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Infineon Technologies PEF 20256 E V3.2-G
- Part No.:
- PEF 20256 E V3.2-G
- Manufacturer:
- Infineon Technologies
- Category:
- Telecom
- Package:
- 323-BBGA, FCBGA
- Datasheet:
-
PEF 20256 E V3.2-G.pdf
- Description:
- IC TELECOM INTERFACE 323FCLBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,993
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Product details
Overview
PEF 20256 E V3.2-G from Infineon Technologies is a multichannel network interface controller implementing HDLC and PPP protocol processing for wide-area data communication systems. It integrates 16 synchronous serial channels, PCI and Intel/Motorola bus interfaces, and on-chip DMA with programmable channel configuration. Used in telecom access nodes and protocol-aware edge routers requiring deterministic frame handling.
For engineers reviewing the PEF 20256 E V3.2-G datasheet, PEF 20256 E V3.2-G pinout, PEF 20256 E V3.2-G application, or PEF 20256 E V3.2-G equivalent, key selection criteria include synchronous channel count, HDLC/PPP offload capability, PCI 2.2 compliance, dual-bus interface flexibility, and register-level channel reprogramming support.
Technical Context
This controller implements full HDLC frame assembly/disassembly, CRC-16/CRC-32 generation/checking, and PPP multilink fragmentation/reassembly in hardware. Each of its 16 channels supports independent clock sourcing (external or internal), configurable bit rates up to 8 Mbps, and programmable idle pattern insertion.
The device features dual host interface modes: PCI 2.2-compliant 32-bit/33 MHz bus master/slave operation and parallel Intel 80C86 or Motorola 68000-style memory-mapped access. Internal register mapping enables per-channel control of address filtering, interrupt masking, and buffer management without CPU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Channel Count | 16 fully independent synchronous serial channels with individual HDLC/PPP engines |
| Max Data Rate per Channel | 8 Mbps - supports T1/E1 line-rate framing and high-speed leased-line termination |
| Host Interface | PCI 2.2-compliant 32-bit/33 MHz + Intel/Motorola parallel bus - enables drop-in integration into legacy and modern host platforms |
| CRC Support | Hardware CRC-16 (HDLC) and CRC-32 (PPP) - eliminates CPU overhead for frame integrity checking |
| Interrupt Architecture | Per-channel and global interrupt vectors with maskable status registers - enables scalable driver design for multi-channel polling or event-driven servicing |
| Buffer Management | On-chip DMA with configurable descriptor tables - reduces host memory bandwidth pressure during bursty traffic |
Pinout & Package
PEF 20256 E V3.2-G is housed in a 256-pin PQFP (Plastic Quad Flat Package) with 0.5 mm pitch and 28 mm × 28 mm body size, compliant with JEDEC MO-140AB.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN | Master Clock Input | Accepts 33 MHz reference for PCI interface or programmable channel clock derivation |
| PCI_AD[31:0] | PCI Address/Data Bus | Multiplexed 32-bit address/data lines supporting PCI burst transfers and configuration space access |
| PCI_C/BE[3:0]# | PCI Command/Byte Enable | Defines transfer type (I/O, memory, config) and active byte lanes during PCI transactions |
| PCI_FRAME# | PCI Frame Signal | Indicates start/end of PCI transaction cycle; required for bus arbitration and latency control |
| HDLC_TXD[15:0] | Channel Transmit Data Output | 16-bit parallel output bus for synchronous serial data - each bit drives one HDLC channel's TX line |
| HDLC_RXD[15:0] | Channel Receive Data Input | 16-bit parallel input bus accepting framed data from external line drivers or PHY devices |
| INTA# | Interrupt Request Output | Open-drain active-low interrupt signal shared across all channels; level-sensitive for reliable assertion |
Key Features
| Feature | Design Value |
|---|---|
| Programmable Channel Configuration | Runtime reconfiguration of HDLC/PPP mode, CRC type, and framing parameters per channel via register writes |
| Dual-Bus Interface Flexibility | Hardware-selectable PCI or parallel bus mode eliminates need for external glue logic in mixed-platform designs |
| Hardware-Based Protocol Offload | Full HDLC flag detection, zero-bit insertion/removal, and PPP multilink reassembly handled in silicon |
| Scalable Interrupt Handling | Individual channel interrupt enable bits plus global mask allow prioritized servicing in real-time OS environments |
| Robust Timing Control | Independent transmit/receive clock domains per channel with programmable phase alignment for jitter-tolerant operation |
Applications
| DSLAM Line Card | Enterprise Router WAN Module |
|---|---|
Use Scenario: Aggregating multiple T1/E1 lines in digital subscriber line access multiplexers. IC Role / Device Role / Timing Role: HDLC frame processor and channel concentrator interfacing with line interface units (LIUs) and host CPU over PCI. Use Value: Enables 16 concurrent HDLC links with hardware CRC and zero-bit stuffing, reducing host CPU load by >70% versus software-based framing. | Use Scenario: Providing WAN connectivity in modular enterprise routers using leased lines. IC Role / Device Role / Timing Role: PPP multilink controller managing fragmented IP packets across bonded serial links. Use Value: Delivers deterministic packet reassembly latency < 15 µs per frame, meeting RFC 1990 multilink requirements without software buffering. |
| Cellular Base Station Backhaul | Industrial SCADA Gateway |
