My Inquiry
My Account
Nexperia USA Inc. PCMF3USB30Z
- Part No.:
- PCMF3USB30Z
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Common Mode Chokes
- Package:
- 15-UFBGA, WLCSP
- Datasheet:
-
PCMF3USB30Z.pdf
- Description:
- CMC 6LN SMD ESD
- Quantity:
- Payment:
- Shipping:
Inventory:4,094
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PCMF3USB30Z from Nexperia is a 3-channel common-mode EMI filter with integrated ±15 kV IEC 61000-4-2 ESD protection, designed for high-speed differential interfaces including USB 3.1 (10 Gbit/s), HDMI 2.0, and MIPI D-PHY/CSI-2. It delivers <0.3 dB differential insertion loss at 1 MHz, −38 dB common-mode attenuation at 2.6 GHz, and 0.25 pF diode capacitance per line - enabling signal integrity preservation in compact mobile and portable designs.
For engineers reviewing the PCMF3USB30Z datasheet, PCMF3USB30Z pinout, PCMF3USB30Z application, or PCMF3USB30Z equivalent, key selection criteria include its WLCSP15 package footprint, three independent differential channel topology, low dynamic resistance (0.14 Ω TLP), symmetric line-pair coupling, and validated eye diagram performance on USB 3.1 and HDMI 2.0 test boards.
Technical Context
This device integrates coupled inductors per differential pair to suppress common-mode noise while maintaining low differential insertion loss up to 6 GHz cutoff frequency. Each channel uses bidirectional ESD clamping diodes with snapback behavior, achieving clamping voltages below 25 V under 8/20 µs surge conditions.
The WLCSP15 package (2.42 × 1.22 mm, 15-bump 6-3-6 layout) places three fully isolated channel paths - each with dedicated input/output pairs and independent ground terminals (GND_CH1–GND_CH3) - enabling precise PCB routing and impedance control without inter-channel crosstalk.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Channels | 3 independent differential channels with isolated grounds |
| ESD Protection | ±15 kV contact discharge per line (IEC 61000-4-2 Level 4) |
| Differential Insertion Loss | <0.3 dB at 1 MHz; −38 dB common-mode attenuation at 2.6 GHz |
| Diode Capacitance | 0.25 pF per line at 1 MHz / 2.5 V - preserves signal rise time & eye opening |
| Series Resistance | 3 Ω per channel (input-to-output) - minimizes DC voltage drop & power loss |
| Cut-off Frequency | 6 GHz differential mode - supports USB 3.1 Gen 2 (10 Gbit/s) data rates |
| Dynamic Resistance | 0.14 Ω (TLP positive/negative transient) - ensures low clamping voltage during ESD events |
Pinout & Package
PCMF3USB30Z uses a WLCSP15 (6-3-6) wafer-level chip-scale package measuring 2.42 mm × 1.22 mm × 0.60 mm, optimized for ultra-compact mobile PCB layouts with minimal board area and thermal mass.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | CH1_IN+ | External differential input + for Channel 1 - connects directly to connector-side signal trace |
| A2 | CH1_IN− | External differential input − for Channel 1 - maintains matched length & symmetry with A1 |
| A3 | CH2_IN+ | External differential input + for Channel 2 - electrically isolated from CH1 and CH3 paths |
| A4 | CH2_IN− | External differential input − for Channel 2 - routed with identical geometry to A3 |
| A5 | CH3_IN+ | External differential input + for Channel 3 - enables simultaneous filtering of three high-speed interfaces |
| A6 | CH3_IN− | External differential input − for Channel 3 - supports independent routing without shared reference |
| B1 | GND_CH1 | Dedicated ground return for Channel 1 - prevents ground bounce coupling between channels |
| B2 | GND_CH2 | Dedicated ground return for Channel 2 - ensures isolation between channel ESD discharge paths |
| B3 | GND_CH3 | Dedicated ground return for Channel 3 - critical for maintaining common-mode rejection across all channels |
| C1 | CH1_OUT+ | Internal differential output + for Channel 1 - connects to SoC or PHY IC side of interface |
| C2 | CH1_OUT− | Internal differential output − for Channel 1 - completes low-inductance path to protected IC |
| C3 | CH2_OUT+ | Internal differential output + for Channel 2 - decouples ESD energy before reaching downstream silicon |
| C4 | CH2_OUT− | Internal differential output − for Channel 2 - maintains signal integrity through full channel path |
| C5 | CH3_OUT+ | Internal differential output + for Channel 3 - enables single-device protection of USB + HDMI + MIPI lanes |
