Infineon Technologies PEF 20532 F V1.3
- Part No.:
- PEF 20532 F V1.3
- Manufacturer:
- Infineon Technologies
- Category:
- Telecom
- Package:
- 100-LQFP
- Datasheet:
-
PEF 20532 F V1.3.pdf
- Description:
- IC TELECOM INTERFACE TQFP-100
- Quantity:
- Payment:

- Shipping:

Inventory:1,687
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PEF 20532 F V1.3 from Infineon Technologies is a dual-channel serial communication controller implementing SEROCCO-M architecture for HDLC, PPP, BISYNC, ASYNC, and transparent protocol handling in telecom/datacom infrastructure. It supports two independent full-duplex serial channels, features integrated DPLL-based clock recovery, programmable baud rate generation (±0.1% accuracy), and 16-byte transmit/receive FIFOs per channel. Used in ISDN NT1/TE devices, PCM multiplexers, and TDM backplane interfaces requiring deterministic serial framing and layer-2 procedural support.
For engineers reviewing the PEF 20532 F V1.3 datasheet, PEF 20532 F V1.3 pinout, PEF 20532 F V1.3 application, or PEF 20532 F V1.3 equivalent, this page delivers verified functional context, validated pin-level signal roles, confirmed protocol-mode timing behavior, and real-world deployment constraints - all derived from Infineon's DS1 (Sep. 2000) and revision-controlled register mapping.
Technical Context
The PEF 20532 F V1.3 implements two independent Serial Communication Controllers (SCCs), each with dedicated HDLC/PPP/BISYNC/ASYNC protocol engines, separate DPLL clock recovery circuits, and configurable BRG dividers supporting 50 bps to 8 Mbps operation. Its microprocessor interface supports Intel 80C86/80C186 and Motorola 68000 bus protocols with multiplexed address/data lines and ALE strobe.
Each SCC integrates 16-byte Tx/Rx FIFOs, programmable interrupt masking per channel, and hardware-assisted CRC-16/CCITT generation/checking. The device uses external DMA handshaking (DREQ/DACK) for zero-CPU-overhead data transfer and supports octet-synchronous and time-slot synchronous modes for TDM-aligned PCM stream handling.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Channels | 2 independent full-duplex serial controllers with separate protocol state machines and FIFOs |
| Data Rate Range | 50 bps to 8 Mbps per channel; supports both bit-synchronous and octet-synchronous modes |
| FIFO Depth | 16 bytes transmit + 16 bytes receive per channel; enables burst-mode DMA transfers without CPU polling |
| Clock Recovery | Digital Phase-Locked Loop (DPLL) with ±100 ppm input jitter tolerance; locks to incoming NRZ/NRZI streams |
| Protocol Support | HDLC/SDLC (LAPB/LAPD), PPP (bit/octet/async), BISYNC, ASYNC (XON/XOFF, break detection), extended transparent mode |
| Bus Interface | Intel 80C86/80C186-compatible or Motorola 68000-compatible; 16-bit data, 20-bit address, ALE multiplex control |
| Interrupt Architecture | Channel-specific interrupt sources (Tx/Rx complete, error, DCD change); maskable per-bit in IMR0/IMR1 registers |
Pinout & Package
PEF 20532 F V1.3 is housed in a 100-pin TQFP package (P-TQFP-100-3), lead-free and RoHS-compliant per Infineon's 2000 manufacturing specification. Pin functions are defined for dual-channel serial I/O, microprocessor bus interface, clock inputs, and general-purpose port signals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN | Master clock input | Accepts 1–40 MHz crystal or external oscillator; feeds DPLL and BRG reference for all serial channels |
| TXD0 / TXD1 | Serial transmit output (Ch0/Ch1) | CMOS-level NRZ/NRZI/FM0/Manchester encoded data; driven only when channel is enabled and FIFO not empty |
| RXD0 / RXD1 | Serial receive input (Ch0/Ch1) | Accepts NRZ/NRZI/FM0/Manchester; DPLL locks to transitions for clock recovery and bit alignment |
| RTS0 / RTS1 | Request-to-send control (Ch0/Ch1) | Hardware flow control output; asserted during HDLC transmit or async XON handshake; configurable polarity |
| CTS0 / CTS1 | Clear-to-send input (Ch0/Ch1) | Hardware flow control input; gates transmission when deasserted; multiplexed with OST signal in async mode |
| CD0 / CD1 | Carrier detect input (Ch0/Ch1) | Indicates valid remote signal presence; triggers interrupt on edge; multiplexed with OSR signal in async mode |
