My Inquiry
My Account
Diodes Incorporated PI2DBS16212AZREX
- Part No.:
- PI2DBS16212AZREX
- Manufacturer:
- Diodes Incorporated
- Category:
- Analog Switches - Special Purpose
- Package:
- 24-WFQFN Exposed Pad
- Datasheet:
-
PI2DBS16212AZREX.pdf
- Description:
- PCIE SWITCH W-QFN2525-24 T&R 3.5
- Quantity:
- Payment:
- Shipping:
Inventory:29,780
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PI2DBS16212AZREX from Diodes Incorporated is a 1.8V, 20 Gbps, 2-channel 2:1 differential mux/demux switch in a 24-contact TQFN package. It supports bidirectional high-speed serial protocols including USB3.2 Gen2 (10 Gbps), Thunderbolt 4 (40 Gbps aggregate), and SAS3.0 (12 Gbps), with -0.94 dB insertion loss at 5 GHz and -3 dB bandwidth of 14 GHz.
For engineers reviewing the PI2DBS16212AZREX datasheet, PI2DBS16212AZREX pinout, PI2DBS16212AZREX application, or PI2DBS16212AZREX equivalent, key selection criteria include differential channel count (2), data rate support (20 Gbps), supply voltage tolerance (1.8 V ±10%), industrial temperature range (-40°C to +85°C), and low bit-to-bit skew (3 ps).
Technical Context
The PI2DBS16212AZREX implements a passive, CMOS-based 2:1 differential mux/demux architecture with no internal termination or active equalization. Its signal path is optimized for minimal parasitic capacitance and controlled impedance matching across all four differential pairs (A0±, A1±, B0±, B1±), enabling transparent switching of NRZ-encoded high-speed serial data.
SEL pin controls channel selection between two differential input pairs (A and B) to a common differential output pair (C), supporting both multiplexing and demultiplexing modes. Power-down (PD) pin enables low-leakage shutdown with 200 µA typical quiescent current, preserving signal integrity during idle states.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Data Rate | 20 Gbps - supports full-rate USB3.2 Gen2x2, Thunderbolt 4 lane aggregation, and SAS3.0 without retiming |
| -3 dB Bandwidth | 14 GHz - ensures minimal amplitude distortion for 10+ Gbaud NRZ signals |
| Insertion Loss | -0.94 dB @ 5 GHz - maintains >90% signal power transfer at PCIe4.0 fundamental frequency |
| Bit-to-Bit Skew | 3 ps - preserves eye opening for multi-lane interfaces like USB3.2 and Thunderbolt |
| Supply Voltage | 1.8 V ±10% - compatible with standard I/O domains of modern SoCs and controllers |
| Operating Temp | -40°C to +85°C - qualified for industrial and extended commercial environments |
| Channel-to-Channel Skew | 20 ps - enables reliable timing alignment across differential pairs in multi-lane routing |
Pinout & Package
Package: 24-contact, Very Very Thin Quad Flat No-Lead (TQFN), 3.5 mm × 5.5 mm, 0.4 mm pitch, RoHS-compliant and halogen-free ("Green").
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0+ | Differential Input Pair 0, Positive | Primary high-speed data input for Channel A (e.g., USB3.2 TX0+) |
| A0- | Differential Input Pair 0, Negative | Complementary input to A0+, forms balanced signal path with 100 Ω differential impedance |
| A1+ | Differential Input Pair 1, Positive | Secondary high-speed data input for Channel A (e.g., USB3.2 RX0+) |
| A1- | Differential Input Pair 1, Negative | Complementary input to A1+, supports bidirectional operation on same channel |
| B0+ | Differential Input Pair 0, Positive | Alternate high-speed data input for Channel B (e.g., Thunderbolt Lane 0+) |
| B0- | Differential Input Pair 0, Negative | Complementary input to B0+, enables independent source selection |
| B1+ | Differential Input Pair 1, Positive | Alternate high-speed data input for Channel B (e.g., Thunderbolt Lane 1+) |
| B1- | Differential Input Pair 1, Negative | Complementary input to B1+, supports dual-lane switching |
| C0+ | Differential Output Pair 0, Positive | Common output for selected channel (A or B), routed to host controller or connector |
| C0- | Differential Output Pair 0, Negative | Complementary output to C0+, maintains signal integrity through shared path |
| C1+ | Differential Output Pair 1, Positive | Second common output for bidirectional demux mode (e.g., upstream/downstream split) |
| C1- | Differential Output Pair 1, Negative | Complementary output to C1-, completes 2:1 de-mux configuration |
| SEL | Channel Select Control | Logic-level input selecting between A (SEL = 0) and B (SEL = 1); TTL/CMOS compatible |
| PD | Power-Down Enable | Active-low control disabling internal bias circuitry to reduce leakage and crosstalk during standby |
Key Features
| Feature | Design Value |
|---|---|
| Passive Mux/Demux Architecture | No DC blocking capacitors or active amplification required; preserves signal DC balance and jitter profile |
| Low Insertion Loss Profile | -0.94 dB @ 5 GHz, -1.16 dB @ 8 GHz - minimizes receiver sensitivity degradation in long trace applications |
| Controlled Skew Performance | 3 ps bit-to-bit skew and 20 ps channel-to-channel skew - enables tight timing closure in multi-lane SerDes links |
| Industrial Temperature Support | Operates reliably from -40°C to +85°C without derating - suitable for fanless embedded systems and edge compute platforms |
