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Infineon Technologies PEF 24624 E V2.2-G
- Part No.:
- PEF 24624 E V2.2-G
- Manufacturer:
- Infineon Technologies
- Category:
- Telecom
- Package:
- 324-LBGA
- Datasheet:
-
PEF 24624 E V2.2-G.pdf
- Description:
- IC TELECOM INTERFACE LBGA-324
- Quantity:
- Payment:
- Shipping:
Inventory:3,370
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Product details
Overview
PEF 24624 E V2.2-G from Infineon Technologies is a 4-channel symmetric DSL (SHDSL) front-end transceiver IC compliant with ITU-T G.991.2 and ETSI TS 101524, supporting payload rates from 144 kbit/s to 6.392 Mbit/s in 8 kbit/s steps, with integrated DSP, microcontroller, analog front end, line driver, and memory in a single P-LBGA-324 package. It operates at 3.3 V and 1.8 V supplies, consumes ~500 mW per channel, and targets remote-powered SHDSL repeater and TDM infrastructure applications.
For engineers reviewing the PEF 24624 E V2.2-G datasheet, PEF 24624 E V2.2-G pinout, PEF 24624 E V2.2-G application, or PEF 24624 E V2.2-G equivalent, key selection criteria include G.SHDSL.bis compliance, M-pair support, tunable hybrid for loop adaptation, programmable framer clocking (1.544–16.384 MHz), and integrated HDLC controllers per channel for EOC handling.
Technical Context
The PEF 24624 E V2.2-G implements a full-duplex TC-PAM line coding scheme with adaptive PSD shaping and ITU-T G.991.2-compliant line probing. Its architecture integrates four independent SHDSL PHY blocks, each with dedicated AFE, hybrid, line driver, and DSP engine, enabling simultaneous operation across four copper pairs.
It supports three operational modes-Line Termination Unit (LTU), Network Termination Unit (NTU), and Regenerator Unit (COT/RT)-and provides universal TDM interface compatibility with E1/T1/J1 framing, plus bit-serial host interface for microcontroller control and configuration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| G.991.2 Compliance | Fully compliant with ITU-T G.991.2 (2004) and ETSI TS 101524, enabling interoperable SHDSL.bis deployment in carrier-grade access networks. |
| Data Rate Range | 144 kbit/s to 6.392 Mbit/s in 8 kbit/s granularity-exceeds baseline G.SHDSL.bis specification and supports fractional E1/T1 provisioning. |
| Power Supply | Two rails: 3.3 V for I/O and digital logic, 1.8 V for core DSP/microcontroller-enables low-noise analog performance and efficient power domain partitioning. |
| Power per Channel | Approximately 500 mW-enables thermal feasibility in compact, fanless remote repeater enclosures with up to four active SHDSL links. |
| Operating Temp | −40°C to +85°C-qualified for uncontrolled outdoor cabinet environments in wireless backhaul and DSLAM extension deployments. |
| Package | P-LBGA-324 (19 mm × 19 mm)-supports high-density board layout with controlled impedance routing for differential line driver outputs and TDM bus signals. |
Pinout & Package
P-LBGA-324 (19 mm × 19 mm, 0.8 mm pitch) with exposed thermal pad; requires 10-layer PCB stack-up for signal integrity on high-speed TDM clocks and differential line driver outputs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO_3V3 | I/O Power Supply | Supplies 3.3 V to digital I/O banks including TDM interface, serial host interface, and GPIOs-must be decoupled with ≥10 µF + 100 nF per bank. |
| VDDCORE_1V8 | DSP/MCU Core Supply | Provides 1.8 V to DSP engine, microcontroller, and internal memory-requires ultra-low-noise regulation and tight voltage tolerance (±3%). |
| TXP/TXN (per channel) | Differential Line Driver Output | High-swing, current-mode outputs driving twisted-pair copper; each pair supports up to 18 kft reach with M-pair bonding and tunable hybrid calibration. |
| RXP/RXN (per channel) | Differential Line Receiver Input | Low-noise, adaptive equalized inputs supporting −40 dBm to −15 dBm input levels; integrated automatic gain control (AGC) and echo cancellation. |