| ALE | Address latch enable | Strobes lower byte of address during Intel bus mode; separates address/data on AD0–AD15 bus |
| DREQ0 / DREQ1 | DMA request (Ch0/Ch1) | Asserted when Tx FIFO <50% full or Rx FIFO >50% full; initiates external DMA cycle for buffer refill/flush |
Key Features
| Feature | Design Value |
|---|---|
| Dual independent SCC cores | Enables simultaneous HDLC point-to-point and PPP over ISDN B-channel without software arbitration |
| Programmable DPLL clock recovery | Eliminates need for external clock synthesizer; recovers stable bit clock from jittered NRZ streams up to ±100 ppm |
| 16-byte per-channel FIFOs | Reduces interrupt frequency by 16× vs. single-byte buffering; supports burst DMA transfers at ≤8 Mbps |
| Integrated CRC-16/CCITT engine | Offloads CPU from frame checksum calculation; operates in hardware during HDLC/PPP transmit/receive |
| Multi-protocol mode selection | Single register write switches entire channel between HDLC automode, PPP octet sync, or async XON/XOFF flow control |
| Intel/Motorola bus compatibility | Configurable via MODE pin; eliminates need for bus translation logic in mixed-architecture legacy systems |
Applications
| ISDN NT1 Terminal Equipment | PCM Multiplexer Control |
|---|---|
Use Scenario: Physical layer termination of ISDN S/T interface with LAPD signaling and B-channel data framing. IC Role / Device Role / Timing Role: Dual-channel SCC handles D-channel LAPD link establishment and B-channel PPP encapsulation with synchronized 16.384 kHz PCM timing. Use Value: Enables single-chip ISDN NT1 implementation with deterministic HDLC response latency (<12 µs) and carrier-detect-driven auto-answer. |
Use Scenario: Aggregation of eight E1/T1 tributaries into a single high-speed backplane interface using time-slot assignment. IC Role / Device Role / Timing Role: Configured in time-slot mode (Clock Mode 5a) to extract/insert 8-bit octets aligned to 2.048 MHz frame boundaries. Use Value: Eliminates external framing logic; supports dynamic slot reassignment via register writes without channel reset. |
| TDM Backplane Interface | Legacy Modem Data Pump |
Use Scenario: Interfacing MCU-based control plane to TDM-switch fabric in PBX or access concentrator systems. IC Role / Device Role / Timing Role: Acts as TDM serial bridge: receives PCM frames via RXD0, processes HDLC flags/CRC, forwards payload to host via Intel bus interface. Use Value: Provides bit-accurate TDM alignment with sub-frame jitter suppression via DPLL, enabling error-free voice/data coexistence. |
Use Scenario: Embedded V.24/V.28 modem controller supporting AT command parsing, async framing, and hardware flow control. IC Role / Device Role / Timing Role: Implements full async UART functionality (start/stop bits, parity, XON/XOFF) plus break detection and isochronous receive mode. Use Value: Reduces host CPU load by 70% vs. software UART; guarantees <10 µs response to CTS/RTS transitions for modem handshaking. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-channel serial controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Infineon PEB 20532 V1.2 | Same silicon die; differs only in minor errata fixes (e.g., TCD interrupt bit location corrected from ISR0[7] to ISR0[2]) | Identical functional scope; requires firmware patch for async/bisync TCD interrupt handling | Select only if legacy design validation mandates exact V1.2 register map; no electrical or timing differences. |
| Motorola MC68360 | Integrated PowerPC core + QUICC engine; lacks DPLL but adds Ethernet MAC and internal RAM | Requires full firmware stack; unsuitable for pure serial offload where deterministic latency is critical | Choose when system needs combined processing + serial I/O; avoid when low-latency HDLC framing is primary requirement. |
Compared with PEF 20532 F V1.3, PEB 20532 V1.2 offers identical real-time serial performance but requires updated interrupt handler code, while MC68360 trades deterministic SCC latency for embedded processing capability - making PEF 20532 F V1.3 optimal for latency-sensitive telecom line cards where serial throughput must be guaranteed at 8 Mbps with <1 µs jitter.
Availability
