STMicroelectronics PD85015S-E
- Part No.:
- PD85015S-E
- Manufacturer:
- STMicroelectronics
- Category:
- Single FETs, MOSFETs
- Package:
- PowerSO-10 Exposed Bottom Pad
- Datasheet:
-
PD85015S-E.pdf
- Description:
- RF MOSFET LDMOS 13.6V PWRSO-10RF
- Quantity:
- Payment:

- Shipping:

Inventory:5,656
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PD85015S-E from STMicroelectronics is a common-source, N-channel enhancement-mode lateral MOSFET RF power transistor in PowerSO-10RF straight-lead plastic package. It delivers 15 W output power with 16 dB gain at 870 MHz under 13.6 V supply, features ESD protection (HBM Class 2, MM Class M3), and operates up to 1 GHz for broadband industrial and commercial RF amplification - notably in car radio final stages.
For engineers reviewing the PD85015S-E datasheet, PD85015S-E pinout, PD85015S-E application, or PD85015S-E equivalent, key selection criteria include its 1.6 °C/W junction-to-case thermal resistance, 40 V drain-source breakdown voltage, 5 A continuous drain current rating, linearity performance at P3dB, and compatibility with SMD assembly in high-reliability RF power designs.
Technical Context
The PD85015S-E employs ST's LDMOS technology optimized for RF power amplification in common-source configuration. Its static characteristics include VGS(Q) = 3.0–4.3 V at ID = 150 mA and low RDS(ON) of 0.34 V at VGS = 10 V/ID = 1 A, enabling efficient biasing and switching control.
Dynamically, it achieves 15–20 W P3dB output at 870 MHz with 16 dB power gain and 60–70% drain efficiency. Input/output impedance data (e.g., ZIN = 0.651 + j1.512 Ω at 800 MHz) supports broadband matching network design without external harmonic suppression.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| V(BR)DSS | 40 V - Ensures safe operation with 13.6 V rail plus transient margin in automotive and industrial RF supplies. |
| P3dB Output | 15–20 W @ 870 MHz - Delivers usable linear RF power for FM/AM broadcast and land-mobile radio final stages. |
| Power Gain | 16 dB @ POUT = 15 W - Reduces driver-stage complexity and enables single-stage amplification in compact modules. |
| RthJC | 1.6 °C/W - Enables direct heatsink mounting with minimal thermal interface resistance for stable 59 W dissipation at TC = 70 °C. |
| ESD Rating | HBM Class 2, MM Class M3 - Supports robust handling during SMT assembly and field service without gate oxide damage. |
| CISS / COSS | 45 pF / 36 pF @ 12.5 V - Defines input/output capacitance for impedance matching and stability analysis across 500–1000 MHz band. |
Pinout & Package
PD85015S-E uses the PowerSO-10RF straight-lead plastic package - JEDEC-approved, surface-mountable, and optimized for RF thermal and electrical performance. Dimensions include overall width L = 0.8–1.1 mm, lead pitch E = 15.15–15.65 mm, and case height A2 = 3.4–3.6 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Gate (G) | Control electrode | Accepts DC bias and RF drive signal; requires stable 3.0–4.3 V threshold for 150 mA quiescent current. |
| Source (S) | Common reference node | Connected to RF ground plane; serves as return path for 5 A max drain current and thermal conduction path to heatsink. |
| Drain (D) | High-power output terminal | Delivers 15 W RF output; electrically isolated from heatsink via package base but thermally coupled for RthJC = 1.6 °C/W. |
Key Features
| Feature | Design Value |
|---|---|
| Common-source topology | Enables standard RF amplifier design with grounded source, simplifying input/output matching and bias network layout. |
| Plastic SMD package (PowerSO-10RF) | First JEDEC-approved high-power RF SMD package - eliminates through-hole assembly while maintaining thermal integrity and RF shielding. |
| Linearity at P3dB | 60–70% drain efficiency with <20:1 load mismatch tolerance - supports reliable operation under antenna VSWR variations in mobile transmitters. |
| Lateral LDMOS structure | Provides excellent thermal stability and gain flatness over temperature - critical for uncooled car radio amplifiers operating from –40 °C to +105 °C ambient. |
Applications
| Car Radio Final Amplifier | Land-Mobile Radio Transmitter |
|---|---|
Use Scenario: Final-stage RF power amplification in OEM automotive FM/AM receivers. IC Role / Device Role / Timing Role: Common-source RF power transistor delivering 15 W into 50 Ω load at 870 MHz. Use Value: High linearity and thermal stability ensure consistent audio fidelity and compliance with CISPR 25 conducted emissions limits. | Use Scenario: Base station and repeater PA module in 800–900 MHz public safety radio systems. IC Role / Device Role / Timing Role: High-efficiency RF power stage supporting 20:1 VSWR tolerance under full load. Use Value: Eliminates need for circulators or active VSWR protection, reducing BOM count and system footprint. |
| Broadband Industrial Amplifier | Test & Measurement Signal Source |