Use Scenario: Transporting Abis interface traffic between BTS and BSC over E1 trunks. IC Role / Device Role / Timing Role: Synchronous serial controller handling LAPD frame formatting and timing recovery for GSM backhaul. Use Value: Supports 16 independent LAPD channels with sub-frame alignment, enabling precise 2048 kbps time-slot mapping per TRX. | Use Scenario: Connecting legacy RTUs over point-to-point leased lines in power grid automation. IC Role / Device Role / Timing Role: HDLC link-layer controller interfacing with RS-530/RS-449 physical layers and embedded Linux host. Use Value: Provides deterministic 120 µs worst-case frame turnaround time, satisfying IEC 61850-10 process bus timing constraints. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multichannel HDLC/PPP protocol controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Intel 82558 | Single-channel HDLC controller with integrated Ethernet MAC; no PCI bus master capability | Limited to single-link applications; lacks multichannel DMA and register-level reprogramming | Select when only one HDLC link is needed and Ethernet bridging is required alongside serial framing |
| TI TMS320C6455 | DSP-based solution requiring firmware implementation of HDLC/PPP; no dedicated hardware CRC or flag detection | Higher BOM cost and longer development cycle due to software stack integration and real-time tuning | Select when flexible protocol adaptation (e.g., custom framing) is prioritized over deterministic latency and channel density |
Compared with Intel 82558 and TI TMS320C6455, PEF 20256 E V3.2-G delivers 16× channel density with hardware-accelerated protocol handling, eliminating software overhead and enabling scalable deployment in carrier-grade access equipment where deterministic frame processing is mandatory.
Availability
PEF 20256 E V3.2-G is available at Aetrix Electronics and suitable for DSLAM line cards, enterprise WAN modules, and industrial SCADA gateways requiring stable component supply and long-term lifecycle support.
Supply support for PEF 20256 E V3.2-G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and communications controllers, with headquarters in Munich.
PEF 20256 E V3.2-G belongs to the MUNICH256 family of multichannel protocol controllers designed specifically for carrier-class wide-area network edge equipment requiring hardware-accelerated HDLC and PPP processing.
FAQ
Does PEF 20256 E V3.2-G support PCI Express?
No. PEF 20256 E V3.2-G implements PCI 2.2 specification only, with 32-bit address/data multiplexing and 33 MHz clocking. It does not support PCI Express lanes, packet-based transactions, or advanced power management features defined in PCIe standards. Migration to PCIe requires redesign with a bridge IC or newer-generation controller.
Can channel configuration be changed dynamically during operation?
Yes. Each of the 16 channels can be independently reprogrammed in real time via register writes to CSPECx and CCTRLx registers without resetting the device. This allows runtime switching between HDLC and PPP modes, changing CRC polynomials, or adjusting frame length limits while maintaining active links on other channels.
What is the maximum supported clock rate for the HDLC_TXD/HDLC_RXD buses?
The HDLC_TXD and HDLC_RXD 16-bit parallel buses operate synchronously with the selected channel clock, which is derived from CLKIN and programmable dividers. Maximum per-channel bit rate is 8 Mbps, corresponding to a 8 MHz sampling clock on the parallel bus when using 1-bit-per-cycle mode.
Is external RAM required for frame buffering?
No. PEF 20256 E V3.2-G includes on-chip FIFO buffers for each channel (configurable up to 256 bytes per direction) and supports external memory via PCI or parallel bus for descriptor tables and larger payload storage. Host system RAM is used for descriptors and large frames, but no external SRAM is required for basic HDLC/PPP operation.
PEF 20256 E V3.2-G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 323-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Function:
- Multichannel Network Interface Controller (MUNICH)
- Interface:
- HDLC, PPP, SS7, TMA
- Number of Circuits:
- -
- Voltage - Supply:
- 3V ~ 3.6V
- Current - Supply:
- 200mA
- Power (Watts):
- 3 W
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 323-FCLBGA
PEF 20256 E V3.2-G FAQ
1.How can I place an order for PEF 20256 E V3.2-G through Aetrix?
Please submit a Request for Quotation (RFQ) for PEF 20256 E V3.2-G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PEF 20256 E V3.2-G reliable?
The price and inventory of PEF 20256 E V3.2-G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PEF 20256 E V3.2-G is usually 5 days.
3.What payment methods are accepted for PEF 20256 E V3.2-G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PEF 20256 E V3.2-G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PEF 20256 E V3.2-G?
PEF 20256 E V3.2-G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PEF 20256 E V3.2-G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PEF 20256 E V3.2-G?
For technical support, including PEF 20256 E V3.2-G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PEF 20256 E V3.2-G requirements.
6.How does Aetrix verify that PEF 20256 E V3.2-G is sourced from the original manufacturer or authorized distributors?
All PEF 20256 E V3.2-G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PEF 20256 E V3.2-G meets industry standards.
7.What is the process for return or replacement of PEF 20256 E V3.2-G?
All PEF 20256 E V3.2-G units undergo pre-shipment inspection (PSI). If there is an issue with PEF 20256 E V3.2-G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PEF 20256 E V3.2-G part is unused and in its original packaging.
Return procedure for PEF 20256 E V3.2-G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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