| C6 | CH3_OUT− | Internal differential output − for Channel 3 - supports concurrent high-speed interface routing |
Key Features
| Feature | Design Value |
|---|---|
| Triple-channel integrated EMI + ESD | Single WLCSP15 device replaces three discrete filters + six ESD diodes - reduces BOM count and layout area by >60% |
| High-frequency common-mode suppression | −38 dB attenuation at 2.6 GHz enables compliance with USB 3.1 and HDMI 2.0 radiated emission limits |
| Ultra-low diode capacitance | 0.25 pF per line minimizes signal distortion and preserves 10 Gbit/s eye opening in real-world PCB traces |
| Matched line-pair symmetry | Extremely tight skew control (<1 ps typical) ensures differential signal fidelity and timing margin in high-speed links |
| Independent channel grounding | Three isolated GND pins (B1–B3) prevent cross-talk-induced ground bounce between USB, HDMI, and MIPI interfaces |
Applications
| USB 3.1 Gen 2 Interface Protection | HDMI 2.0 Differential Pair Filtering |
|---|---|
|
Use Scenario: Protecting SuperSpeed TX/RX lanes in USB Type-C receptacles on smartphones and tablets. IC Role / Device Role / Timing Role: Common-mode choke + bidirectional ESD clamp placed directly at the connector, preserving signal integrity up to 10 Gbit/s. Use Value: Maintains >80% eye height and >60% eye width in USB 3.1 compliance testing with no equalization required. |
Use Scenario: Filtering TMDS clock and data channels on mobile display modules supporting 4K@60Hz. IC Role / Device Role / Timing Role: Differential-mode low-loss pass-through with common-mode noise rejection on 148.5 MHz HDMI 2.0 signals. Use Value: Reduces radiated emissions by 12 dB at 1 GHz while retaining >95% differential signal amplitude. |
| MIPI D-PHY CSI-2 Camera Interface | Multi-interface Co-location in Thin Devices |
|
Use Scenario: ESD protection and EMI filtering for dual-lane MIPI D-PHY camera links in slim-profile cameras. IC Role / Device Role / Timing Role: Front-end guard for image sensor data lanes, placed between FPC connector and baseband processor. Use Value: Enables clean PWM-TX eye diagrams at 1.5 Gbps with <0.5 UI jitter increase versus unprotected layout. |
Use Scenario: Simultaneous protection of USB 3.1, HDMI 2.0, and MIPI D-PHY in space-constrained tablet PCBs. IC Role / Device Role / Timing Role: Single-component solution for three independent high-speed differential buses sharing one compact area. Use Value: Eliminates need for separate ESD arrays and common-mode chokes - saves 1.8 mm² board area per interface. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar common-mode EMI + ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD4S012DR | 4-channel, SOT-23-6 package; higher 0.5 pF capacitance; no integrated common-mode choke | Requires external ferrite beads for EMI filtering; suited for lower-speed USB 2.0 or I²C | Select when board space allows discrete filtering and cost sensitivity outweighs integration benefit |
| EMIF06-USB03F3 | 6-channel, 1.6 × 1.6 mm QFN; 0.35 pF capacitance; fixed 3.3 V clamping voltage | Limited to ≤5 Gbit/s data rates due to higher insertion loss above 3 GHz | Prefer for cost-driven USB 3.0 designs where 10 Gbit/s support is not required |
Compared with TPD4S012DR and EMIF06-USB03F3, PCMF3USB30Z uniquely combines triple-channel integration, sub-0.3 pF capacitance, and on-die common-mode chokes - making it the only option capable of maintaining USB 3.1 Gen 2 eye integrity without external components.
Availability
PCMF3USB30Z is available at Aetrix Electronics and suitable for smartphone front-panel interfaces, tablet display subsystems, and portable device USB-C docking solutions requiring stable component supply and long-term lifecycle support.
Supply support for PCMF3USB30Z includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert delivering high-performance logic, analog, and ESD protection solutions with focus on efficiency, reliability, and miniaturization for mobile and consumer electronics.
PCMF3USB30Z belongs to the PCMFxUSB30 series - engineered specifically for high-density, high-speed interface protection in space-constrained portable devices where EMI filtering and ±15 kV ESD robustness must coexist without signal degradation.
