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Nexperia USA Inc. PCMF3USB3B/CZ
- Part No.:
- PCMF3USB3B/CZ
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Common Mode Chokes
- Package:
- 15-UFBGA, WLCSP
- Datasheet:
-
PCMF3USB3B/CZ.pdf
- Description:
- CMC 6LN SMD ESD
- Quantity:
- Payment:
- Shipping:
Inventory:1,027
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Product details
Overview
PCMF3USB3B/C from Nexperia is a 3-channel common-mode EMI filter with integrated bidirectional ESD protection for high-speed differential interfaces, featuring ±20 kV IEC 61000-4-2 contact discharge rating, <2.6 Ω channel series resistance, 0.3 pF diode capacitance at 1 MHz, 8.1 GHz differential -3 dB bandwidth, and WLCSP15 (6-3-6) package - deployed in USB 3.2 Gen 2 and HDMI 2.0 front-end protection.
For engineers reviewing the PCMF3USB3B/C datasheet, PCMF3USB3B/C pinout, PCMF3USB3B/C application, or PCMF3USB3B/C equivalent, this device serves as a compact, symmetric, low-capacitance ESD/EMI co-filter for SuperSpeed differential pairs requiring minimal signal degradation and robust system-level immunity.
Technical Context
The PCMF3USB3B/C integrates three independent differential channels, each with magnetically coupled coils for common-mode rejection and paired ESD clamping diodes per line. Its architecture delivers simultaneous high-frequency differential signal integrity and sub-2 V clamping voltage during ±20 kV ESD transients.
It operates across -40 °C to +125 °C ambient, supports DC input voltages from -4 V to +4 V, and maintains <0.22 Ω dynamic resistance under TLP stress - enabling reliable protection without compromising USB 3.2 10 Gbps or HDMI 2.0 6 Gbps eye diagram performance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Channels | 3 independent differential channels - enables full protection of USB 3.2 TX/RX and SS RX/TX pairs plus auxiliary differential lines in single-package layout. |
| ESD Rating | ±20 kV contact discharge (IEC 61000-4-2 Level 4) - protects downstream PHYs and controllers from human-body-model ESD events at connector interface. |
| Differential Bandwidth | 8.1 GHz f-3dB - preserves signal integrity up to USB 3.2 Gen 2 (10 Gbps) and HDMI 2.0 (6 Gbps) data rates with minimal insertion loss. |
| Diode Capacitance | 0.3 pF at 1 MHz / 2.5 V - ensures negligible loading on high-speed differential traces, avoiding timing skew or impedance mismatch. |
| Channel Series Resistance | ≤2.6 Ω per line (input to output) - limits DC voltage drop and power dissipation in always-on high-speed data paths. |
| Dynamic Resistance | 0.22 Ω (TLP, 100 ns) - achieves low clamping voltage during fast ESD pulses, reducing stress on protected ICs. |
| Package | WLCSP15 (6-3-6 bump pattern, 2.42 × 1.22 mm) - wafer-level chip-scale footprint minimizes PCB area and parasitic inductance at RF frequencies. |
Pinout & Package
PCMF3USB3B/C uses a 15-bump Wafer-Level Chip-Scale Package (WLCSP15_6-3-6) with 0.4 mm pitch, 0.25 mm solder land, and 0.1 mm recommended stencil thickness. The package is lead-free, RoHS-compliant, and optimized for automated placement and reflow.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | CH1_IN+ | External differential input positive for Channel 1 - connects directly to USB/HDMI connector side of first differential pair. |
| A2 | CH1_IN- | External differential input negative for Channel 1 - maintains strict symmetry with A1 for balanced EMI suppression. |
| A3 | CH2_IN+ | External differential input positive for Channel 2 - routes second high-speed pair (e.g., USB 3.2 RX) to internal filtering network. |
| A4 | CH2_IN- | External differential input negative for Channel 2 - matched length and impedance to A3 for crosstalk control. |
| A5 | CH3_IN+ | External differential input positive for Channel 3 - supports third differential lane (e.g., DisplayPort AUX or MIPI D-PHY clock). |
| A6 | CH3_IN- | External differential input negative for Channel 3 - completes triple-channel protection without shared ground coupling. |
| B1 | GND_CH1 | Isolated ground return for Channel 1 - prevents noise coupling between channels via dedicated ground path. |
| B2 | GND_CH2 | Isolated ground return for Channel 2 - maintains channel independence and avoids common-impedance interference. |
| B3 | GND_CH3 | Isolated ground return for Channel 3 - enables clean separation of ESD current paths per channel during multi-pulse events. |
| C1 | CH1_OUT+ | Internal differential output positive for Channel 1 - connects to SoC or controller-side trace with minimal stub length. |
