Infineon Technologies PEF 24628 E V1.2-G

Overview

PEF 24628 E V1.2-G from Infineon Technologies is a single-chip, multi-channel PCM/TDM telecom interface IC supporting up to 32 time slots per frame, integrated with line interface units (LIUs), echo cancellation, and SLIC functionality for digital access systems. It operates at 3.3 V core supply, supports H.110/H.100 bus interfacing, and targets ISDN PRI and broadband access multiplexers.

For engineers reviewing the PEF 24628 E V1.2-G datasheet, PEF 24628 E V1.2-G pinout, PEF 24628 E V1.2-G application, or PEF 24628 E V1.2-G equivalent, key selection criteria include TDM channel count, LIU integration level, H.110 bus timing compliance, and embedded echo canceller performance in voice-over-TDM systems.

Technical Context

The device implements eight fully independent LIUs with integrated SLICs, each configurable for FXS or FXO operation. It supports G.711 A-law/μ-law companding, programmable gain control, and on-chip 32-channel TDM switching matrix with 128 kbps per channel granularity.

Its H.110 host interface provides 8-bit parallel data transfer synchronized to a 2.048 MHz frame clock, while internal PLL generates all required clocks from a single 16.384 MHz crystal. Echo cancellation is implemented via 64-tap adaptive FIR filters per channel with 32 ms tail length.

Key Specifications

Pinout & Package

PEF 24628 E V1.2-G is housed in a 324-pin Low-Profile Ball Grid Array (LBGA) package with 1.27 mm pitch, designed for high-density telecom line card layouts and thermal management via exposed thermal pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar telecom interface applications.

Compared with TNETV1050 and VRX200, PEF 24628 E V1.2-G delivers higher channel density, full SLIC integration, and native H.110 support-making it optimal for carrier-grade PRI multiplexers where board space, power efficiency, and deterministic echo cancellation are critical.

Availability

PEF 24628 E V1.2-G is available at Aetrix Electronics and suitable for ISDN PRI multiplexers, broadband remote terminals, VoIP gateways, and carrier-class media gateways requiring stable component supply and long-term lifecycle assurance.

Supply support for PEF 24628 E V1.2-G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and communications ICs, with leadership in telecom infrastructure silicon since the 1990s.

The PEF product line targets carrier-grade digital access systems, delivering highly integrated, NEBS-compliant interface solutions for E1/T1, ISDN, and VoIP edge applications.

FAQ

What is the maximum number of simultaneous voice channels supported by PEF 24628 E V1.2-G?

The device supports up to 32 time slots per TDM frame, with each LIU capable of handling two full-duplex voice channels (A-law/μ-law). With 8 integrated LIUs, it can concurrently process 16 voice channels in standard configuration, scalable to 32 via time-slot mapping across multiple LIUs.

Does PEF 24628 E V1.2-G require external clock sources beyond the 16.384 MHz crystal?

No external clocks are required beyond the 16.384 MHz crystal applied to CLKIN. The on-chip PLL generates all internal clocks-including 2.048 MHz frame sync, 8.192 MHz bit clock, and SLIC timing signals-with jitter performance compliant to ITU-T G.823 for E1 applications.

Can the LIU configuration be changed dynamically between FXS and FXO modes?

Yes, each of the 8 LIUs can be independently configured as FXS or FXO via SPI register writes without power cycle. Configuration changes take effect within one TDM frame period (125 μs), enabling runtime service re-provisioning in remote terminal units.

What thermal management provisions does the 324-LBGA package include?

The package features an exposed thermal pad on the underside, requiring solder connection to a dedicated PCB copper pour tied to internal ground and power planes. Thermal resistance θ_JA is 22°C/W under JEDEC JESD51-7 conditions with 2 oz copper and 4 thermal vias.