Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > Single FETs, MOSFETs

STMicroelectronics PD55003TR-E

Name: PD55003TR-E
Brand: STMicroelectronics
SKU: PD55003TR-E
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: PD55003TR-E

Manufacturer:: STMicroelectronics

Category:: Single FETs, MOSFETs

Package:: PowerSO-10 Exposed Bottom Pad

Datasheet:: PD55003TR-E.pdf

Description:: RF MOSFET LDMOS 12.5V POWERSO10

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:600

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

PD55003TR-E from STMicroelectronics is a common-source N-channel enhancement-mode lateral MOSFET RF power transistor designed for broadband commercial and industrial amplification up to 1 GHz. It delivers 3 W output power with 17 dB gain at 500 MHz under 12.5 V supply and 50 mA quiescent drain current, featuring excellent thermal stability and linearity optimized for car mobile radio transmitters.

For engineers reviewing the PD55003TR-E datasheet, PD55003TR-E pinout, PD55003TR-E application, or PD55003TR-E equivalent, key selection criteria include its PowerSO-10RF SMD package, 40 V drain-source breakdown voltage, 31.7 W power dissipation at 70°C case temperature, and verified 52% drain efficiency at 3 W output in 500 MHz band.

Technical Context

The PD55003TR-E operates in common-source configuration with gate-controlled lateral conduction, leveraging ST's LDMOS process for high gain and ruggedness. Its static characteristics include 0.75 Ω on-resistance at V_GS = 10 V and 1 A, while dynamic performance is characterized by 36 pF input capacitance (C_iss) and 2.4 pF reverse transfer capacitance (C_rss) at 12.5 V.

Designed for RF power stages in VHF/UHF bands, it supports stable operation across 480–860 MHz with tunable load impedance matching - Z_IN = 1.542 − j3.705 Ω and Z_DL = 6.842 + j6.209 Ω at 500 MHz - and maintains >45% drain efficiency over 1–3 W output range under 12.5 V bias.

Key Specifications

Parameter	Value and Actual Design Meaning
V(BR)DSS	40 V - Ensures safe operation in 12.5 V RF amplifier rails with margin against transient voltage spikes
P_OUT	3 W @ 500 MHz - Delivers sufficient RF output for Class AB mobile radio final stages
G_P	17 dB @ 500 MHz - Enables single-stage amplification without cascaded gain blocks
R_thJC	3.0 °C/W - Supports high-power density mounting in PowerSO-10RF package with minimal thermal derating
C_iss	36 pF @ 12.5 V - Determines input matching network component values for 500 MHz design
η_D	45–52% @ P_OUT = 3 W - Reduces heat sink requirements and improves battery runtime in portable radios
T_J(max)	165 °C - Allows reliable operation under sustained RF drive with proper PCB copper pour

Pinout & Package

PD55003TR-E uses the PowerSO-10RF (formed lead) plastic package - JEDEC-approved, surface-mount RF power package with integrated heatsink pad and optimized RF layout for minimal parasitic inductance.

Pin/Terminal	Circuit Role	Design Meaning
Gate (G)	Control electrode	Accepts DC bias and RF input signal; requires stable 2–5 V gate-source voltage for linear Class AB operation
Source (S)	Common reference node	Connected to RF ground plane; serves as return path for both DC bias and RF current
Drain (D)	Power output terminal	Delivers amplified RF output; mounted directly to thermal pad for efficient heat extraction

Key Features

Feature	Design Value
First JEDEC-approved SMD RF power package	PowerSO-10RF enables automated assembly and eliminates through-hole mounting constraints
Excellent thermal stability	3.0 °C/W junction-to-case resistance maintains gain flatness across temperature drift
High linearity at 3 W output	Enables clean AM/FM modulation in car radio transmitters without spectral regrowth
Optimized for 480–860 MHz band	Validated S-parameters and load-pull data support rapid PA design at UHF frequencies
Moisture sensitivity level 3	Requires standard floor-life handling per J-STD-020B before reflow soldering

Applications

Car Mobile Radio Transmitter

UHF Land Mobile Radio Base Station

Use Scenario: Final RF power stage in 450–470 MHz land mobile two-way radios operating from 13.8 V supply.

IC Role / Device Role / Timing Role: Common-source RF power amplifier delivering 3 W P1dB output with 17 dB small-signal gain.

Use Value: Eliminates need for external driver stage due to high gain; 52% drain efficiency reduces thermal load on compact chassis.

Use Scenario: Linear amplifier module in 860 MHz public safety repeater systems requiring low distortion.

IC Role / Device Role / Timing Role: High-linearity RF power transistor biased in Class AB for AM-compatible transmission.

Use Value: Verified 40 dB input return loss at 860 MHz simplifies matching network design and improves system stability.

VHF Broadcast Auxiliary Link

Industrial Wireless Sensor Hub

Use Scenario: 174–216 MHz TV broadcast auxiliary STL link transmitter operating at 12.5 V.

IC Role / Device Role / Timing Role: Final-stage amplifier driving ceramic bandpass filter and coaxial output stage.

Use Value: 40 V V(BR)DSS provides headroom for voltage doubling in push-pull configurations without breakdown risk.

Use Scenario: Compact 433 MHz ISM-band sensor gateway requiring robust RF output in harsh industrial environments.

IC Role / Device Role / Timing Role: Single-ended RF power device enabling 3 W ERP with integrated thermal management.