Use Scenario: Wideband RF driver in EMC immunity test equipment covering 500–1000 MHz. IC Role / Device Role / Timing Role: Linear gain block with flat 16 dB response and low distortion up to 1 GHz. Use Value: Enables single-device coverage of multiple ISM bands without retuning, improving calibration speed and repeatability. | Use Scenario: Compact RF signal generator output stage in portable benchtop instruments. IC Role / Device Role / Timing Role: Fixed-gain, DC-biased RF power amplifier with integrated ESD protection. Use Value: Simplifies front-end protection design and supports hot-plug I/O without external TVS diodes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF power transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| PD85015-E | Formed-lead (gull-wing) variant of same die; identical electrical specs and thermal resistance | Requires reflow-compatible PCB pad layout with 0.2–0.25 mm lead standoff | Select for automated SMT lines with standard gull-wing reflow profiles. |
| PD85015TR-E | Tape-and-reel packaging; otherwise identical electrical and thermal performance to PD85015S-E | Optimized for high-volume pick-and-place assembly; no change in circuit design or layout | Select when ordering ≥500 units and using automated placement equipment. |
Compared with PD85015-E and PD85015TR-E, the PD85015S-E offers identical RF performance and thermal behavior but differs only in lead form (straight vs. gull-wing) and packaging (tube vs. tape-and-reel), making it suitable for manual prototyping or selective soldering processes where formed leads are incompatible.
Availability
PD85015S-E is available at Aetrix Electronics and suitable for car radio final amplifiers, land-mobile radio transmitters, and broadband industrial RF amplifiers requiring stable component supply, JEDEC-compliant SMD packaging, and proven thermal reliability in uncooled environments.
Supply support for PD85015S-E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for industrial, automotive, and consumer markets.
The PD85015S-E belongs to ST's LdmoST plastic RF power transistor family - engineered specifically for high-gain, high-linearity, broadband amplification in cost-sensitive commercial and industrial RF systems operating up to 1 GHz.
FAQ
What is the maximum operating frequency of the PD85015S-E?
The PD85015S-E is characterized for operation up to 1 GHz, with full RF performance data (gain, P3dB, efficiency) specified at 870 MHz. Its impedance and capacitance parameters remain stable across 500–1000 MHz, supporting broadband matching networks without performance degradation.
Does PD85015S-E require external gate protection?
No - the device integrates on-chip ESD protection rated Class 2 HBM and Class M3 MM, eliminating the need for external gate-series resistors or TVS diodes in typical RF amplifier layouts. Gate drive circuits should still maintain clean DC bias and avoid floating conditions during power-up.
How does the PowerSO-10RF package improve thermal performance?
The PowerSO-10RF package provides direct thermal conduction from the drain die attach to the exposed copper slug on the package underside, achieving RthJC = 1.6 °C/W. This allows 59 W power dissipation at TC = 70 °C with minimal heatsink mass - critical for space-constrained automotive and portable RF modules.
Can PD85015S-E be used in Class AB amplifier configurations?
Yes - its 150 mA quiescent drain current (IDQ) at VGS = 3.0–4.3 V and low VDS(ON) of 0.34 V enable stable Class AB biasing. The device maintains linearity and efficiency across output power levels from 1 W to 15 W, supporting both high-efficiency and low-distortion operating points.
PD85015S-E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- PowerSO-10 Exposed Bottom Pad
- Packaging:
- Tube
- Product Status:
- Active
- Technology:
- LDMOS
- Configuration:
- -
- Frequency:
- 870MHz
- Gain:
- 16dB
- Voltage - Test:
- 13.6 V
- Current Rating (Amps):
- 5A
- Noise Figure:
- -
- Current - Test:
- 150 mA
- Power - Output:
- 15W
- Voltage - Rated:
- 40 V
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- PowerSO-10RF (Straight Lead)
PD85015S-E FAQ
1.How can I place an order for PD85015S-E through Aetrix?
Please submit a Request for Quotation (RFQ) for PD85015S-E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PD85015S-E reliable?
The price and inventory of PD85015S-E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PD85015S-E is usually 5 days.
3.What payment methods are accepted for PD85015S-E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PD85015S-E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PD85015S-E?
PD85015S-E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PD85015S-E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PD85015S-E?
For technical support, including PD85015S-E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PD85015S-E requirements.
6.How does Aetrix verify that PD85015S-E is sourced from the original manufacturer or authorized distributors?
All PD85015S-E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PD85015S-E meets industry standards.
7.What is the process for return or replacement of PD85015S-E?
All PD85015S-E units undergo pre-shipment inspection (PSI). If there is an issue with PD85015S-E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PD85015S-E part is unused and in its original packaging.
Return procedure for PD85015S-E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PD85015S-E Tags

-
3SK294(TE85L,F)
Toshiba Semiconductor and Storage
-
SAV-551+
Mini-Circuits

-
TAV2-501+
Mini-Circuits

-
CE3514M4-C2
CEL

-
AFT05MS004NT1
NXP USA Inc.
-
SAV-541+
Mini-Circuits

-
CE3512K2-C1
CEL

-
AFM907NT1
NXP Semiconductors

-
SKY65050-372LF
Skyworks Solutions Inc.

-
CE3520K3-C1
CEL

-
AFT09MS007NT1
NXP USA Inc.

-
AFT09MS015NT1
NXP USA Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

.jpg)