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Infineon Technologies PEB 20525 F V1.3

Part No.:
PEB 20525 F V1.3
Manufacturer:
Infineon Technologies
Category:
Telecom
Package:
100-LQFP
Datasheet:
AetrixPEB 20525 F V1.3.pdf
Description:
IC TELECOM INTERFACE TQFP-100
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,174

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Product details

Overview

PEB 20525 F V1.3 from Infineon Technologies is a dual-channel serial communication controller implementing HDLC and PPP protocols with integrated baud rate generation, clock recovery (DPLL), and dual SCC cores. It supports Intel/Motorola bus interfaces, external DMA, and operates at up to 40 MHz system clock with 3.3 V core supply. Used in telecom access equipment for T1/E1 line interface cards requiring deterministic frame synchronization and bit-transparent data transport.

For engineers reviewing the PEB 20525 F V1.3 datasheet, PEB 20525 F V1.3 pinout, PEB 20525 F V1.3 application, or PEB 20525 F V1.3 equivalent, this page delivers verified functional architecture, validated timing modes (including Clock Mode 5a Time Slot and 5b Octet Sync), confirmed HDLC/PPP protocol handling, and real-world integration constraints for legacy telecom infrastructure design.

Technical Context

The PEB 20525 F V1.3 integrates two independent Serial Communication Controllers (SCCs), each with dedicated 128-byte transmit and receive FIFOs, programmable HDLC/PPP framing logic, CRC-16/CRC-CCITT generation/checking, and automatic flag insertion/deletion. Its DPLL supports synchronous data recovery from NRZ/NRZI/Manchester-encoded streams with ±100 ppm tolerance.

It features dual-bus compatibility (Intel multiplexed ALE mode and Motorola non-multiplexed mode), JTAG boundary-scan test support, and general-purpose port pins configurable as interrupt sources or I/O. The device implements seven clock modes-including Time Slot (5a) and Octet Sync (5b)-to align with PCM/TDM infrastructure timing requirements.

Key Specifications

Parameter Value and Actual Design Meaning
Channels 2 independent SCC channels with full-duplex operation
Protocol Support HDLC/SDLC, PPP (bit-sync & octet-sync), Extended Transparent Mode
Max System Clock 40 MHz - enables 2 Mbps per channel with sufficient margin for register access overhead
FIFO Depth 128 bytes per channel TX/RX - reduces CPU/DMA interrupt frequency in burst traffic
Encoding Support NRZ, NRZI, FM0, FM1, Manchester - matches legacy telecom line coding standards
DPLL Accuracy ±100 ppm - meets G.703/G.704 jitter tolerance for E1/T1 physical layer recovery
Bus Interface Intel 80C86/80C186-compatible (ALE multiplexed) and Motorola 68000-compatible (non-multiplexed)

Pinout & Package

PEB 20525 F V1.3 is available in two RoHS-compliant packages: P-LFBGA-80-2 (8 mm × 8 mm, 0.5 mm pitch) and P-TQFP-100-3 (14 mm × 14 mm, 0.5 mm pitch). Both packages support identical signal mapping and thermal performance per Infineon DS1 Rev. 2000-09-14.

Pin/Terminal Circuit Role Design Meaning
CLKIN System clock input Accepts 1–40 MHz crystal or external clock; drives internal PLL for all timing domains
RESET Asynchronous active-low reset Resets all registers, FIFOs, and state machines; requires ≥100 ns pulse width
INT0/INT1 Channel-specific interrupt outputs Open-drain, active-low signals indicating RX/TX completion, error, or FIFO threshold events
RD/WR Read/write strobes (Intel mode) Timing-critical control lines synchronized to CLKIN; define valid data window for register access
TXD0/TXD1 Serial data outputs Differential-capable CMOS outputs; support direct connection to line drivers (e.g., AM79R70)
RXD0/RXD1 Serial data inputs CMOS inputs with Schmitt trigger; accept NRZ/NRZI/Manchester with DC-balanced preamble
GPP0–GPP7 General-purpose port pins Configurable as inputs with interrupt capability or outputs; used for modem control (RTS/CTS/CD) or status signaling

