Nexperia USA Inc. PCMF3USB3S/CZ

Overview

PCMF3USB3S from Nexperia is a 3-channel common-mode EMI filter with integrated ±15 kV IEC 61000-4-2 ESD protection for high-speed differential interfaces. It provides <−38 dB common-mode attenuation at 2.6 GHz, <−18 dB differential insertion loss at 5 GHz, and 0.25 pF diode capacitance per line - enabling clean signal integrity in USB 3.2 Gen 2 (10 Gbps), HDMI 2.0, and MIPI D-PHY/CSI-2 applications.

For engineers reviewing the PCMF3USB3S datasheet, PCMF3USB3S pinout, PCMF3USB3S application, or PCMF3USB3S equivalent, key selection criteria include channel count matching, WLCSP15 footprint compatibility, differential impedance preservation (Z_dif ≈ 95–105 Ω), and ESD clamping performance under 8/20 µs surge conditions.

Technical Context

The device integrates three independent differential channels, each with magnetically coupled coils for common-mode rejection and bidirectional ESD diodes with snap-back clamping behavior. Its TLP-measured dynamic resistance is 0.14 Ω (positive/negative transient) and 0.22 Ω (IEC 61000-4-5 surge), ensuring low clamping voltage during ESD events.

Frequency response is optimized for high-speed serial links: common-mode suppression exceeds −12 dB at 800 MHz and −38 dB at 2.6 GHz, while differential insertion loss remains ≤0.3 dB up to 1 MHz and ≤−18 dB at 5 GHz - preserving eye opening in 10 Gbps USB 3.2 and 148.5 MHz HDMI 2.0 signals.

Key Specifications

Pinout & Package

PCMF3USB3S uses the WLCSP15 (6-3-6) wafer-level chip-scale package: 2.42 mm × 1.22 mm × 0.60 mm body, 15 solder bumps arranged in 3 rows (A/B/C), with 0.4 mm pitch and 0.25 mm bump diameter. Solder land size is 0.25 mm × 0.25 mm; recommended stencil thickness is 0.1 mm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 3-channel differential EMI/ESD filtering applications.

Compared with TDk MEM2012W15R0 and ON Semi NUF4302MUTAG, PCMF3USB3S uniquely combines 3-channel common-mode rejection, ±15 kV ESD clamping, and sub-0.3 pF capacitance in one WLCSP15 package - eliminating discrete component trade-offs in space-constrained 10 Gbps designs.

Availability

PCMF3USB3S is available at Aetrix Electronics and suitable for USB 3.2 Gen 2, HDMI 2.0, and MIPI D-PHY applications requiring stable component supply, high-volume production readiness, and long-term lifecycle support.

Supply support for PCMF3USB3S includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential efficiency technologies, delivering high-performance logic, analog, and ESD protection solutions for mobile, computing, and automotive markets.

PCMF3USB3S belongs to the PCMFxUSB3S series - engineered specifically for high-speed differential interfaces demanding co-located EMI filtering and IEC 61000-4-2 Level 4 ESD protection in ultra-compact WLCSP packages.

FAQ

What is the maximum data rate supported by PCMF3USB3S?

PCMF3USB3S supports 10 Gbps differential signaling, validated via USB 3.2 Gen 2 eye diagrams (Fig. 5–6) showing >75% eye height and >0.3 UI opening with the device installed. Its −18 dB insertion loss at 5 GHz and 0.25 pF diode capacitance ensure minimal intersymbol interference up to 10 Gbps, meeting USB-IF compliance requirements for Gen 2 receivers.

Can PCMF3USB3S be used for HDMI 2.0 applications?

Yes - PCMF3USB3S is explicitly qualified for HDMI 2.0, with test data (Fig. 9–12) confirming preserved eye opening at 148.5 MHz TMDS clock rates. Its −38 dB common-mode attenuation at 2.6 GHz suppresses harmonic emissions, while low differential loss (<0.3 dB at 1 MHz) and 95–105 Ω differential impedance match maintain signal fidelity across all three TMDS channels.

How does the snap-back clamping mechanism improve ESD protection?

The snap-back structure delivers negative dynamic resistance during ESD transients, reducing clamping voltage to <8 V at 5 A (Fig. 17–18). This prevents overvoltage stress on 1.2 V/1.8 V PHY I/Os, unlike conventional diodes that clamp at >12 V. The effect is validated under IEC 61000-4-2 Level 4 (±15 kV contact), with no functional failure observed in 1000-pulse testing.

What PCB layout guidelines are critical for optimal performance?

Maintain strict 50 Ω differential impedance on all IN/OUT traces, minimize stub length (<0.5 mm) between bumps and vias, and isolate GND_CH1/CH2/CH3 with separate thermal reliefs. Avoid routing beneath the WLCSP15 body; place device within 3 mm of the connector. Use the exact solder footprint in Fig. 29 (P = 0.80 mm, SL = 0.25 mm) to prevent tombstoning or voiding.