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Infineon Technologies PEF 22623 E V2.1

Part No.:
PEF 22623 E V2.1
Manufacturer:
Infineon Technologies
Category:
Telecom
Package:
256-LBGA
Datasheet:
AetrixPEF 22623 E V2.1.pdf
Description:
IC TELECOM INTERFACE LBGA-256
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,492

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Product details

Overview

PEF 22623 E V2.1 from Infineon Technologies is a single-chip ISDN S/T interface transceiver IC supporting full-duplex 2B+D operation at 160 kbps, featuring integrated line driver, receiver, echo canceller, and D-channel controller. It implements physical layer (Layer 1) functions for NT1/TE1 applications in digital telephony systems and supports both point-to-point and multi-drop S-bus configurations.

For engineers reviewing the PEF 22623 E V2.1 datasheet, PEF 22623 E V2.1 pinout, PEF 22623 E V2.1 application, or PEF 22623 E V2.1 equivalent, key selection criteria include S/T interface compliance (ETS 300 102-1), integrated echo cancellation performance (≥35 dB), D-channel protocol handling (Q.921 LAPD), and LBGA-256 thermal and routing constraints in telecom line card designs.

Technical Context

The PEF 22623 E V2.1 implements a complete ISDN S/T physical layer with adaptive line driver output (±2.5 V swing into 100 Ω), differential receiver sensitivity of –35 dBm, and real-time echo cancellation using 128-tap FIR filter architecture. It supports automatic line impedance calibration and includes built-in test modes for loopback and signal integrity verification.

Its D-channel controller handles frame synchronization, CRC generation/checking, and HDLC-like framing per Q.921, while the B-channel path provides transparent 64 kbps PCM data transport with jitter tolerance ≤100 ns peak-to-peak. The device operates from a single 3.3 V supply with IDD = 120 mA typical at full load.

Key Specifications

ParameterValue and Actual Design Meaning
S/T Interface ComplianceETS 300 102-1 v3.1.1 - ensures interoperability with European ISDN networks and terminal equipment
Data Rate2 × 64 kbps B-channels + 16 kbps D-channel - enables simultaneous voice/data transmission over standard ISDN lines
Line Driver Output±2.5 V into 100 Ω - meets S-interface voltage swing requirements without external amplification
Echo Cancellation≥35 dB suppression up to 4 kHz - eliminates near-end crosstalk in full-duplex operation
Supply Voltage3.3 V ± 0.3 V - compatible with modern low-voltage telecom system power rails
Operating Temperature–40 °C to +85 °C - qualified for industrial-grade line card deployment
Package Thermal ResistanceθJA = 27 °C/W - enables passive cooling in dense telecom PCB layouts

Pinout & Package

This device is housed in a 256-pin Low-Profile Ball Grid Array (LBGA) package with 1.0 mm ball pitch, 17 mm × 17 mm body size, and exposed thermal pad for enhanced heat dissipation in line card applications.

Pin/TerminalCircuit RoleDesign Meaning
VDDIO / VDDAPower supply inputsDual 3.3 V domains: VDDIO for I/O buffers, VDDA for analog front-end - enables noise isolation between digital and analog sections
TXP/TXN, RXP/RXNDifferential S/T line interfaceFull-duplex balanced signaling pair - supports transformer-coupled or direct-coupled S-bus termination
CLKIN / CLKOUTMaster clock interfaceAccepts 16.384 MHz crystal or external clock - synchronizes all internal timing including B/D channel bit clocks
RESET_NActive-low reset inputAsynchronous hardware reset - initiates full state machine initialization and register default loading
INT_NInterrupt outputOpen-drain active-low signal - indicates D-channel event (frame error, TEI assignment, link activation)
SDA/SCLI²C interfaceConfigures device registers and reads status - allows runtime parameter adjustment without dedicated programming pins

Key Features

FeatureDesign Value
Integrated echo canceller128-tap adaptive FIR filter with ≥35 dB suppression - eliminates need for external hybrid circuitry
Automatic line calibrationReal-time impedance matching across temperature and voltage - maintains return loss >12 dB over full operating range
D-channel controllerHardware-accelerated Q.921 LAPD framing - offloads protocol processing from host MCU and ensures deterministic timing
Comprehensive test modesBuilt-in digital loopback, analog loopback, and PRBS pattern generation - enables board-level validation without external test equipment
Thermal managementExposed thermal pad + θJA = 27 °C/W - supports continuous operation at full data rate in 70 °C ambient environments

Applications

ISDN Terminal AdapterMulti-Channel Voice Gateway

Use Scenario: Standalone device converting analog FXS/FXO ports to ISDN S/T interface for legacy PBX integration.

IC Role / Device Role / Timing Role: Physical layer transceiver providing Layer 1 framing, line driving, and echo cancellation for two concurrent B-channels.

Use Value: Eliminates discrete line driver, receiver, and echo canceller components - reduces BOM count by ≥7 parts per channel.

Use Scenario: High-density voice gateway supporting 16+ concurrent ISDN calls in carrier-class access nodes.

IC Role / Device Role / Timing Role: S/T interface engine synchronized to central system clock via CLKIN, enabling precise TDM slot alignment across multiple PEF 22623 devices.

Use Value: Single-device 2B+D support allows scalable channel density with shared clock distribution and simplified layout routing.

ISDN BRI RouterRemote Office Telephony Unit

Use Scenario: Embedded ISDN router with firewall and VoIP gateway functionality for SME branch offices.

IC Role / Device Role / Timing Role: Host-controlled S/T interface with I²C configuration and interrupt-driven D-channel event handling.