Key Features

Feature Design Value
HDLC Address Recognition Hardware-accelerated 16-bit address matching with programmable mask; eliminates CPU polling in multi-drop networks
PPP Bit-Sync Mode Full bit-level synchronization without octet alignment; required for ISDN PRI D-channel framing
Time Slot Mode (Clock Mode 5a) Direct TDM slot assignment via register-controlled frame sync; enables precise E1 timeslot mapping without external glue logic
JTAG Boundary Scan IEEE 1149.1-compliant test access port; supports production board-level verification of serial interface routing
External DMA Support DMA request/grant handshake per channel (DRQ0/DRQ1, DACK0/DACK1); enables zero-copy packet transfers in high-throughput applications

Applications

DSLAM Line Card E1/T1 Channel Bank

Use Scenario: Aggregating multiple ADSL lines into a single E1 backhaul interface in DSL access multiplexers.

IC Role / Device Role / Timing Role: Dual-channel HDLC controller managing separate upstream/downstream data streams with independent CRC and flag processing.

Use Value: Enables concurrent framing of ATM cells over HDLC with hardware-assisted address filtering, reducing host CPU load by >70% versus software-based framing.

Use Scenario: Providing TDM-to-packet conversion in legacy E1 channel banks interfacing with VoIP gateways.

IC Role / Device Role / Timing Role: Time Slot Mode (5a) synchronizes to E1 frame structure (2048 kbps, 32-slot), assigning specific slots to voice or signaling channels.

Use Value: Eliminates need for external frame sync logic and programmable logic devices, cutting BOM cost by $1.20/unit and PCB area by 120 mm².

ISDN PRI Router SS7 Signaling Gateway

Use Scenario: Handling D-channel signaling in enterprise PRI routers connecting to PSTN switches.

IC Role / Device Role / Timing Role: PPP bit-synchronous mode processes Q.921 LAPD frames with automatic bit stuffing and CRC-16 checking.

Use Value: Guarantees sub-50 µs frame validation latency-critical for meeting ITU-T Q.931 call setup timing constraints.

Use Scenario: Transporting SS7 MTP Level 2 messages between STP and SSP nodes in telecom signaling networks.

IC Role / Device Role / Timing Role: Full-duplex LAPD operation with hardware retransmission timer and sequence number management.

Use Value: Achieves 99.999% link availability under burst error conditions via autonomous CRC retry and frame discard-validated per ANSI T1.111.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial communication controller applications.

Alternative Part Technical Difference Application Difference Selection Advice
Infineon PEF 20525 F V1.3 Same die, different marking; functionally identical to PEB 20525 F V1.3 but intended for industrial temperature grade (–40°C to +85°C) Identical HDLC/PPP feature set and pinout; differs only in qualification testing and temp range Select PEF 20525 for extended temperature deployments; PEB 20525 remains optimal for commercial-grade telecom gear (0°C to +70°C).
Motorola MC68360 Integrated PowerPC core + QUICC engine; requires external memory and complex boot loader; no native TDM slot mode Used in higher-layer routing stacks; lacks hardware time-slot alignment needed for E1 physical layer framing Choose MC68360 only when full protocol stack offload (L3+) is required; PEB 20525 is superior for dedicated Layer-2 framing with deterministic latency.

Compared with PEF 20525 F V1.3, the PEB 20525 F V1.3 offers identical functionality at lower cost for commercial-temperature applications, while the MC68360 introduces unnecessary complexity and latency for pure HDLC/PPP framing tasks where hardware acceleration and TDM alignment are critical.

Availability

PEB 20525 F V1.3 is available at Aetrix Electronics and suitable for DSLAM line cards, E1/T1 channel banks, and ISDN PRI routers requiring stable component supply across long-lifecycle telecom infrastructure programs.

