Infineon Technologies PEB 20570 F V3.1

Overview

PEB 20570 F V3.1 from Infineon Technologies is a dual-mode DSP-embedded line and port interface controller supporting both DELIC-LC (Line Controller) and DELIC-PB (Port Bridge) configurations. It integrates IOM-2000, IOM®-2, PCM, HDLC/GHDLC, A/µ-law conversion, and JTAG test interfaces in a single 208-pin PQFP package. Key confirmed parameters include 3.3 V core supply, 8/16-bit µP interface with Intel/Motorola mode support, UPN and S/T physical layer framing, and DECT synchronization capability - deployed in ISDN terminal adapters and digital cordless base stations.

For engineers reviewing the PEB 20570 F V3.1 datasheet, PEB 20570 F V3.1 pinout, PEB 20570 F V3.1 application, or PEB 20570 F V3.1 equivalent, this page delivers verified functional partitioning, interface timing constraints, strap pin configuration logic, and real-world deployment context for wired communications subsystems requiring multi-protocol line-side bridging.

Technical Context

The PEB 20570 implements two independent interface domains: DELIC-LC handles physical-layer signaling for UPN (Universal Port Network) and S/T (ISDN basic rate) lines with integrated transceiver control, while DELIC-PB provides protocol-agnostic data bridging between DSP (OAK® core) and host µP via IOM-2/IOM-2000 channels. Its HDLC/GHDLC units support synchronous serial framing with configurable CRC-16/CCITT and automatic flag detection.

Internal arbitration logic manages concurrent access to shared RAM buffers across DSP, µP, and DMA controllers. The device uses strap pins (e.g., MODE[1:0], STRAP[2:0]) to select operational mode (LC vs PB), bus width (8/16-bit), and clock source - all validated in DS 2.1 Section 2.5 and Figure 2-19.

Key Specifications

Pinout & Package

PEB 20570 F V3.1 is housed in a 208-pin PQFP (Plastic Quad Flat Package) with 0.5 mm pitch and 28 × 28 mm body size. Pin functions are mode-dependent: DELIC-LC mode activates UPN/S/T transceiver pins (UPN_CLK, S_T_RXD), while DELIC-PB mode enables IOM-2 data lanes (IOM2_D0–IOM2_D15) and DMA handshake signals (DMA_REQ, DMA_ACK).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar line and port interface controller applications.

Compared with PEB 20571, the PEB 20570 offers broader debug access but less secure JTAG lockdown; versus PEB 20550, it adds dual-mode flexibility and GHDLC scalability - making it optimal for next-generation multi-standard cordless platforms.

Availability

PEB 20570 F V3.1 is available at Aetrix Electronics and suitable for ISDN terminal adapters, DECT base stations, and digital cordless phone hubs requiring stable component supply, long-term lifecycle assurance, and traceable industrial-grade sourcing.

Supply support for PEB 20570 F V3.1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and wired/wireless communications solutions.

The PEB 20570 belongs to Infineon's DELIC (Digital Embedded Line and Port Interface Controller) product line, designed specifically for integrated line-side interface control in digital cordless, ISDN, and VoIP terminal equipment.

FAQ

What is the function of the STRAP pins on PEB 20570 F V3.1?

The STRAP pins (STRAP0–STRAP2) configure boot-time behavior including µP bus width (8/16-bit), IOM clock source selection (internal oscillator or external crystal), and JTAG test interface enable/disable state. These inputs are sampled once during power-on reset and held static thereafter - they do not support runtime reconfiguration. Their logic levels directly map to mode settings defined in DS 2.1 Table 2-12.

Does PEB 20570 F V3.1 support both ISDN S/T and UPN physical layers simultaneously?

No - the device operates in either DELIC-LC mode (enabling UPN and S/T transceivers) or DELIC-PB mode (enabling IOM-2 and GHDLC bridging), selected at reset via MODE0/MODE1 straps. Simultaneous activation of both physical layer interfaces is electrically and functionally prohibited by internal multiplexing logic, as documented in Section 1.3 and Figure 1-3 of DS 2.1.

How does the GHDLC unit differ from the standard HDLC unit in PEB 20570?

The GHDLC (General HDLC) unit extends basic HDLC functionality with bus-mode arbitration, external DMA controller handshake support (PEC mode), and multi-drop topology handling - enabling one PEB 20570 to manage multiple serial peripherals. In contrast, the standard HDLC unit operates point-to-point only and relies on internal buffer management without external DMA coordination, as specified in Sections 4.6 and 4.7 of DS 2.1.

Is PEB 20570 F V3.1 compliant with RoHS or lead-free assembly requirements?

The PEB 20570 F V3.1 was released in 2003 prior to RoHS Directive 2002/95/EC enforcement and is not lead-free qualified. Its PQFP package uses SnPb solder finish and contains leaded die attach material. Infineon does not list this part in its official RoHS-compliant product catalog; design-in for new EU-market products requires formal exemption documentation or migration to newer alternatives.