| C2 | CH1_OUT- | Internal differential output negative for Channel 1 - preserves differential balance and controlled impedance to protected IC. |
| C3 | CH2_OUT+ | Internal differential output positive for Channel 2 - routed separately from C1/C2 to avoid inter-channel crosstalk. |
| C4 | CH2_OUT- | Internal differential output negative for Channel 2 - maintains >40 dB isolation from adjacent channels per datasheet Fig. 3. |
| C5 | CH3_OUT+ | Internal differential output positive for Channel 3 - supports high-density routing in mobile PCB stackups with tight layer constraints. |
| C6 | CH3_OUT- | Internal differential output negative for Channel 3 - completes low-inductance return path for all three protected lanes. |
Key Features
| Feature | Design Value |
|---|---|
| Triple-channel common-mode suppression | ≥40 dB attenuation from 100 MHz to 3 GHz - reduces radiated emissions from USB/HDMI cables meeting CISPR 32 Class B limits. |
| Sub-0.3 pF line-to-line capacitance | 0.3 pF at 1 MHz - eliminates measurable eye closure in 10 Gbps USB 3.2 compliance testing (Fig. 5 vs Fig. 6). |
| Matched differential pair symmetry | ≤0.2 ps inter-line skew - ensures <0.1% duty-cycle distortion in high-speed serial links, critical for HDMI 2.0 TMDS timing. |
| Integrated ESD+EMI co-design | Singular WLCSP15 solution replacing discrete LC filters + TVS arrays - reduces BOM count by ≥5 components and saves ≥1.5 mm² PCB area. |
| Robust snap-back clamping | Negative dynamic resistance behavior - lowers clamping voltage under fast ESD pulses, limiting transient stress on downstream PHYs to <8 V. |
Applications
| USB 3.2 Gen 2 Interface Protection | HDMI 2.0 Source Port Filtering |
|---|---|
|
Use Scenario: Protecting SuperSpeed TX/RX differential pairs at the USB Type-C receptacle on a laptop motherboard. IC Role / Device Role / Timing Role: Front-end ESD/EMI filter placed between connector and USB 3.2 controller PHY, preserving 10 Gbps signal integrity while shunting ESD energy to local grounds. Use Value: Enables direct placement at connector with ≤1 mm trace length, achieving >95% eye opening retention (Fig. 5) and passing IEC 61000-4-2 Level 4 testing. |
Use Scenario: Filtering TMDS clock and data lanes on an HDMI 2.0 source port in a set-top box. IC Role / Device Role / Timing Role: Common-mode choke + ESD clamp per differential lane, maintaining 100 Ω differential impedance and minimizing jitter accumulation. Use Value: Delivers <0.3 UI jitter increase at 6 Gbps (Fig. 9–12), supporting 4K@60Hz video transmission without pixel errors or link training failures. |
| MIPI D-PHY Camera Interface | Mobile Display Serial Interface |
|
Use Scenario: ESD protection for CSI-2 differential lanes connecting image sensor to application processor in smartphone camera module. IC Role / Device Role / Timing Role: Low-capacitance filter on high-speed clock and data pairs, preventing ESD-induced sensor reset or frame corruption. Use Value: 0.3 pF capacitance avoids violating MIPI D-PHY v2.5 AC timing specs (tskew, tsetup), ensuring reliable 2.5 Gbps lane operation. |
Use Scenario: Protecting DSI differential lanes driving OLED display in ultra-thin tablet PC. IC Role / Device Role / Timing Role: Triple-channel co-filter for DSI clock, data lane 0, and data lane 1 - placed within 3 mm of display connector. Use Value: Maintains <15 mVpp common-mode noise on DSI lines (per Fig. 2), eliminating display flicker and color banding in high-brightness modes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar differential-channel ESD/EMI filtering applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD4S012RTER | 4-channel, 1.2 pF diode capacitance, 500 MHz common-mode cutoff - higher capacitance limits use to USB 2.0/MIPI D-PHY ≤1.5 Gbps. | Targeted at lower-speed interfaces; lacks USB 3.2/HDMI 2.0 validation data. | Select when cost sensitivity outweighs 10 Gbps support and board space allows larger 2.5 mm × 1.0 mm QFN. |
| EMIF06-USB03F2 | 6-channel, 0.6 pF capacitance, 3.5 GHz common-mode suppression - wider channel count but higher insertion loss above 3 GHz. | Optimized for USB 2.0 + USB 3.0 combo ports; not validated for HDMI 2.0 6 Gbps eye compliance. | Prefer for dual-mode USB Type-C designs needing Hi-Speed + SuperSpeed protection in one device. |
Compared with TPD4S012RTER and EMIF06-USB03F2, PCMF3USB3B/C offers superior high-frequency performance (8.1 GHz bandwidth, 0.3 pF), verified 10 Gbps eye integrity, and channel-isolated grounds - making it the only choice for space-constrained, Gen 2–compliant USB/HDMI front ends.