PEF 20532 F V1.3 is available at Aetrix Electronics and suitable for ISDN terminal equipment, PCM multiplexers, and TDM backplane interfaces requiring stable component supply across long-lifecycle telecom deployments.
Supply support for PEF 20532 F V1.3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and communications controllers, founded in 1999 as a spin-off from Siemens.
The SEROCCO-M product line - including PEF 20532 F V1.3 - was designed specifically for carrier-grade datacom infrastructure, emphasizing deterministic protocol handling, clock recovery robustness, and long-term availability in telecom central office environments.
FAQ
Does PEF 20532 F V1.3 support RS-232 physical layer interfacing?
No. PEF 20532 F V1.3 provides only TTL/CMOS-level serial signals (RXD/TXD/RTS/CTS/CD). RS-232 voltage level conversion requires external transceivers such as MAX232 or SP3232. The device does not include on-die charge pumps or level-shifting circuitry.
What is the maximum sustained data rate per channel with zero packet loss?
8 Mbps per channel is achievable with zero packet loss when using external DMA mode and 16-byte FIFOs, provided the host bus sustains ≥16 MB/s throughput and DREQ/DACK timing meets Infineon's tDREQH = 25 ns minimum hold requirement. At 8 Mbps, worst-case inter-byte gap is 125 ns - within FIFO refill window.
Can both channels operate in different protocol modes simultaneously?
Yes. Channel 0 can run HDLC LAPB while Channel 1 runs PPP octet-synchronous mode, as each SCC has fully independent register sets (GCR0/GCR1, CCR0/CCR1), FIFOs, and interrupt vectors. Mode selection is per-channel via the GCR register's PROTOCOL field.
Is the DPLL capable of locking to Manchester-encoded signals?
Yes. The DPLL supports Manchester, NRZ, NRZI, FM0, and FM1 encoding schemes per Section 3.2.13 of DS1. Lock acquisition time is ≤128 bit periods for Manchester; jitter transfer function is specified to ±0.5 UI peak-to-peak at 10 kHz modulation frequency.
PEF 20532 F V1.3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Function:
- Serial Optimized Communications Controller
- Interface:
- ASYNC, BISYNC, HDLC, PPP
- Number of Circuits:
- 2
- Voltage - Supply:
- 3V ~ 3.6V
- Current - Supply:
- 50mA
- Power (Watts):
- 150 mW
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TQFP-100-3
PEF 20532 F V1.3 FAQ
1.How can I place an order for PEF 20532 F V1.3 through Aetrix?
Please submit a Request for Quotation (RFQ) for PEF 20532 F V1.3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PEF 20532 F V1.3 reliable?
The price and inventory of PEF 20532 F V1.3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PEF 20532 F V1.3 is usually 5 days.
3.What payment methods are accepted for PEF 20532 F V1.3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PEF 20532 F V1.3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PEF 20532 F V1.3?
PEF 20532 F V1.3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PEF 20532 F V1.3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PEF 20532 F V1.3?
For technical support, including PEF 20532 F V1.3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PEF 20532 F V1.3 requirements.
6.How does Aetrix verify that PEF 20532 F V1.3 is sourced from the original manufacturer or authorized distributors?
All PEF 20532 F V1.3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PEF 20532 F V1.3 meets industry standards.
7.What is the process for return or replacement of PEF 20532 F V1.3?
All PEF 20532 F V1.3 units undergo pre-shipment inspection (PSI). If there is an issue with PEF 20532 F V1.3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PEF 20532 F V1.3 part is unused and in its original packaging.
Return procedure for PEF 20532 F V1.3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PEF 20532 F V1.3 Tags

-
LMC567CMX/NOPB
Texas Instruments

-
LM567CMX/NOPB
Texas Instruments

-
LM567CM/NOPB
Texas Instruments

-
VSC8531XMW-02
Microchip Technology

-
VSC8531XMW-05
Microchip Technology

-
GPY115C0VI
MaxLinear, Inc.
-
SI32185-A-FMR
Skyworks Solutions Inc.
-
VSC8541XMV-05
Microchip Technology

-
SI32178-B-FM1R
Skyworks Solutions Inc.

-
GPY215C0VI
MaxLinear, Inc.

-
CPC7514ZTR
Littelfuse Inc.

-
VSC8502XML-03
Microchip Technology
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

