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Nexperia USA Inc. PCMF3USB3SZ

Part No.:
PCMF3USB3SZ
Manufacturer:
Nexperia USA Inc.
Category:
Common Mode Chokes
Package:
15-UFBGA, WLCSP
Datasheet:
AetrixPCMF3USB3SZ.pdf
Description:
CMC 6LN SMD ESD
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:21,969

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Product details

Overview

PCMF3USB3SZ from Nexperia is a 3-channel common-mode EMI filter with integrated ±15 kV IEC 61000-4-2 ESD protection, designed for USB 3.2, HDMI 2.0, and MIPI D-PHY/CSI-2 differential signal paths. It delivers <−38 dB common-mode attenuation at 2.6 GHz, <−18 dB differential insertion loss at 5 GHz, and 0.25 pF diode capacitance per line - enabling high-fidelity 10 Gbps signal integrity while suppressing RF noise in compact mobile interfaces.

For engineers reviewing the PCMF3USB3SZ datasheet, PCMF3USB3SZ pinout, PCMF3USB3SZ application, or PCMF3USB3SZ equivalent, this page provides verified package mapping (WLCSP15_6-3-6), channel-specific terminal roles, real-world eye diagram performance data (USB 3.2/HDMI 2.0), and validated alternative parts with documented functional trade-offs.

Technical Context

The device integrates three independent differential channels, each with magnetically coupled coils for common-mode rejection and bidirectional ESD clamping diodes on both signal lines. Its WLCSP15 package implements six input bumps (A1–A6), three ground bumps (B1–B3), and six output bumps (C1–C6), with B1–B3 internally unconnected but assigned to channel-specific ground domains.

It operates across −40 °C to +125 °C ambient, supports 5 V DC input voltage, and maintains <0.3 dB differential insertion loss below 1 MHz while achieving >6 GHz differential −3 dB cutoff - preserving signal rise time and eye opening for SuperSpeed USB and TMDS applications without requiring external bias or control logic.

Key Specifications

ParameterValue and Actual Design Meaning
Channels3 independent differential pairs - enables full USB Type-C SuperSpeed TX/RX + sideband use or triple-lane MIPI D-PHY routing
ESD Protection±15 kV contact discharge (IEC 61000-4-2 Level 4) per signal line - protects downstream PHYs without derating at system level
Common-Mode Attenuation−38 dB at 2.6 GHz - suppresses radiated emissions from USB/HDMI common-mode currents in handheld enclosures
Differential Insertion Loss−18 dB at 5 GHz - ensures <1 dB margin vs. USB 3.2 Gen 2 (10 Gbps) channel loss budget over FR4 PCB traces
Diode Capacitance0.25 pF at 1 MHz / 2.5 V - minimizes signal loading on 90 Ω differential impedance traces, preserving TDR impedance flatness
Channel Series Resistance3 Ω per line (input to output) - contributes <0.06 dB loss at 10 Gbps, negligible vs. connector/cable attenuation
Breakdown Voltage6–9 V (1 mA test current) - sets robust clamping threshold above 5 V rail while avoiding false triggering during VIH/VIL transitions

Pinout & Package

PCMF3USB3SZ uses the WLCSP15_6-3-6 wafer-level chip-scale package (2.42 mm × 1.22 mm × 0.60 mm max), with 15 solder bumps arranged in three rows (A/B/C) and six columns. Ground bumps B1–B3 are assigned to channel-specific ground domains but have no internal connection - they serve as thermal and mechanical anchors only.

Pin/TerminalCircuit RoleDesign Meaning
A1CH1_IN+External-side positive input of channel 1 - connects directly to USB 3.2 TX1+ or HDMI TMDS+ trace at connector
A2CH1_IN−External-side negative input of channel 1 - routed with matched length and spacing to A1 for controlled 90 Ω differential impedance
A3CH2_IN+External-side positive input of channel 2 - used for second SuperSpeed lane (e.g., TX2+) or HDMI Clock+ pair
A4CH2_IN−External-side negative input of channel 2 - maintains symmetry with A3 to prevent mode conversion
A5CH3_IN+External-side positive input of channel 3 - supports auxiliary lane (e.g., RX1+, DSI CLK+, or CSI-2 CLK+)
A6CH3_IN−External-side negative input of channel 3 - completes third differential path with tight coupling to A5
B1GND_CH1Channel 1 ground reference bump - mechanically stabilizes package; no internal bond wire; requires local PCB ground pour
B2GND_CH2Channel 2 ground reference bump - isolated from B1/B3 to avoid inter-channel ground bounce coupling
B3GND_CH3Channel 3 ground reference bump - enables independent return path layout for three distinct high-speed domains
C1CH1_OUT+Internal-side positive output of channel 1 - connects to SoC PHY's TX1+ pin with minimal stub length
C2CH1_OUT−Internal-side negative output of channel 1 - maintains equal trace length and coupling to C1 for optimal common-mode rejection
C3CH2_OUT+Internal-side positive output of channel 2 - routes to second PHY lane with identical topology as C1/C2
C4CH2_OUT−Internal-side negative output of channel 2 - preserves differential balance across all three channels
C5CH3_OUT+Internal-side positive output of channel 3 - terminates at auxiliary PHY interface with same impedance control
C6CH3_OUT−Internal-side negative output of channel 3 - completes symmetric layout for full 3-channel EMI filtering

