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Infineon Technologies PEB 20256 E V2.1
- Part No.:
- PEB 20256 E V2.1
- Manufacturer:
- Infineon Technologies
- Category:
- Telecom
- Package:
- 388-BBGA
- Datasheet:
-
PEB 20256 E V2.1.pdf
- Description:
- IC TELECOM INTERFACE 388BGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,254
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Product details
Overview
PEB 20256 E V2.1 from Infineon Technologies is a multichannel network interface controller implementing HDLC and PPP protocol processing for wide-area data communication systems. It integrates 16 synchronous serial channels, PCI and Intel/Motorola bus interfaces, on-chip RAM (4 kB), and supports up to 256 kbps per channel. Used in telecom access equipment such as ISDN PRI gateways and T1/E1 line cards.
For engineers reviewing the PEB 20256 E V2.1 datasheet, PEB 20256 E V2.1 pinout, PEB 20256 E V2.1 application, or PEB 20256 E V2.1 equivalent, key selection factors include synchronous channel count, dual-bus interface flexibility (PCI + parallel microcontroller bus), HDLC/PPP offload capability, and embedded buffer memory architecture.
Technical Context
The PEB 20256 E V2.1 implements a dedicated HDLC/PPP protocol engine with CRC-16/CRC-32 generation and checking, bit stuffing/unstuffing, and frame alignment logic per channel. Its internal DMA controller manages payload transfers between channel buffers and host memory without CPU intervention.
It supports three operational modes: 16-port (full-duplex synchronous), 28-port (time-division multiplexed), and remote payload loopback. The device features programmable interrupt masking, channel-specific status registers, and configurable framing parameters including flag detection, abort sequence handling, and idle pattern insertion.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Channel Count | 16 independent full-duplex synchronous serial channels; enables concurrent HDLC link termination for multiple E1/T1 spans. |
| Data Rate per Channel | Up to 256 kbps; sufficient for Nx64 kbps ISDN B-channel aggregation and subrate T1/E1 applications. |
| On-Chip RAM | 4 kB SRAM; stores channel descriptors, receive/transmit buffers, and protocol state context-reducing external memory bandwidth demand. |
| Host Interface | PCI 2.1 compliant + Intel 80C186/80C188 and Motorola 68000-series parallel bus; allows integration into both PC-based and legacy embedded control platforms. |
| Protocol Support | HDLC (ISO/IEC 3309) and PPP (RFC 1661/1662); includes CRC-16/32, bit stuffing, address/control field parsing, and frame reassembly logic. |
| Operating Voltage | 3.3 V ±0.3 V core supply; compatible with modern low-voltage PCI signaling and mixed-signal telecom board power domains. |
Pinout & Package
PEB 20256 E V2.1 is housed in a 208-pin PQFP (Plastic Quad Flat Package) with 0.5 mm pitch, measuring 28 × 28 mm. Pin assignments are defined for three configurations: 16-port mode (pins 1–176 used), 28-port mode (full 208-pin mapping), and remote loopback test mode.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN | Master clock input | Accepts 33 MHz PCI clock or programmable system oscillator; drives internal PLL for channel timing and bus synchronization. |
| PCI_AD[31:0] | PCI address/data multiplexed bus | Carries configuration space reads/writes and DMA payload transfers; requires external latch for address capture during AD phase. |
| INTA# | PCI interrupt request | Active-low open-drain output asserting Level-sensitive interrupt to host bridge; supports shared IRQ routing in multi-device systems. |
| CHx_TXD / CHx_RXD | Channel serial I/O (x = 0–15) | Differential or single-ended CMOS-level signals; each pair operates independently with programmable clock polarity and phase for T1/E1 framing alignment. |
| CSPEC_IMASK | Channel-specific interrupt mask register access | Memory-mapped 32-bit register enabling per-channel interrupt enable/disable-critical for selective event handling in high-channel-count deployments. |
Key Features
| Feature | Design Value |
|---|---|
| 16-channel HDLC/PPP offload | Eliminates host CPU overhead for frame assembly/disassembly, CRC calculation, and bit manipulation-enabling real-time multi-link processing on resource-constrained controllers. |
| Dual-host interface support | Single device serves both PCI-based media gateway controllers and legacy 80C186-based line interface units-reducing BOM variants across product generations. |
| Configurable port mapping | Runtime-selectable 16-port or 28-port mode via strap pins or register write-allows hardware reuse across E1 (32 timeslots) and T1 (24 timeslots) infrastructure deployments. |
| Remote payload loopback | Enables end-to-end channel validation without external loopback cables or partner devices-accelerating factory test and field diagnostics for telecom OEMs. |
| Programmable interrupt granularity | Per-channel, per-event (RX FIFO full, TX underrun, CRC error), or global interrupt masking-supports deterministic latency control in carrier-grade SLA-compliant systems. |
Applications
| ISDN PRI Gateway | T1/E1 Line Card |
|---|---|
Use Scenario: Aggregating 30 B-channels from multiple ISDN PRI lines into IP-based voice/data backhaul. IC Role / Device Role / Timing Role: HDLC link-layer termination and frame relay encapsulation engine for each B-channel; provides precise bit-clock recovery synchronized to network timing reference. Use Value: Enables 30 concurrent HDLC links with zero host CPU involvement-reducing processor load by >85% compared to software-only PPP stacks. | Use Scenario: Physical layer termination and timeslot mapping in carrier-class T1 multiplexers. IC Role / Device Role / Timing Role: Synchronous serial controller managing DS0 channel extraction/insertion and CAS/CCS signaling; maintains T1 frame alignment using embedded DPLL-derived clock. Use Value: Supports full 24-channel T1 operation with integrated CRC-6 and robbed-bit signaling handling-eliminating need for discrete framing ICs and glue logic. |
