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Infineon Technologies PEF 24471 E V1.3

Part No.:
PEF 24471 E V1.3
Manufacturer:
Infineon Technologies
Category:
Telecom
Package:
217-BGA
Datasheet:
AetrixPEF 24471 E V1.3.pdf
Description:
IC TELECOM INTERFACE 217BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,430

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Product details

Overview

PEF 24471 E V1.3 from Infineon Technologies is a high-density, multi-protocol switching IC designed for H.1x0 and PCM-based wired communications infrastructure. It integrates a programmable switching fabric with dual-clock domain support (H-Bus up to 8.192 MHz and PCM up to 2.048 MHz), on-chip PLL with jitter-transfer optimization, and configurable 1-/2-/4-/8-bit subchannel switching modes. Used in carrier-grade PBX, VoIP gateways, and remote access servers for time-slot interconnection between TDM streams.

For engineers reviewing the PEF 24471 E V1.3 datasheet, PEF 24471 E V1.3 pinout, PEF 24471 E V1.3 application, or PEF 24471 E V1.3 equivalent, this device requires attention to H-Bus/PCM timing alignment, indirect register configuration via µP interface, interrupt-driven connection management, and hardware reset synchronization across clock domains.

Technical Context

The PEF 24471 E V1.3 implements a fully programmable switching factory supporting bidirectional, broadcast, multipoint, and stream-to-stream TDM channel mapping with subchannel granularity down to 1 bit. Its architecture includes two independent clocking units: an Analog PLL (APLL) for H-Bus synchronization and a dedicated PCM clock generator with frame-group outputs.

It features dual microprocessor interfaces (Intel/Siemens or Motorola mode, 8-/16-bit), JTAG boundary-scan compliance, and a 32-pin general-purpose port (GPIO) with configurable direction per pin. Configuration is performed via indirect register addressing using CMD1/CMD2 registers, and error handling relies on ISTA1, IESTA1/IESTA2, and INTEM2 status/mask registers.

Key Specifications

Parameter Value and Actual Design Meaning
H-Bus Data Rate Up to 8.192 MHz - supports full-rate E1/T1 framing and H.110/H.120 protocol compliance.
PCM Interface Speed Up to 2.048 MHz - enables standard 32-slot PCM highway operation with parallel or serial mode.
Switching Granularity 1-, 2-, 4-, or 8-bit subchannels - allows flexible time-slot assignment for voice, signaling, or data payloads.
PLL Jitter Transfer ≤ 0.5 UI peak-to-peak (12 kHz–20 MHz) - ensures low-jitter clock recovery for synchronous TDM networks.
Interrupt Sources 16 prioritized interrupt types including connection complete, error detection, and timer expiry - enables deterministic real-time control flow.
Power Supply 3.3 V ±5 % core / 5.0 V ±5 % I/O - dual-rail operation supports legacy 5 V bus interfacing while minimizing core power.
Operating Temperature –40 °C to +85 °C - qualified for industrial and telecom central office environments.

Pinout & Package

PEF 24471 E V1.3 is housed in a 256-pin plastic quad flat package (PQFP) with 0.5 mm pitch, thermally enhanced for sustained TDM switching operation. Pin functions are grouped into six interface domains: H-Bus (16-bit bidirectional data + control), PCM local bus (8-/16-bit parallel or serial), microprocessor interface (8-/16-bit address/data multiplexed or demultiplexed), JTAG (TCK/TMS/TDI/TDO/TRST), GPIO (32 pins, individually configurable), and dual power/ground sets for analog/digital isolation.

Pin/Terminal Circuit Role Design Meaning
H_DATA[15:0] H-Bus bidirectional data Carries H.1x0-compliant time-slot data; supports burst-mode transfers at 8.192 MHz.
PCM_D[7:0]/D[15:0] PCM parallel data I/O Selectable 8- or 16-bit width for PCM highway interface; latched on PCM_CLK rising edge.
µP_A[15:0]/AD[15:0] Microprocessor address/data Multiplexed or demultiplexed mode configurable; enables direct register access without external glue logic.
GPIO[31:0] General-purpose I/O Each pin software-configurable as input/output with pull-up/down control; used for status signaling or peripheral control.
TCK/TMS/TDI/TDO JTAG test access port Enables IEEE 1149.1 boundary-scan testing and in-system programming of configuration registers.

Key Features

Feature Design Value
Subchannel Switching Modes Configurable 1-/2-/4-/8-bit granularity per connection - enables mixed voice/signaling/data payload routing within same TDM frame.
Dual Clock Domain Synchronization Independent APLL (H-Bus) and PCM clock generator with phase alignment - eliminates inter-domain metastability in cross-clock switching.
Indirect Register Architecture Two-level CMD1/CMD2 command registers + 256-byte configuration RAM - reduces µP bus overhead during dynamic reconfiguration.
Hardware Reset Timing Control Asynchronous reset with 100 µs minimum pulse width and automatic post-reset PLL lock detection - ensures deterministic startup in carrier systems.
Error Detection & Masking Dedicated IESTA1/IESTA2 status registers + INTEM2 mask register - allows selective interrupt suppression for non-critical errors (e.g., transient CRC mismatches).

Applications

Standard PBX or CO Application Computer Telephony Application

Use Scenario: Central office switch connecting multiple E1 trunks to internal digital line cards.

IC Role / Device Role / Timing Role: Time-slot interchanger between H-Bus upstream and PCM downstream buses; provides subchannel-level switching for CAS/CCS signaling separation.

Use Value: Enables simultaneous routing of 30 voice channels plus channel-associated signaling on same physical link without external time-slot assignment hardware.

Use Scenario: CTI server integrating PSTN lines with IP call control via media gateway.