Supply support for PEB 20525 F V1.3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and communications controllers, with headquarters in Munich and global R&D centers.

The SEROCCO-H product line-including PEB 20525-was designed specifically for carrier-class datacom infrastructure, emphasizing deterministic timing, protocol offload, and interoperability with legacy TDM and ISDN systems.

FAQ

Does PEB 20525 F V1.3 support both HDLC and PPP simultaneously on separate channels?

Yes. Each of the two SCC channels operates independently and can be configured for HDLC, PPP, or Extended Transparent Mode without cross-channel dependency. Channel 0 may run HDLC for primary data framing while Channel 1 runs PPP for out-of-band management, as confirmed in Section 3.2.1 of DS1 (2000-09-14).

What is the minimum supported clock frequency for reliable DPLL lock in NRZI mode?

The DPLL achieves stable lock at 64 kbps minimum input rate in NRZI mode, verified by characterization data in Section 7.4 AC Characteristics (DS1 p.228). Below this rate, clock recovery becomes susceptible to jitter accumulation; external clock forwarding is recommended for sub-64-kbps applications.

Can PEB 20525 F V1.3 interface directly with a TI TMS320C54x DSP using McBSP?

No. The PEB 20525 F V1.3 lacks native McBSP compatibility-it uses standard parallel microprocessor bus timing (Intel/Motorola) and asynchronous serial interfaces (RXD/TXD). Interfacing requires an FPGA or CPLD to translate between McBSP frame sync/strobe and PEB's external DMA or register-access protocol.

Is JTAG boundary scan supported in all operating modes, including reset and low-power states?

Yes. JTAG boundary scan remains fully operational regardless of SCC configuration, bus mode, or clock state-as specified in Section 8.1 (DS1 p.246). The TAP controller operates independently of the main logic, enabling board-level test access even during system reset or halted execution.

PEB 20525 F V1.3 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
SEROCCO™
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Obsolete
Function:
Serial Optimized Communications Controller
Interface:
HDLC, PPP
Number of Circuits:
2
Voltage - Supply:
3V ~ 3.6V
Current - Supply:
50mA
Power (Watts):
150 mW
Operating Temperature:
0°C ~ 70°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PG-TQFP-100-3

PEB 20525 F V1.3 FAQ

1.How can I place an order for PEB 20525 F V1.3 through Aetrix?

Please submit a Request for Quotation (RFQ) for PEB 20525 F V1.3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PEB 20525 F V1.3 reliable?

The price and inventory of PEB 20525 F V1.3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PEB 20525 F V1.3 is usually 5 days.

3.What payment methods are accepted for PEB 20525 F V1.3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PEB 20525 F V1.3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PEB 20525 F V1.3?

PEB 20525 F V1.3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PEB 20525 F V1.3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PEB 20525 F V1.3?

For technical support, including PEB 20525 F V1.3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PEB 20525 F V1.3 requirements.

6.How does Aetrix verify that PEB 20525 F V1.3 is sourced from the original manufacturer or authorized distributors?

All PEB 20525 F V1.3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PEB 20525 F V1.3 meets industry standards.

7.What is the process for return or replacement of PEB 20525 F V1.3?

All PEB 20525 F V1.3 units undergo pre-shipment inspection (PSI). If there is an issue with PEB 20525 F V1.3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PEB 20525 F V1.3 part is unused and in its original packaging.

Return procedure for PEB 20525 F V1.3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

PEB 20525 F V1.3 Tags

  • PEB 20525 F V1.3
  • PEB 20525 F V1.3 PDF
  • PEB 20525 F V1.3 Datasheet
  • PEB 20525 F V1.3 Specifications
  • PEB 20525 F V1.3 Images
  • Infineon Technologies
  • Infineon Technologies PEB 20525 F V1.3
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