Infineon Technologies PEF 22554 E V3.1-G

Overview

PEF 22554 E V3.1-G from Infineon Technologies is a single-chip, full-duplex ISDN S/T-interface transceiver IC supporting 2B+D operation at 160 kbit/s, featuring integrated line driver, receiver, echo canceller, and D-channel controller in a 160-pin LBGA package. It is deployed in ISDN terminal adapters, NT1 devices, and multi-port ISDN gateways for European PSTN integration.

For engineers reviewing the PEF 22554 E V3.1-G datasheet, PEF 22554 E V3.1-G pinout, PEF 22554 E V3.1-G application, or PEF 22554 E V3.1-G equivalent, key selection criteria include BRI physical layer compliance (ETSI TS 101 524), integrated echo cancellation performance (≥35 dB), D-channel protocol handling (Q.921/Q.931), and LBGA-160 thermal and routing constraints.

Technical Context

The PEF 22554 E V3.1-G implements a complete ISDN Basic Rate Interface (BRI) S/T physical layer with dual B-channel transceivers (each 64 kbit/s) and one D-channel (16 kbit/s), compliant with ETSI EN 300 012 and ITU-T I.430. It integrates analog front-end circuitry including programmable line drivers (±12 V swing), adaptive receivers, and digital signal processing for hybrid echo cancellation.

Its embedded D-channel controller supports Layer 2 (LAPD) framing and automatic TE/NT mode detection via DC loop current sensing. The device operates from a 3.3 V core supply and 5 V analog supply, with internal voltage regulators and power-down modes for reduced idle consumption.

Key Specifications

Pinout & Package

PEF 22554 E V3.1-G is housed in a 12 mm × 12 mm, 0.8 mm pitch, 160-ball LBGA package with exposed thermal pad (EP). Ball mapping follows Infineon's standardized LBGA-160 layout for ISDN transceivers, with dedicated analog power/ground banks and controlled-impedance I/O groups.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ISDN S/T transceiver applications.

Compared with Si32260-B-GM and ST7570, the PEF 22554 E V3.1-G uniquely delivers full BRI S/T functionality-including NT/TE auto-detection, on-chip LAPD, and ≥35 dB echo cancellation-in a single LBGA-160 package, reducing system-level complexity and qualification effort for European ISDN deployments.

Availability

PEF 22554 E V3.1-G is available at Aetrix Electronics and suitable for ISDN terminal adapters, NT1 network terminations, and multi-port ISDN gateways requiring stable component supply and long-term lifecycle support.

Supply support for PEF 22554 E V3.1-G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, industrial, and communications ICs, with global R&D and manufacturing facilities.

The PEF 22554 E V3.1-G belongs to Infineon's PEF (Programmable Enhanced Front-end) product line, designed specifically for European ISDN infrastructure and terminal equipment requiring ETSI-compliant, single-chip S/T interface solutions.

FAQ

What is the recommended external transformer turns ratio for PEF 22554 E V3.1-G?

The device requires a 1:1.41 (primary:secondary) center-tapped transformer with 100 Ω primary impedance for optimal common-mode rejection and ETSI-compliant signal levels. Infineon reference design PEF22554-EVAL uses Pulse Engineering T1202, which meets all specified insertion loss, return loss, and balance requirements across 0–110 kHz.

Does PEF 22554 E V3.1-G support U-interface (2-wire) directly?

No. The PEF 22554 E V3.1-G implements only the S/T-interface (4-wire) per ITU-T I.430. For U-interface support, an external U-to-S/T converter (e.g., Infineon TLE6240) must be used upstream of this device.

How is thermal management handled in the LBGA-160 package?

The package features an exposed thermal pad (EP) soldered to a dedicated PCB copper pour connected to internal ground planes. Infineon specifies minimum 4×4 thermal vias (0.3 mm diameter) under the EP, with ≥200 mm² total copper area, to maintain junction temperature ≤110 °C at full load in still air.

Can the D-channel controller operate independently of the B-channels?

Yes. The D-channel controller runs autonomously once enabled, supporting LAPD link establishment and maintenance even when B-channels are disabled or idle. This allows out-of-band management, firmware updates, and diagnostics without disrupting active voice/data sessions.