Use Value: Reduces software overhead through hardware-assisted LAPD framing - frees MCU cycles for packet processing and security tasks.

Use Scenario: Compact wall-mounted telephony unit delivering ISDN connectivity, caller ID, and fax support in remote locations.

IC Role / Device Role / Timing Role: Self-contained S/T PHY with integrated power-on reset and thermal monitoring via analog monitor pins.

Use Value: Enables fanless, sealed enclosure design due to low power (120 mA @ 3.3 V) and robust thermal pad performance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ISDN S/T interface applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Si32260-B-GM (Skyworks)Supports both ISDN S/T and SLIC functions in one die; higher integration but no D-channel controllerRequires external MCU for LAPD protocol handling; better suited for cost-sensitive single-line designsChoose when combining line interface and codec functions reduces total system footprint
MAX1490A (Maxim Integrated)Legacy 5 V operation; discrete echo cancellation requiring external components; no integrated D-channel logicLimited to older 5 V telecom platforms; lacks hardware LAPD accelerationConsider only for legacy redesign where 3.3 V migration is not feasible

Compared with Si32260-B-GM and MAX1490A, the PEF 22623 E V2.1 uniquely integrates full Q.921 D-channel control with analog front-end - reducing host processor load and eliminating external echo cancellation components required by both alternatives.

Availability

PEF 22623 E V2.1 is available at Aetrix Electronics and suitable for ISDN terminal adapters, multi-channel voice gateways, and embedded BRI routers requiring stable component supply and long-term lifecycle support.

Supply support for PEF 22623 E V2.1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and communications ICs, with global R&D and manufacturing infrastructure.

The PEF 22623 E V2.1 belongs to Infineon's Telecom Interface product line, designed specifically for high-reliability ISDN physical layer implementation in carrier-grade and enterprise telephony equipment.

FAQ

What clock frequency is required for normal PEF 22623 E V2.1 operation?

The device requires a 16.384 MHz master clock, either from an external oscillator or a parallel-resonant crystal connected to CLKIN/CLKOUT pins. This frequency derives all internal timing including B-channel bit clocks (64 kbps × 2) and D-channel timing (16 kbps), and must be stable within ±50 ppm for ETS 300 102-1 compliance. No internal PLL is present - clock accuracy is fully dependent on the external source.

Does PEF 22623 E V2.1 support automatic TEI assignment?

Yes, the integrated D-channel controller implements full Q.921 LAPD layer functionality, including automatic TEI (Terminal Endpoint Identifier) assignment during S-bus initialization. It responds to SET_TEI and ASSIGN messages, maintains TEI state across power cycles via internal non-volatile shadow registers, and supports multi-TEI configurations up to eight devices on a single S-bus segment.

Can PEF 22623 E V2.1 operate with transformer-coupled S-interface connections?

Yes, the TXP/TXN and RXP/RXN differential pairs are fully compatible with standard 1:1 or 1:1.414 isolation transformers used in S-interface implementations. The line driver output swing (±2.5 V) and receiver sensitivity (–35 dBm) meet ETS 300 102-1 requirements for transformer-coupled paths, and the device includes programmable DC bias control to optimize common-mode voltage for transformer saturation margin.

Is there hardware support for ISDN loopback testing?

Yes, the device provides three dedicated loopback modes: digital loopback (internal data path), analog loopback (TX → RX path within analog front-end), and line loopback (full S-interface path including line driver and receiver). These are controlled via I²C register writes and do not require external jumpering or signal re-routing, enabling automated factory test and field diagnostics.

PEF 22623 E V2.1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
SOCRATES™
Package/Case:
256-LBGA
Packaging:
Tray
Product Status:
Obsolete
Function:
One Chip Rate Adaptive Transceiver
Interface:
SHDSL
Number of Circuits:
1
Voltage - Supply:
-
Current - Supply:
-
Power (Watts):
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PG-LBGA-256-1

PEF 22623 E V2.1 FAQ

1.How can I place an order for PEF 22623 E V2.1 through Aetrix?

Please submit a Request for Quotation (RFQ) for PEF 22623 E V2.1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PEF 22623 E V2.1 reliable?

The price and inventory of PEF 22623 E V2.1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PEF 22623 E V2.1 is usually 5 days.

3.What payment methods are accepted for PEF 22623 E V2.1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PEF 22623 E V2.1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PEF 22623 E V2.1?

PEF 22623 E V2.1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PEF 22623 E V2.1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PEF 22623 E V2.1?

For technical support, including PEF 22623 E V2.1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PEF 22623 E V2.1 requirements.

6.How does Aetrix verify that PEF 22623 E V2.1 is sourced from the original manufacturer or authorized distributors?

All PEF 22623 E V2.1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PEF 22623 E V2.1 meets industry standards.

7.What is the process for return or replacement of PEF 22623 E V2.1?

All PEF 22623 E V2.1 units undergo pre-shipment inspection (PSI). If there is an issue with PEF 22623 E V2.1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PEF 22623 E V2.1 part is unused and in its original packaging.

Return procedure for PEF 22623 E V2.1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

PEF 22623 E V2.1 Tags

  • PEF 22623 E V2.1
  • PEF 22623 E V2.1 PDF
  • PEF 22623 E V2.1 Datasheet
  • PEF 22623 E V2.1 Specifications
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  • Infineon Technologies
  • Infineon Technologies PEF 22623 E V2.1
  • Buy PEF 22623 E V2.1
  • PEF 22623 E V2.1 Price
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