| TDM_CLK / TDM_FS / TDM_DATA | Universal TDM Interface | Supports master/slave operation at 1.544/2.048/2.312/4.096/8.192/16.384 MHz; configurable for E1, T1, J1, or custom PCM frame formats. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated 4-channel SHDSL PHY | Eliminates need for four discrete transceivers, external memory, and separate framer ASIC-reduces BOM count by >35 components per port. |
| M-pair functionality | Enables bonding of up to two copper pairs per logical SHDSL link, doubling effective reach or data rate without protocol changes. |
| Tunable hybrid circuit | Digitally adjustable impedance matching allows real-time optimization for varying loop lengths and cable gauges-improves SNR margin by up to 6 dB. |
| Programmable framer with multi-clock support | Single hardware platform supports E1 (2.048 MHz), T1 (1.544 MHz), and extended-rate clocks (up to 16.384 MHz)-avoids redesign for regional or legacy network integration. |
| Integrated HDLC controller per channel | Offloads EOC (Embedded Operations Channel) processing from host MCU-enables in-band management, fault reporting, and performance monitoring without external protocol engine. |
Applications
| ISDN Primary Rate Replacement | SHDSL Repeater/Regenerator |
|---|---|
Use Scenario: Migration of legacy ISDN PRI (30B+D) services over existing copper plant using SHDSL bonding. IC Role / Device Role / Timing Role: Acts as line termination unit (LTU) converting TDM E1 frames to G.SHDSL.bis physical layer signals with embedded OAM. Use Value: Maintains full 2.048 MHz E1 timing transparency while extending reach beyond 3 km without fiber overlay. | Use Scenario: Mid-span regeneration of degraded SHDSL signals in rural broadband access loops exceeding 12 km. IC Role / Device Role / Timing Role: Functions as regenerator unit (COT/RT) performing full waveform reshaping, clock recovery, and error correction per channel. Use Value: Restores signal integrity without requiring upstream/downstream protocol renegotiation-enables plug-and-play repeater deployment. |
| Digital Loop Carrier (DLC) Systems | Wireless Infrastructure Backhaul |
Use Scenario: Extending central office switching capacity to remote terminals via copper-based DLC trunking. IC Role / Device Role / Timing Role: Serves as network termination unit (NTU) interfacing with DLC multiplexer's TDM bus and conditioning copper distribution lines. Use Value: Supports fractional E1 allocation and dynamic bandwidth assignment-optimizes copper resource utilization across multiple subscriber groups. | Use Scenario: Providing point-to-point backhaul between macrocell base stations and aggregation nodes over legacy copper. IC Role / Device Role / Timing Role: Operates as LTU delivering synchronized 16.384 MHz clock to BTS timing modules while transporting CPRI-like payload over SHDSL. Use Value: Enables precise phase alignment (<1 µs jitter) required for LTE-A CoMP and 5G NR TDD synchronization without GPS dependency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar symmetric DSL front-end applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| PEF 22624 E | 2-channel version with identical architecture, pinout, and software compatibility; same power per channel (~500 mW) but lower total power draw. | Targeted at dual-port repeaters or cost-sensitive DLC nodes where four channels are unnecessary. | Select when board space or thermal budget limits require fewer active ports without sacrificing feature set or firmware reuse. |
| PEF 21624 E | Single-channel variant sharing core IP, register map, and clocking architecture; occupies same P-LBGA-324 footprint but uses only half the I/O pins. | Suitable for STU-R NTU installations or evaluation platforms requiring minimal channel count and simplified layout. | Choose for prototyping, low-volume NTU designs, or applications needing field-upgradable channel expansion via multi-SOC topology. |
Compared with PEF 22624 E and PEF 21624 E, the PEF 24624 E V2.2-G delivers maximum port density per package-critical for space-constrained remote repeaters-while preserving full software and pin compatibility across the SDFE family, enabling scalable hardware design with unified firmware maintenance.