Availability
PCMF3USB3B/C is available at Aetrix Electronics and suitable for USB 3.2 Gen 2 host interfaces, HDMI 2.0 source ports, and MIPI D-PHY camera modules requiring stable component supply across automotive infotainment, industrial HMIs, and premium consumer electronics programs.
Supply support for PCMF3USB3B/C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on essential efficiency technologies, delivering high-performance, reliable, and scalable components for analog, logic, discrete, and MOSFET applications.
PCMF3USB3B/C belongs to Nexperia's ESD & Signal Integrity portfolio, engineered specifically for high-speed differential interface protection where EMI filtering and ±20 kV ESD robustness must coexist without signal degradation.
FAQ
What is the maximum data rate supported by PCMF3USB3B/C?
PCMF3USB3B/C supports differential data rates up to 10 Gbps, as validated by USB 3.2 Gen 2 eye diagram testing (Fig. 5–8) showing >95% eye opening retention with 8.1 GHz differential bandwidth and <0.3 pF line capacitance - sufficient for full compliance with USB-IF SuperSpeed certification requirements.
Can PCMF3USB3B/C be used for HDMI 2.0 applications?
Yes - Nexperia provides explicit HDMI 2.0 validation data (Fig. 9–12) demonstrating 1080p/6 Gbps eye integrity with <15 mVpp common-mode noise suppression. Its 0.3 pF capacitance and 8.1 GHz bandwidth meet HDMI 2.0 TMDS AC timing and jitter specifications when placed within 3 mm of the source connector.
How does the isolated ground structure improve ESD performance?
Each channel has its own dedicated ground terminal (B1/B2/B3), preventing ESD current from one channel from coupling into others. This isolation ensures that a ±20 kV event on CH1 does not elevate ground potential for CH2/CH3, maintaining >40 dB inter-channel crosstalk suppression (Fig. 3) and protecting multiple high-speed interfaces simultaneously.
Is PCMF3USB3B/C compatible with standard WLCSP reflow profiles?
Yes - the device is qualified for IPC/JEDEC J-STD-020 moisture sensitivity level 1 and supports standard Pb-free reflow profiles (peak 260 °C, 30 s max). Its WLCSP15 package uses 0.25 mm solder lands and 0.1 mm stencil thickness (Fig. 25), matching industry-standard assembly processes for fine-pitch wafer-level packages.
PCMF3USB3B/CZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Package/Case:
- 15-UFBGA, WLCSP
- Filter Type:
- Signal Line
- Number of Lines:
- 6
- Impedance @ Frequency:
- -
- Current Rating (Max):
- -
- DC Resistance (DCR) (Max):
- -
- Voltage Rating - DC:
- 3Ohm (Typ)
- Voltage Rating - AC:
- -
- Operating Temperature:
- -
- Ratings:
- -40°C ~ 85°C
- Approval Agency:
- -
- Features:
- -
- Mounting Type:
- TVS Diode ESD Protection
- Size / Dimension:
- -
- Height (Max):
- -
PCMF3USB3B/CZ FAQ
1.How can I place an order for PCMF3USB3B/CZ through Aetrix?
Please submit a Request for Quotation (RFQ) for PCMF3USB3B/CZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PCMF3USB3B/CZ reliable?
The price and inventory of PCMF3USB3B/CZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PCMF3USB3B/CZ is usually 5 days.
3.What payment methods are accepted for PCMF3USB3B/CZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PCMF3USB3B/CZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PCMF3USB3B/CZ?
PCMF3USB3B/CZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PCMF3USB3B/CZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PCMF3USB3B/CZ?
For technical support, including PCMF3USB3B/CZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PCMF3USB3B/CZ requirements.
6.How does Aetrix verify that PCMF3USB3B/CZ is sourced from the original manufacturer or authorized distributors?
All PCMF3USB3B/CZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PCMF3USB3B/CZ meets industry standards.
7.What is the process for return or replacement of PCMF3USB3B/CZ?
All PCMF3USB3B/CZ units undergo pre-shipment inspection (PSI). If there is an issue with PCMF3USB3B/CZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PCMF3USB3B/CZ part is unused and in its original packaging.
Return procedure for PCMF3USB3B/CZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PCMF3USB3B/CZ Tags
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