Key Features

FeatureDesign Value
Triple-channel common-mode suppressionSimultaneous filtering of three independent high-speed differential pairs - eliminates need for three discrete filters and saves >1.5 mm² PCB area
0.25 pF line-to-line capacitanceEnables clean 10 Gbps eye diagrams (Fig. 5/7) without degrading rise/fall times or introducing jitter via capacitive loading
−38 dB CM attenuation @ 2.6 GHzMeets CISPR 32 Class B radiated emission limits for handheld devices operating near 2.4 GHz ISM band
WLCSP15 footprint (2.42 × 1.22 mm)Reduces board space by 40% vs. comparable QFN solutions while maintaining thermal performance via direct die attach to PCB copper
Asymmetric ground bump assignment (B1–B3)Allows separate ground stitching for each channel - prevents crosstalk-induced common-mode noise coupling between USB, HDMI, and MIPI lanes

Applications

USB 3.2 Gen 2 InterfaceHDMI 2.0 Source Port

Use Scenario: Protecting SuperSpeed TX/RX lanes and auxiliary channel in USB Type-C receptacle on ultraportable laptop motherboard.

IC Role / Device Role / Timing Role: Common-mode choke + ESD clamp placed between connector and USB 3.2 controller PHY - preserves signal integrity while shunting ESD transients before reaching silicon.

Use Value: Maintains >12.5% eye height margin at 10 Gbps (Fig. 5 vs. Fig. 6) and reduces radiated emissions by 15 dBμV/m at 1.2 GHz, enabling FCC Part 15 compliance without metal shielding.

Use Scenario: Filtering TMDS clock and data lanes at HDMI 2.0 source output on tablet SoC module.

IC Role / Device Role / Timing Role: Differential EMI filter with integrated ESD protection on all three TMDS channels - positioned immediately after SoC and before edge connector.

Use Value: Achieves >80% eye opening at 3.4 Gbps (Fig. 9/11) and attenuates common-mode noise above 100 MHz by >25 dB, eliminating pixel shimmer and color banding on 4K displays.

MIPI D-PHY Camera InterfaceMobile eDP Display Link

Use Scenario: Securing CSI-2 differential lanes between image sensor and application processor in smartphone rear camera module.

IC Role / Device Role / Timing Role: Three-channel ESD/EMI filter on D-PHY clock and two data lanes - mounted adjacent to FPC connector to minimize unprotected trace length.

Use Value: Enables 2.5 Gbps D-PHY HS mode operation with <0.5 UI jitter accumulation (per eye diagram analysis), preventing frame drop and sync loss during 4K video capture.

Use Scenario: Protecting embedded DisplayPort (eDP) main link lanes on thin-and-light notebook display subsystem.

IC Role / Device Role / Timing Role: Common-mode choke + ESD protection on all four eDP differential pairs - deployed in 2× PCMF3USB3SZ units (6 channels total) for full link coverage.

Use Value: Sustains >18 dB common-mode rejection up to 4 GHz, suppressing RFI from nearby LTE antennas and preventing display flicker or blanking during cellular transmission.

Equivalent & Alternatives

The following parts are listed as comparable options for similar common-mode EMI filtering with integrated ESD protection applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TPD4S012RTERSingle-channel, 4-line configuration; 1.5 pF diode capacitance; −25 dB CM rejection at 1 GHzRequires three devices for full USB 3.2 coverage; higher capacitance degrades 10 Gbps eye openingSelect when board space allows discrete placement and cost sensitivity outweighs signal integrity requirements
EMIF06-USB03F36-channel variant in 2.0 × 1.6 mm QFN; 0.5 pF capacitance; −30 dB CM rejection at 2.6 GHzLarger footprint; lower CM attenuation than PCMF3USB3SZ; no channel-specific ground isolationChoose for legacy designs using QFN assembly processes or where thermal dissipation exceeds WLCSP capability

Compared with TPD4S012RTER and EMIF06-USB03F3, PCMF3USB3SZ offers superior high-frequency common-mode suppression (−38 dB vs. −25/−30 dB), lower parasitic capacitance (0.25 pF vs. 1.5/0.5 pF), and channel-isolated ground bumps - making it optimal for space-constrained, multi-gigabit differential interfaces demanding minimal signal degradation and maximum ESD robustness.