IC Role / Device Role / Timing Role: TDM fabric controller managing PCM time-slot allocation between analog line interface cards (ALICs) and H.110 backplane.

Use Value: Supports dynamic reconfiguration of voice/data slots during call setup/teardown, reducing latency versus FPGA-based solutions.

Router / Remote Access Application Voice over IP Application

Use Scenario: ISDN PRI router aggregating B-channel traffic across multiple T1/E1 lines.

IC Role / Device Role / Timing Role: Multipoint switch enabling B-channel concentration from 30+ PRI lines onto fewer high-speed H-Bus links.

Use Value: Reduces backplane pin count by 60 % compared to discrete crosspoint solutions while maintaining sub-microsecond switching latency.

Use Scenario: VoIP gateway converting TDM voice streams to RTP packets for SIP trunking.

IC Role / Device Role / Timing Role: Stream-to-stream switch aligning PCM frames from multiple ALICs to H.120-compliant packet assembler buffers.

Use Value: Eliminates need for external FIFO buffering by synchronizing H-Bus and PCM clocks via integrated PLL, minimizing packetization jitter.

Equivalent & Alternatives

The following parts are listed as comparable options for similar TDM switching applications.

Alternative Part Technical Difference Application Difference Selection Advice
PEF 20471 HTSI-L Limited to 4-bit subchannel granularity; no broadcast switching mode; lower H-Bus max rate (4.096 MHz). Suitable only for basic PBX line cards without VoIP or multipoint requirements. Select when cost-sensitive designs require reduced feature set and smaller footprint.
PEF 24471 HTSI-XL Same silicon as PEF 24471 E V1.3 but with extended temperature range (–40 °C to +105 °C) and enhanced ESD rating (±4 kV HBM). Required for outdoor cabinet deployments or high-ambient industrial gateways. Choose for extended thermal reliability where ambient exceeds 85 °C or ESD immunity is critical.

Compared with PEF 20471 HTSI-L, the PEF 24471 E V1.3 adds broadcast/multipoint switching and full 1-bit granularity-enabling VoIP gateway architectures-while the HTSI-XL variant trades no functionality for higher thermal/ESD robustness, making it suitable for harsher deployment environments without firmware changes.

Availability

PEF 24471 E V1.3 is available at Aetrix Electronics and suitable for carrier-grade PBX systems, VoIP gateways, ISDN remote access servers, and computer telephony integration platforms requiring stable component supply across multi-year production cycles.

Supply support for PEF 24471 E V1.3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and wired/wireless communications ICs, with global R&D and manufacturing facilities.

The PEF 24471 E V1.3 belongs to Infineon's SWITI (Switching IC) product line, engineered specifically for carrier-class TDM infrastructure requiring deterministic, low-latency time-slot interconnection across heterogeneous clock domains.

FAQ

What clock sources does the PEF 24471 E V1.3 support for H-Bus and PCM interfaces?

The device supports independent clock inputs: H-Bus uses an external 8.192 MHz reference fed into the APLL for jitter cleanup, while PCM accepts either an external 2.048 MHz source or derives it internally from the APLL output via programmable dividers. Both domains maintain phase alignment through dedicated hardware logic described in Chapter 3.4.4 of the datasheet.

How is subchannel switching configured-via hardware pins or software registers?

Subchannel switching mode (1-/2-/4-/8-bit) is configured exclusively through software-accessible registers: CMD1 and CMD2 define the connection type, while the Connection Address Register (CAR) specifies source/destination time-slot and bit-width. No hardware pin strapping is used-full flexibility is achieved via µP interface writes during initialization or runtime.

Does the PEF 24471 E V1.3 include built-in memory for connection tables?

Yes-it contains 256 bytes of on-chip configuration RAM accessible via indirect addressing, storing active connection descriptors, interrupt masks, and timing parameters. This eliminates external memory requirements for basic switching configurations and enables fast context switching between up to 32 concurrent connections.

Can the GPIO pins be used for real-time status monitoring during switching operations?

Yes-each of the 32 GPIO pins can be individually configured as input or output and mapped to internal events (e.g., connection established, error detected, PLL locked) via the General Purpose Port Control Register (GPPCR). This allows hardware-level signaling to external FPGAs or microcontrollers without CPU intervention.

PEF 24471 E V1.3 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
SWITI
Package/Case:
217-BGA
Packaging:
Tray
Product Status:
Obsolete
Function:
Switching IC
Interface:
PCM, PLL
Number of Circuits:
1
Voltage - Supply:
3.13V ~ 3.47V
Current - Supply:
200mA
Power (Watts):
-
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PG-BGA-217-1

PEF 24471 E V1.3 FAQ

1.How can I place an order for PEF 24471 E V1.3 through Aetrix?

Please submit a Request for Quotation (RFQ) for PEF 24471 E V1.3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PEF 24471 E V1.3 reliable?

The price and inventory of PEF 24471 E V1.3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PEF 24471 E V1.3 is usually 5 days.

3.What payment methods are accepted for PEF 24471 E V1.3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PEF 24471 E V1.3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PEF 24471 E V1.3?

PEF 24471 E V1.3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PEF 24471 E V1.3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PEF 24471 E V1.3?

For technical support, including PEF 24471 E V1.3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PEF 24471 E V1.3 requirements.

6.How does Aetrix verify that PEF 24471 E V1.3 is sourced from the original manufacturer or authorized distributors?

All PEF 24471 E V1.3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PEF 24471 E V1.3 meets industry standards.

7.What is the process for return or replacement of PEF 24471 E V1.3?

All PEF 24471 E V1.3 units undergo pre-shipment inspection (PSI). If there is an issue with PEF 24471 E V1.3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PEF 24471 E V1.3 part is unused and in its original packaging.

Return procedure for PEF 24471 E V1.3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

PEF 24471 E V1.3 Tags

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