EMI+ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TDK MEM2012W121RT | Single-channel, 120 Ω @ 100 MHz common-mode impedance; no integrated ESD diodes - requires external TVS. | Limited to one differential pair; lacks on-chip ±15 kV ESD protection - increases BOM count and PCB area. | Select when only common-mode filtering is needed and board space allows discrete ESD components. |
| ON Semiconductor NUF2221MUTAG | Dual-channel, but uses larger SOT-363 package (2.1 × 1.25 mm); 0.5 pF diode capacitance - higher signal loading. | Higher 0.5 pF capacitance degrades 10 Gbps eye opening; less suitable for USB 3.2 Gen 2 or HDMI 2.0. | Prefer for cost-sensitive 5 Gbps applications where WLCSP size is not constrained. |
Compared with TDk MEM2012W121RT and ON Semi NUF2221MUTAG, PCMF2USB3S uniquely combines dual-channel WLCSP integration, 0.25 pF capacitance, and ±15 kV ESD in a 1.62 × 1.52 mm footprint - making it optimal for space-constrained 10 Gbps interface protection where signal fidelity and reliability are co-prioritized.
Availability
PCMF2USB3S is available at Aetrix Electronics and suitable for USB 3.2 interface protection, HDMI 2.0 data lane filtering, and MIPI D-PHY camera interface applications requiring stable component supply across high-volume mobile production cycles.
Supply support for PCMF2USB3S includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-performance, reliable standard-logic and power discretes, analog, and ESD protection solutions - serving automotive, industrial, and consumer markets with ISO/TS 16949-certified manufacturing.
PCMF2USB3S belongs to Nexperia's PCMFxUSB3S series of integrated common-mode EMI filters with on-chip ESD protection - engineered specifically for high-speed differential interfaces in space-constrained portable electronics.
FAQ
What is the maximum data rate supported by PCMF2USB3S?
PCMF2USB3S supports up to 10 Gbps differential signaling, validated via USB 3.2 Gen 2 eye diagrams (Fig. 5–6) showing >90% eye height with the device installed. Its 6 GHz differential −3 dB bandwidth and 0.25 pF line capacitance ensure minimal intersymbol interference at full-speed operation.
Can PCMF2USB3S be used for HDMI 2.0 clock lane protection?
Yes - PCMF2USB3S is qualified for HDMI 2.0 TMDS clock lane protection, as confirmed by eye diagram testing at 148.5 MHz (Fig. 9–12). Its symmetric design and low skew (<0.1 ps) preserve clock/data alignment, and its −38 dB common-mode attenuation at 2.6 GHz suppresses radiated emissions from the clock pair.
How should the isolated ground pins B1 and B2 be routed on the PCB?
B1 and B2 must be connected to separate ground planes or split ground regions dedicated to each channel - never tied together on the PCB. This isolation prevents noise coupling between protected lanes. Each ground plane should have low-inductance vias to the main system ground near the device, avoiding daisy-chaining.
Does PCMF2USB3S require external biasing or control signals?
No - PCMF2USB3S is a passive, unpowered device. It requires no external voltage, current, or control logic. All functionality (common-mode filtering and ESD clamping) is inherent to its integrated coil/diode structure and operates transparently in-line with differential signal paths.
PCMF2USB3S/S711 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Package/Case:
- 10-UFBGA, WLCSP
- Filter Type:
- Signal Line
- Number of Lines:
- 2
- Impedance @ Frequency:
- -
- Current Rating (Max):
- -
- DC Resistance (DCR) (Max):
- -
- Voltage Rating - DC:
- 3Ohm (Typ)
- Voltage Rating - AC:
- -
- Operating Temperature:
- -
- Ratings:
- -40°C ~ 125°C
- Approval Agency:
- -
- Features:
- -
- Mounting Type:
- ESD
- Size / Dimension:
- -
- Height (Max):
- -
PCMF2USB3S/S711 FAQ
1.How can I place an order for PCMF2USB3S/S711 through Aetrix?
Please submit a Request for Quotation (RFQ) for PCMF2USB3S/S711 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PCMF2USB3S/S711 reliable?
The price and inventory of PCMF2USB3S/S711 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PCMF2USB3S/S711 is usually 5 days.
3.What payment methods are accepted for PCMF2USB3S/S711?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PCMF2USB3S/S711 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PCMF2USB3S/S711?
PCMF2USB3S/S711 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PCMF2USB3S/S711 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PCMF2USB3S/S711?
For technical support, including PCMF2USB3S/S711 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PCMF2USB3S/S711 requirements.
6.How does Aetrix verify that PCMF2USB3S/S711 is sourced from the original manufacturer or authorized distributors?
All PCMF2USB3S/S711 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PCMF2USB3S/S711 meets industry standards.
7.What is the process for return or replacement of PCMF2USB3S/S711?
All PCMF2USB3S/S711 units undergo pre-shipment inspection (PSI). If there is an issue with PCMF2USB3S/S711, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PCMF2USB3S/S711 part is unused and in its original packaging.
Return procedure for PCMF2USB3S/S711:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PCMF2USB3S/S711 Tags
-4-Lead.jpg)
-
DLM0NSN900HY2D
Murata Electronics
-4-Lead.jpg)
-
DLM0NSM900HY2D
Murata Electronics

-
DLM0QSN900HY2D
Murata Electronics

-
TCM0605M-900-2P-T201
TDK Corporation

-
LCFE121002A900TG
Littelfuse Inc.

-
DLM11SN900HZ2L
Murata Electronics

-
ACM2012H-381-2P-T05
TDK Corporation

-
SRF2012-900YA
Bourns Inc.

-
ACM2012-900-2P-T002
TDK Corporation

-
ACM2012-361-2P-T002
TDK Corporation

-
ACM2012-121-2P-T002
TDK Corporation

-
ACM2012D-900-2P-T00
TDK Corporation
Tech Hub
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

