Nexperia USA Inc. PCMF3USB3BA/CZ

Overview

PCMF3USB3BA/C from Nexperia is a 3-channel common-mode EMI filter with integrated bidirectional ESD protection for high-speed differential interfaces, featuring ±15 kV IEC 61000-4-2 contact discharge rating, 2.2 Ω typical channel series resistance, 0.3 pF diode capacitance at 1 MHz, 10 GHz differential f_-3dB, and WLCSP15 (6-3-6) package - deployed in USB3.2 Gen2 and HDMI 2.1 FRL signal paths to suppress common-mode noise while preserving signal integrity.

For engineers reviewing the PCMF3USB3BA/C datasheet, PCMF3USB3BA/C pinout, PCMF3USB3BA/C application, or PCMF3USB3BA/C equivalent, key selection criteria include differential insertion loss < −1 dB up to 10 GHz, common-mode attenuation > −30 dB from 100 MHz to 6 GHz, symmetrical line-pair impedance matching (< 0.5 Ω imbalance), and compatibility with 50 Ω/100 Ω differential PCB routing for SuperSpeed USB and TMDS interfaces.

Technical Context

This device integrates three independent differential channels, each with magnetically coupled coils for common-mode rejection and low-capacitance silicon diodes for bidirectional ESD clamping. Its architecture enables simultaneous suppression of RF interference above 100 MHz and transient protection without degrading 10 Gbps USB3.2 or 12 Gbps HDMI 2.1 FRL eye diagrams.

The WLCSP15 package implements six input bumps (A1–A6), three ground bumps (B1–B3), and six output bumps (C1–C6), with all ground bumps internally unconnected per datasheet Figure 22 and Table 2 - requiring external PCB grounding via dedicated thermal pads or adjacent vias to maintain ≤ 0.29 Ω dynamic resistance during ±8/20 μs surges.

Key Specifications

Pinout & Package

PCMF3USB3BA/C uses a WLCSP15 (6-3-6) wafer-level chip-scale package measuring 2.42 mm × 1.22 mm × 0.64 mm max, with 15 solder bumps arranged in three rows (A/B/C) and no internal connection on B1–B3 ground bumps - requiring external PCB grounding through adjacent thermal vias or copper pour.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar common-mode EMI + ESD protection applications.

Compared with TPD4S012DR and EMIF06-USB03F3, PCMF3USB3BA/C delivers superior high-frequency fidelity (10 GHz vs ≤6 GHz), lower parasitic capacitance (0.3 pF vs ≥0.5 pF), and ultra-compact WLCSP15 packaging - making it the only option qualified for 10+ Gbps differential interfaces with board-edge ESD robustness.

Availability

PCMF3USB3BA/C is available at Aetrix Electronics and suitable for USB3.2 Gen2 docking stations, HDMI 2.1 source devices, and MIPI D-PHY camera modules requiring stable component supply across automotive infotainment, industrial HMI, and premium consumer electronics programs.

Supply support for PCMF3USB3BA/C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential efficiency technologies, delivering high-performance logic, analog, and ESD protection solutions for mobile, computing, and automotive markets.

PCMF3USB3BA/C belongs to Nexperia's high-speed interface protection product line, engineered specifically to meet the signal integrity and ESD immunity demands of next-generation USB, HDMI, and MIPI serial interfaces.

FAQ

Is PCMF3USB3BA/C compatible with USB-C reversible connectors?

Yes - its symmetric 3-channel architecture supports full SuperSpeed lane mapping (TX1+/−, RX1+/−, TX2+/−) required for USB-C Alternate Mode operation. The WLCSP15 layout allows placement directly adjacent to the USB-C receptacle with matched-length routing to both plug orientations, maintaining < 0.1 mm intra-pair skew as verified in Nexperia's application note AN11624.

What is the maximum recommended trace length between PCMF3USB3BA/C and the protected IC?

For USB3.2 Gen2 (10 Gbps), the maximum recommended post-filter trace length is 8 mm from C1/C2 to the SoC PHY differential inputs. This limit ensures < 0.05 UI jitter accumulation and preserves the −1 dB insertion loss margin up to 10 GHz, as confirmed by time-domain reflectometry (Fig. 4) and eye diagram validation (Fig. 5).

How should the unconnected B1–B3 bumps be handled on the PCB?

B1–B3 bumps have no internal connection per datasheet Figure 22 and Table 2. They must be externally grounded using ≥3 thermal vias per bump connected to a solid ground plane - not left floating or tied only to signal ground. This external grounding provides low-inductance return paths for common-mode currents and stabilizes ESD clamping performance during ±15 kV events.

Does PCMF3USB3BA/C require external bias or control signals?

No - PCMF3USB3BA/C is a passive, fully integrated solution with no enable pins, voltage rails, or configuration interfaces. It operates transparently in-circuit: differential signals pass through the coupled inductors with minimal loss, while ESD transients trigger snap-back diode conduction without external triggering or power dependency, as characterized in Figures 13–18.