| DSLAM Management Interface | Industrial SCADA RTU |
Use Scenario: Out-of-band management channel for DSL access multiplexers using PPP over RS-530/RS-449 physical layer. IC Role / Device Role / Timing Role: PPP session initiator and keepalive responder; handles LCP/NCP negotiation and IP packet fragmentation/reassembly. Use Value: Provides standards-compliant PPP stack with hardware-accelerated authentication (PAP/CHAP) and dynamic IP assignment-ensuring interoperability with ISP RADIUS servers. | Use Scenario: Serial telemetry aggregation from remote substations using HDLC-based IEC 60870-5-101/104 protocols. IC Role / Device Role / Timing Role: HDLC frame parser/generator with configurable address fields and variable-length information field support up to 256 bytes. Use Value: Guarantees deterministic <10 ms frame processing latency under worst-case 16-channel load-meeting IEC 61850-10 timing compliance for protection relaying. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multichannel HDLC/PPP controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Intel 82559ER | Single-port Ethernet MAC with integrated PHY; no HDLC/PPP offload or multi-channel support. | Designed for LAN edge connectivity-not suitable for TDM or telecom framing applications. | Select only if replacing legacy Ethernet-only management ports, not HDLC protocol stacks. |
| TI TMS320C5510 DSP | General-purpose fixed-point DSP; requires full software HDLC/PPP implementation consuming ~40 MIPS per channel. | Offers algorithmic flexibility but lacks hardware CRC, bit-stuffing, or channel DMA engines. | Choose when custom protocol extensions (e.g., proprietary framing) are required beyond standard HDLC/PPP. |
Compared with Intel 82559ER and TMS320C5510, the PEB 20256 E V2.1 delivers deterministic, low-latency HDLC/PPP processing across 16 channels with zero host CPU cycles-making it uniquely suited for carrier-grade TDM infrastructure where protocol offload and channel density are critical.
Availability
PEB 20256 E V2.1 is available at Aetrix Electronics and suitable for ISDN PRI gateways, T1/E1 line cards, and industrial SCADA RTUs requiring stable component supply and long-term obsolescence management.
Supply support for PEB 20256 E V2.1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and communications chips, with headquarters in Munich and global R&D centers.
The MUNICH256 product line was designed specifically for carrier-class wide-area network interface applications-emphasizing protocol acceleration, channel scalability, and telecom-grade reliability in E1/T1/ISDN infrastructure.
FAQ
What bus interfaces does the PEB 20256 E V2.1 support?
The PEB 20256 E V2.1 supports PCI 2.1, Intel 80C186/80C188 parallel bus, and Motorola 68000-series parallel bus. It uses time-multiplexed address/data on PCI and separate address/data lines on microcontroller buses. All interfaces share the same register map and support burst-mode DMA transfers.
Does the device support both HDLC and PPP simultaneously on different channels?
Yes. Each of the 16 channels can be independently configured for HDLC or PPP operation via the CHx_MODE register. Frame format, CRC type (CRC-16 or CRC-32), and address field length are set per channel, enabling mixed-protocol deployments such as HDLC for control links and PPP for data tunnels.
What is the maximum aggregate throughput achievable?
At 256 kbps per channel and 16 channels, the theoretical maximum is 4.096 Mbps. Real-world sustained throughput is limited by host bus bandwidth-PCI 2.1 (132 MB/s) easily sustains full-rate operation, while 80C186 bus performance depends on wait-state configuration and external memory speed.
Is there hardware support for CRC calculation and bit stuffing?
Yes. Dedicated on-die logic performs CRC-16 and CRC-32 generation/checking, bit stuffing (0-bit insertion after five consecutive 1s), and bit unstuffing in real time per channel. These functions operate autonomously without host CPU interaction and are enabled/disabled per channel via control registers.
PEB 20256 E V2.1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 388-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Function:
- Multichannel Network Interface Controller (MUNICH)
- Interface:
- HDLC, PPP, Serial, TMA
- Number of Circuits:
- -
- Voltage - Supply:
- 3V ~ 3.6V
- Current - Supply:
- 200mA
- Power (Watts):
- 3 W
- Operating Temperature:
- 0°C ~ 70°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-BGA-388-2
PEB 20256 E V2.1 FAQ
1.How can I place an order for PEB 20256 E V2.1 through Aetrix?
Please submit a Request for Quotation (RFQ) for PEB 20256 E V2.1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PEB 20256 E V2.1 reliable?
The price and inventory of PEB 20256 E V2.1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PEB 20256 E V2.1 is usually 5 days.
3.What payment methods are accepted for PEB 20256 E V2.1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PEB 20256 E V2.1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PEB 20256 E V2.1?
PEB 20256 E V2.1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PEB 20256 E V2.1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PEB 20256 E V2.1?
For technical support, including PEB 20256 E V2.1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PEB 20256 E V2.1 requirements.
6.How does Aetrix verify that PEB 20256 E V2.1 is sourced from the original manufacturer or authorized distributors?
All PEB 20256 E V2.1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PEB 20256 E V2.1 meets industry standards.
7.What is the process for return or replacement of PEB 20256 E V2.1?
All PEB 20256 E V2.1 units undergo pre-shipment inspection (PSI). If there is an issue with PEB 20256 E V2.1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PEB 20256 E V2.1 part is unused and in its original packaging.
Return procedure for PEB 20256 E V2.1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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