Use Value: PowerSO-10RF package allows direct PCB copper pour attachment, reducing thermal interface resistance by >40% vs. SO-8.

Equivalent & Alternatives

The following parts are listed as comparable options for similar RF power amplifier applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MRF300AN	Higher P1dB (10 W), TO-270WB package, 28 V operation	Suitable for higher-power base stations; requires larger heatsink and different bias network	Select when >5 W output or 28 V rail is available; not drop-in compatible
PD57003-E	Same PowerSO-10RF package, 5 W P1dB, 12.5 V operation, improved gain flatness above 600 MHz	Better suited for 700–900 MHz LTE infrastructure; higher cost	Choose for wider bandwidth or higher output where board space permits same footprint

Compared with MRF300AN and PD57003-E, PD55003TR-E offers optimal balance of 3 W output, thermal efficiency, and compact SMD integration for cost-sensitive mobile radio designs below 1 GHz - avoiding overdesign while meeting linearity and reliability targets.

Availability

PD55003TR-E is available at Aetrix Electronics and suitable for car mobile radios, UHF land mobile base stations, VHF broadcast auxiliary links, and industrial wireless sensor hubs requiring stable component supply and JEDEC-compliant RF packaging.

Supply support for PD55003TR-E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader specializing in power management, analog, MEMS, and RF technologies with manufacturing facilities across Europe, Asia, and the Americas.

The PD55003TR-E belongs to ST's LdmoST plastic family of RF power transistors, engineered specifically for high-efficiency, high-linearity amplification in commercial and industrial mobile radio systems operating below 1 GHz.

FAQ

What is the recommended gate bias voltage for linear operation?

The PD55003TR-E achieves optimal linearity and gain flatness with V_GS = 3.5–4.5 V at I_DQ = 50 mA. This range corresponds to the typical gate-source threshold voltage (V_GS(Q) = 2.0–5.0 V) and avoids deep triode-region conduction that degrades intermodulation performance in AM/FM applications.

Can PD55003TR-E be used in push-pull configuration?

Yes - its 40 V V(BR)DSS rating and symmetrical common-source topology support push-pull operation at 12.5 V supply. However, layout must ensure matched gate drive paths and identical source inductance; application note AN1294 specifies microstrip routing guidelines for balanced configurations.

What thermal interface material is recommended for PowerSO-10RF mounting?

A 50–100 µm thickness of thermally conductive epoxy (e.g., Henkel Loctite ECCOBOND® 4820) or solder paste (Sn96.5/Ag3.0/Cu0.5) is recommended between the exposed drain pad and copper thermal plane. Avoid air gaps: thermal resistance increases by >2.5 °C/W per 25 µm void layer.

Is PD55003TR-E compliant with RoHS and REACH?

Yes - PD55003TR-E carries ECOPACK®2 certification, confirming full compliance with EU RoHS Directive 2011/65/EU and REACH Regulation (EC) No. 1907/2006, including restriction of SVHC substances below 0.1% w/w threshold.

PD55003TR-E Specifications

Product attributes: Attribute value

Manufacturer:: STMicroelectronics

Series:: -

Package/Case:: PowerSO-10 Exposed Bottom Pad

Packaging:: Tape & Reel (TR)

Product Status:: Active

Technology:: LDMOS

Configuration:: -

Frequency:: 500MHz

Gain:: 17dB

Voltage - Test:: 12.5 V

Current Rating (Amps):: 2.5A

Noise Figure:: -

Current - Test:: 50 mA

Power - Output:: 3W

Voltage - Rated:: 40 V

Grade:: -

Qualification:: -

Mounting Type:: -

Supplier Device Package:: 10-PowerSO

PD55003TR-E FAQ

1.How can I place an order for PD55003TR-E through Aetrix?

Please submit a Request for Quotation (RFQ) for PD55003TR-E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PD55003TR-E reliable?

The price and inventory of PD55003TR-E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PD55003TR-E is usually 5 days.

3.What payment methods are accepted for PD55003TR-E?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PD55003TR-E transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PD55003TR-E?

PD55003TR-E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PD55003TR-E order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PD55003TR-E?

For technical support, including PD55003TR-E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PD55003TR-E requirements.

6.How does Aetrix verify that PD55003TR-E is sourced from the original manufacturer or authorized distributors?

All PD55003TR-E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PD55003TR-E meets industry standards.

7.What is the process for return or replacement of PD55003TR-E?

All PD55003TR-E units undergo pre-shipment inspection (PSI). If there is an issue with PD55003TR-E, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PD55003TR-E part is unused and in its original packaging.

Return procedure for PD55003TR-E:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

2026-08-11 LDO Regulator: Dropout Voltage, Noise, PSRR and Power Dissipation

LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…

2026-08-06 Conditional Access Module: CAM, CI/CI+ and DVB Security

Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…

2026-08-03 Electronic Component Obsolescence: EOL Risks, Replacement Options and Last-Time Buy Strategy

Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.

2026-07-29 18650 Battery: Voltage, Capacity, Charging and Pack Design

18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

2026-07-27 Hall Effect Sensor: Working Principle, Types, Circuits and Applications

Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

2026-07-17 Raspberry Pi Alternatives: Chip-Level Comparison, Compatibility and Replacement Guide

Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

2026-07-13 How to Test Dynamic Load Response in Low-Voltage High-Current Buck Converters

Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…