NXP Semiconductors PDTC124XE,115

Overview

PDTC124XE from NXP Semiconductors is an NPN resistor-equipped transistor (RET) in SOT416 (SC-75) package, featuring integrated bias resistors R1 = 22 kΩ and R2/R1 = 2.1, V_CEO = 50 V, I_O = 100 mA, and V_CEsat ≤ 150 mV at I_C = 10 mA / I_B = 0.5 mA - used for compact logic-level switching in space-constrained digital interface circuits.

For engineers reviewing the PDTC124XE datasheet, PDTC124XE pinout, PDTC124XE application, or PDTC124XE equivalent, this page delivers verified package mapping (SOT416), confirmed pin functions (base-input/collector-output/emitter-GND), thermal resistance (R_th(j-a) = 833 K/W), off-state input voltage (V_I(off) = 0.5–0.8 V), and on-state input voltage (V_I(on) = 1.1–2 V) to support rapid BOM validation and PCB layout decisions.

Technical Context

The PDTC124XE integrates two precision bias resistors (R1 = 22 kΩ ±29%, R2/R1 = 2.1 ±21%) directly into an NPN silicon transistor die, eliminating external base resistors and reducing component count in level-shifting and digital buffer applications. Its internal resistor network enables direct connection to CMOS/TTL outputs without external pull-up or current-limiting components.

Designed for surface-mount assembly using reflow soldering only, the device operates across −65 °C to +150 °C ambient temperature with junction temperature limited to 150 °C. It exhibits low leakage (I_CEO ≤ 1 μA at 30 V, 25 °C) and stable DC current gain (h_FE ≥ 80 at V_CE = 5 V, I_C = 5 mA), supporting reliable saturation switching in low-power control paths.

Key Specifications

Pinout & Package

SOT416 (SC-75) ultra-small surface-mount plastic package: 1.8 mm × 1.4 mm × 0.95 mm body, 3-lead single-row configuration, designed for high-density PCB layouts and automated reflow assembly.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar NPN resistor-equipped transistor applications.

Compared with PDTC124XE, PDTA124XE enables complementary high-side control in dual-rail designs, while PDTC124XU trades miniaturization for improved thermal handling and assembly flexibility - both retain identical bias resistor values and switching thresholds, allowing functional substitution with minor layout adaptation.

Availability

PDTC124XE is available at Aetrix Electronics and suitable for LED driver circuits, digital logic level shifters, microcontroller I/O expander interfaces, and push-pull output stages requiring stable component supply, consistent parametric performance, and long-term production continuity.

Supply support for PDTC124XE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.

The PDTC124XE belongs to NXP's Resistor-Equipped Transistor (RET) family, engineered to simplify digital interface design by integrating precision bias networks into miniature SMT packages for space- and cost-sensitive embedded systems.

FAQ

What is the package type and dimensions of the PDTC124XE?

The PDTC124XE uses the SOT416 (JEITA SC-75) package: a 3-lead ultra-small surface-mount outline measuring 1.8 mm × 1.4 mm × 0.95 mm. Its standardized footprint allows placement in high-density layouts and compatibility with automated pick-and-place equipment. The PDTC124XE pinout is Pin 1 = base input, Pin 2 = emitter (GND), Pin 3 = collector output - confirmed in NXP's official datasheet Rev. 07.

Does the PDTC124XE require external base resistors?

No, the PDTC124XE does not require external base resistors because it integrates R1 = 22 kΩ and R2 = 47 kΩ internally. This resistor-equipped transistor (RET) is designed for direct connection to logic outputs such as MCU GPIOs or gate drivers. The PDTC124XE's built-in bias network ensures proper saturation and cutoff without additional components, reducing BOM count and PCB area.

What is the maximum continuous output current rating for the PDTC124XE?

The PDTC124XE has a maximum continuous output current (I_O) rating of 100 mA, as specified in Table 2 of the NXP datasheet. This value applies under standard mounting conditions on FR4 PCB with single-sided copper. Derating is required above Tamb = 25 °C, and peak current (I_CM) remains 100 mA for pulses ≤1 ms. The PDTC124XE's low V_CEsat ≤ 150 mV helps maintain efficiency at this current level.

Can the PDTC124XE be used in 1.8 V logic interface applications?

Yes, the PDTC124XE supports 1.8 V logic interfaces: its V_I(on) ranges from 1.1 V to 2.0 V, ensuring reliable turn-on with 1.8 V CMOS outputs, and its V_I(off) is 0.5–0.8 V, providing adequate noise margin. The PDTC124XE's internal R1/R2 ratio maintains stable biasing across voltage rails, making it suitable for mixed-voltage systems without level-shifter ICs.

How does the thermal performance of the PDTC124XE compare to other RET packages?

The PDTC124XE in SOT416 has a junction-to-ambient thermal resistance (R_th(j-a)) of 833 K/W in free air, which is higher than larger RET packages like SOT346 (500 K/W) or SOT490 (500 K/W). This reflects its ultra-compact size and lower power dissipation limit (P_tot = 150 mW). For thermally demanding applications, the PDTC124XE should be used within its 100 mA I_O and 150 mW P_tot limits, and PCB copper area should be maximized around Pin 2 (emitter/GND) to improve heat spreading. The PDTC124XE's thermal characteristics are fully documented in Table 7 of the NXP datasheet.