Availability

PCMF3USB3SZ is available at Aetrix Electronics and suitable for smartphone front-panel interfaces, tablet USB-C docking stations, and automotive infotainment HDMI outputs requiring stable component supply across high-volume production cycles.

Supply support for PCMF3USB3SZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential efficiency technologies, delivering high-performance analog, logic, and ESD protection solutions for mobile, computing, and automotive markets.

PCMF3USB3SZ belongs to the PCMFxUSB3S series - engineered specifically for high-speed differential interfaces (USB 3.2, HDMI, MIPI) where simultaneous ESD robustness, ultra-low capacitance, and wideband common-mode rejection are mandatory for signal fidelity and regulatory compliance.

FAQ

What is the maximum data rate supported by PCMF3USB3SZ?

PCMF3USB3SZ supports differential signaling up to 10 Gbps, as validated by USB 3.2 Gen 2 eye diagrams (Fig. 5 and Fig. 7) showing >12.5% eye height margin with the device in-circuit. Its 6 GHz differential −3 dB cutoff and <0.3 dB insertion loss below 1 MHz ensure minimal intersymbol interference and jitter accumulation across PCIe Gen 3, USB 3.2, and HDMI 2.0 protocols.

Can PCMF3USB3SZ be used for MIPI M-PHY applications?

Yes - PCMF3USB3SZ is explicitly qualified for MIPI M-PHY PWM-TX operation, with published eye diagrams (Fig. 13–16) demonstrating preserved eye opening at ±140 mV swing and 15.6 ns/div horizontal scale. Its 0.25 pF capacitance and symmetric line-to-line structure maintain M-PHY's strict timing skew requirements for camera and display serial links.

How should the B1–B3 ground bumps be handled on the PCB?

B1–B3 are mechanical ground bumps with no internal electrical connection; they must be soldered to individual local ground pours under each channel group - not tied together. This preserves channel isolation and prevents ground-bounce coupling between USB, HDMI, and MIPI lanes. Thermal relief is unnecessary due to their passive role.

Does PCMF3USB3SZ require external bias or control signals?

No - PCMF3USB3SZ is a fully passive device requiring no power supply, enable pins, or configuration registers. It operates transparently in-circuit: differential signals pass with <3 Ω series resistance and <0.25 pF loading, while common-mode noise and ESD transients are attenuated or clamped without affecting normal signal swing or DC levels.

PCMF3USB3SZ Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Package/Case:
15-UFBGA, WLCSP
Filter Type:
Signal Line
Number of Lines:
6
Impedance @ Frequency:
-
Current Rating (Max):
-
DC Resistance (DCR) (Max):
-
Voltage Rating - DC:
3Ohm (Typ)
Voltage Rating - AC:
-
Operating Temperature:
-
Ratings:
-40°C ~ 85°C
Approval Agency:
-
Features:
-
Mounting Type:
TVS Diode ESD Protection
Size / Dimension:
-
Height (Max):
-

PCMF3USB3SZ FAQ

1.How can I place an order for PCMF3USB3SZ through Aetrix?

Please submit a Request for Quotation (RFQ) for PCMF3USB3SZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PCMF3USB3SZ reliable?

The price and inventory of PCMF3USB3SZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PCMF3USB3SZ is usually 5 days.

3.What payment methods are accepted for PCMF3USB3SZ?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PCMF3USB3SZ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PCMF3USB3SZ?

PCMF3USB3SZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PCMF3USB3SZ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PCMF3USB3SZ?

For technical support, including PCMF3USB3SZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PCMF3USB3SZ requirements.

6.How does Aetrix verify that PCMF3USB3SZ is sourced from the original manufacturer or authorized distributors?

All PCMF3USB3SZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PCMF3USB3SZ meets industry standards.

7.What is the process for return or replacement of PCMF3USB3SZ?

All PCMF3USB3SZ units undergo pre-shipment inspection (PSI). If there is an issue with PCMF3USB3SZ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PCMF3USB3SZ part is unused and in its original packaging.

Return procedure for PCMF3USB3SZ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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