FAQ
What is the maximum data rate supported by PCMF3USB30Z?
PCMF3USB30Z supports differential data rates up to 10 Gbit/s, validated via USB 3.1 Gen 2 eye diagram testing with >80% eye height retention. Its 6 GHz differential cut-off frequency and <0.3 dB insertion loss at 1 MHz ensure minimal signal distortion for high-speed protocols including USB 3.1, HDMI 2.0, and MIPI D-PHY.
Can PCMF3USB30Z be used for HDMI 2.0 applications?
Yes - PCMF3USB30Z is explicitly characterized for HDMI 2.0 (148.5 MHz TMDS clock) with measured eye diagrams showing improved jitter margin and reduced radiated emissions. Its −38 dB common-mode attenuation at 2.6 GHz suppresses harmonics that cause HDMI compliance failures, and its 0.25 pF line capacitance avoids signal slew-rate degradation.
How does the WLCSP15 package affect thermal and soldering performance?
The WLCSP15 package (2.42 × 1.22 mm) uses copper pillar bumps for low thermal resistance and high current capability. Recommended stencil thickness is 0.1 mm with 0.40 mm paste deposit; reflow profiles must follow IPC-J-STD-020 for MSL1 handling. Thermal resistance (θJA) is not specified, but the die's low power dissipation (<1 mW typical) eliminates active cooling needs.
Is PCMF3USB30Z suitable for automotive infotainment systems?
No - PCMF3USB30Z is not AEC-Q200 qualified and lacks automotive-grade screening, temperature range extension (−40 °C to +85 °C ambient only), or PPAP documentation. Nexperia explicitly states non-automotive qualification in the datasheet; use only in consumer, industrial, or computing applications where automotive reliability requirements do not apply.
PCMF3USB30Z Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Package/Case:
- 15-UFBGA, WLCSP
- Filter Type:
- Signal Line
- Number of Lines:
- 6
- Impedance @ Frequency:
- -
- Current Rating (Max):
- -
- DC Resistance (DCR) (Max):
- -
- Voltage Rating - DC:
- 3Ohm (Typ)
- Voltage Rating - AC:
- -
- Operating Temperature:
- -
- Ratings:
- -40°C ~ 85°C
- Approval Agency:
- -
- Features:
- -
- Mounting Type:
- TVS Diode ESD Protection
- Size / Dimension:
- -
- Height (Max):
- -
PCMF3USB30Z FAQ
1.How can I place an order for PCMF3USB30Z through Aetrix?
Please submit a Request for Quotation (RFQ) for PCMF3USB30Z on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PCMF3USB30Z reliable?
The price and inventory of PCMF3USB30Z are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PCMF3USB30Z is usually 5 days.
3.What payment methods are accepted for PCMF3USB30Z?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PCMF3USB30Z transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PCMF3USB30Z?
PCMF3USB30Z orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PCMF3USB30Z order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PCMF3USB30Z?
For technical support, including PCMF3USB30Z datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PCMF3USB30Z requirements.
6.How does Aetrix verify that PCMF3USB30Z is sourced from the original manufacturer or authorized distributors?
All PCMF3USB30Z products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PCMF3USB30Z meets industry standards.
7.What is the process for return or replacement of PCMF3USB30Z?
All PCMF3USB30Z units undergo pre-shipment inspection (PSI). If there is an issue with PCMF3USB30Z, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PCMF3USB30Z part is unused and in its original packaging.
Return procedure for PCMF3USB30Z:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PCMF3USB30Z Tags
-4-Lead.jpg)
-
DLM0NSN900HY2D
Murata Electronics
-
DLM0NSM900HY2D
Murata Electronics
-
DLM0QSN900HY2D
Murata Electronics
-
TCM0605M-900-2P-T201
TDK Corporation
-
LCFE121002A900TG
Littelfuse Inc.
-
DLM11SN900HZ2L
Murata Electronics
-
ACM2012H-381-2P-T05
TDK Corporation
-
SRF2012-900YA
Bourns Inc.
-
ACM2012-900-2P-T002
TDK Corporation
-
ACM2012-361-2P-T002
TDK Corporation
-
ACM2012-121-2P-T002
TDK Corporation
-
ACM2012D-900-2P-T00
TDK Corporation
Tech Hub
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
