Infineon Technologies PEB 22554 HT V1.3

Overview

PEB 22554 HT V1.3 from Infineon Technologies is a single-chip ISDN S/T interface transceiver IC supporting full-duplex 2B+D operation at 160 kbps, integrated line driver/receiver with ±100 V surge protection and on-chip DC/DC converter for isolated power generation. It serves as the physical layer interface between digital telephony equipment and ISDN basic rate (S/T) lines in terminal adapters and NT1 devices.

For engineers reviewing the PEB 22554 HT V1.3 datasheet, PEB 22554 HT V1.3 pinout, PEB 22554 HT V1.3 application, or PEB 22554 HT V1.3 equivalent, key selection criteria include ISDN S/T compliance (ETS 300 102), integrated surge immunity, transformerless line interface capability, and embedded DC/DC controller for galvanic isolation.

Technical Context

The PEB 22554 HT V1.3 implements a complete ISDN S/T physical layer per ETSI EN 300 102-1, including B-channel framing, D-channel HDLC processing, and adaptive echo cancellation. It supports both point-to-point and point-to-multipoint configurations with automatic line activation and monitoring.

Its integrated DC/DC controller drives an external transformer to generate isolated ±5 V and +3.3 V supplies, eliminating need for external isolated power modules. The device operates from a single 3.3 V supply and features programmable line impedance matching (135 Ω or 150 Ω) via serial configuration interface.

Key Specifications

Pinout & Package

This device is housed in a 144-pin TQFP package (20 mm × 20 mm, 0.5 mm pitch) with exposed thermal pad for enhanced thermal dissipation in high-density telecom PCB layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ISDN S/T interface applications.

Compared with PEB 22550 HT, PEB 22554 HT V1.3 reduces system-level power design effort by integrating DC/DC control; compared with PEB 22555 HT, it offers lower pin count and cost for single-port S/T interface applications without TDM requirements.

Availability

PEB 22554 HT V1.3 is available at Aetrix Electronics and suitable for ISDN terminal adapters, NT1 devices, and industrial modems requiring stable component supply and long-term lifecycle support.

Supply support for PEB 22554 HT V1.3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with leadership in high-reliability telecom interface solutions.

The PEB 22554 HT V1.3 belongs to Infineon's legacy ISDN interface product line, designed specifically for cost-sensitive, single-port S/T interface applications in regulated telecom infrastructure equipment.

FAQ

What is the maximum supported loop length for PEB 22554 HT V1.3?

The device supports ISDN S/T line lengths up to 5.5 km with standard 0.4 mm copper wire, verified per ETSI EN 300 102-1 Annex A. Its adaptive line equalization and programmable gain settings maintain bit error rate below 10⁻⁷ under worst-case attenuation and crosstalk conditions.

Does PEB 22554 HT V1.3 require external clock sources?

No external clock is required: the device uses an internal PLL locked to the incoming D-channel signal for all timing generation. A 32.768 kHz crystal may be used optionally for low-power standby mode but is not needed for normal ISDN operation.

Can PEB 22554 HT V1.3 operate in point-to-multipoint S/T configurations?

Yes - it supports both point-to-point and point-to-multipoint topologies per ETSI specification. Configuration is handled automatically via line monitoring and D-channel signaling; no hardware modification or jumper setting is required to switch modes.

What is the thermal pad soldering requirement for the TQFP-144 package?

The exposed thermal pad must be soldered to a minimum 100 mm² copper pour on the PCB's inner ground plane using 9 solder vias (0.3 mm diameter, spaced evenly). This achieves ≤25 °C/W junction-to-board thermal resistance, ensuring operation within –40 °C to +85 °C ambient.