Availability
PEF 24624 E V2.2-G is available at Aetrix Electronics and suitable for SHDSL repeater/regenerator systems, Digital Loop Carrier (DLC) node expansions, and wireless infrastructure backhaul requiring stable component supply across industrial temperature ranges and long product lifecycles.
Supply support for PEF 24624 E V2.2-G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and wired/wireless communication ICs, with global R&D centers and ISO/TS 16949-certified manufacturing.
The SDFE (Symmetric DSL Front End) product line was designed specifically for carrier-class copper access infrastructure-delivering high-reach, low-power, standards-compliant SHDSL transceivers optimized for remote repeater, DLC, and TDM replacement applications.
FAQ
What is the maximum supported loop length for PEF 24624 E V2.2-G in single-pair mode?
The PEF 24624 E V2.2-G achieves up to 18,000 ft (≈5.5 km) reach in single-pair mode under ITU-T G.991.2 conditions with 26 AWG copper and standard PSD mask. With M-pair bonding (two pairs), reach extends to 24,000 ft (≈7.3 km) while maintaining full 6.392 Mbit/s payload capacity.
Does PEF 24624 E V2.2-G support both E1 and T1 framing natively?
Yes-it supports native E1 (2.048 MHz), T1 (1.544 MHz), and J1 (1.544 MHz) framing via its programmable TDM framer. Clock inputs at 1.544, 2.048, 2.312, 4.096, 8.192, and 16.384 MHz are accepted, and frame structure (timeslot mapping, CAS/SAC, CRC type) is fully configurable through register writes.
Is external memory required for PEF 24624 E V2.2-G operation?
No external memory is required. The device integrates 128-byte FIFOs for transmit and receive per channel, on-chip program RAM, and boot ROM containing SHDSL initialization code and G.991.2 line probing sequences. External flash may be used for custom firmware but is optional.
How is thermal management handled in the P-LBGA-324 package?
The P-LBGA-324 package includes an exposed thermal pad on the underside, which must be soldered to a solid copper thermal plane on the PCB. Recommended layout uses ≥4 thermal vias (0.3 mm diameter) under the pad connected to inner-layer ground planes, achieving ≤25°C/W junction-to-board thermal resistance in typical 4-layer boards.
PEF 24624 E V2.2-G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- SOCRATES™
- Package/Case:
- 324-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Function:
- Symmetrical DSL Front End (SDFE)
- Interface:
- DSL, SHDSL, TDM
- Number of Circuits:
- 4
- Voltage - Supply:
- -
- Current - Supply:
- -
- Power (Watts):
- 500 mW
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- P-LBGA-324
PEF 24624 E V2.2-G FAQ
1.How can I place an order for PEF 24624 E V2.2-G through Aetrix?
Please submit a Request for Quotation (RFQ) for PEF 24624 E V2.2-G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PEF 24624 E V2.2-G reliable?
The price and inventory of PEF 24624 E V2.2-G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PEF 24624 E V2.2-G is usually 5 days.
3.What payment methods are accepted for PEF 24624 E V2.2-G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PEF 24624 E V2.2-G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PEF 24624 E V2.2-G?
PEF 24624 E V2.2-G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PEF 24624 E V2.2-G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PEF 24624 E V2.2-G?
For technical support, including PEF 24624 E V2.2-G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PEF 24624 E V2.2-G requirements.
6.How does Aetrix verify that PEF 24624 E V2.2-G is sourced from the original manufacturer or authorized distributors?
All PEF 24624 E V2.2-G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PEF 24624 E V2.2-G meets industry standards.
7.What is the process for return or replacement of PEF 24624 E V2.2-G?
All PEF 24624 E V2.2-G units undergo pre-shipment inspection (PSI). If there is an issue with PEF 24624 E V2.2-G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PEF 24624 E V2.2-G part is unused and in its original packaging.
Return procedure for PEF 24624 E V2.2-G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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