| RoHS 3 & Halogen-Free Compliance | Fully compliant with EU Directive 2015/863/EU and Diodes' "Green" definition (<900 ppm Br/Cl, <1000 ppm Sb) |
Applications
| USB3.2 Gen2 Hub Interface | Thunderbolt 4 Docking Multiplexer |
|---|---|
Use Scenario: Switching dual-lane USB3.2 Gen2 (10 Gbps per lane) between host CPU and peripheral ports in compact docking stations. IC Role / Device Role / Timing Role: 2:1 differential mux/demux providing seamless lane reconfiguration without protocol-aware logic or retiming. Use Value: Maintains signal integrity up to 20 Gbps aggregate while reducing PCB layer count via single shared high-speed routing path. | Use Scenario: Aggregating two Thunderbolt 4 lanes (20 Gbps each) from upstream port to downstream peripherals in modular docking solutions. IC Role / Device Role / Timing Role: Bidirectional passive switch enabling dynamic allocation of high-speed lanes between display, storage, and network functions. Use Value: Enables hardware-level lane sharing with <3 ps skew, eliminating need for costly retimers or FPGA-based switching logic. |
| SAS3.0 Enterprise Storage Backplane | PCIe4.0 x2 Signal Routing |
Use Scenario: Multiplexing SAS3.0 (12 Gbps) signals between dual host controllers and shared storage enclosures in RAID subsystems. IC Role / Device Role / Timing Role: Low-loss, low-skew analog switch supporting hot-plug-aware failover without interrupting link training. Use Value: Achieves -1.25 dB insertion loss at 10 GHz, preserving eye height margin required for SAS3.0 compliance testing. | Use Scenario: Routing PCIe4.0 x2 differential pairs between SoC and NVMe SSD or FPGA in space-constrained edge AI modules. IC Role / Device Role / Timing Role: Transparent signal path with 14 GHz bandwidth, avoiding jitter accumulation or equalization dependency. Use Value: Supports full PCIe4.0 data rate (16 GT/s) with <20 ps channel-to-channel skew, ensuring robust link negotiation and L0s/L1 entry. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed differential mux/demux applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TS3DV642RHBR | 64-channel, 3.3V supply, lower bandwidth (8.5 GHz), higher insertion loss (-1.7 dB @ 5 GHz) | Targeted at HDMI 2.0 and DisplayPort 1.4, not optimized for 20 Gbps serial protocols | Select when cost-sensitive, lower-speed video routing is primary requirement |
| MAX4945ETE+ | Single 2:1 mux, 3.3V supply, 10 Gbps max, integrated 50Ω termination | Designed for SATA and PCIe3.0, lacks dual-channel simultaneous operation and 20 Gbps capability | Prefer for legacy SATA/PCIe3.0 designs where integrated termination simplifies layout |
Compared with TS3DV642RHBR and MAX4945ETE+, the PI2DBS16212AZREX delivers 2× higher bandwidth (14 GHz vs ≤8.5 GHz), 30% lower insertion loss at 5 GHz, and native support for 20 Gbps protocols-making it uniquely suited for next-generation USB, Thunderbolt, and SAS infrastructure where signal fidelity and lane density are critical.
Availability
PI2DBS16212AZREX is available at Aetrix Electronics and suitable for USB3.2 Gen2 hub design, Thunderbolt 4 docking station development, and SAS3.0 enterprise storage backplane integration requiring stable component supply and consistent lead-time performance.
Supply support for PI2DBS16212AZREX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design and manufacturing operations across Asia and the Americas.
The PI2DBS series targets high-speed interface signal routing, specifically addressing the need for low-loss, low-skew passive switching in next-generation serial data standards including USB, Thunderbolt, PCIe, and SAS.
FAQ
Does PI2DBS16212AZREX require external termination resistors?
No. The device is designed for use with externally terminated 100 Ω differential transmission lines. It does not integrate on-die termination and relies on system-level 100 Ω matching at source and load ends to maintain return loss better than -12 dB at 10 GHz.
Can PI2DBS16212AZREX operate with 3.3V logic control signals?
Yes. SEL and PD pins accept 1.8 V logic thresholds but are overvoltage tolerant up to 3.6 V, allowing direct interfacing with 3.3 V GPIOs without level-shifting circuitry while maintaining guaranteed switching behavior.
What is the maximum recommended trace length when using PI2DBS16212AZREX in a 20 Gbps link?
Based on measured -1.25 dB insertion loss at 10 GHz and industry-standard channel models, the device supports up to 8 inches of FR-4 microstrip (5-mil trace, 4-mil spacing) before requiring active equalization, assuming proper impedance control and minimal via transitions.
Is PI2DBS16212AZREX qualified for automotive AEC-Q100 applications?
No. This part is specified for industrial temperature range (-40°C to +85°C) and is not AEC-Q100 qualified. Diodes Incorporated offers automotive-grade variants under separate part numbers with PPAP documentation and IATF 16949 manufacturing certification.
PI2DBS16212AZREX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 24-WFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- -
- Multiplexer/Demultiplexer Circuit:
- 2:1
- Switch Circuit:
- SPST
- Number of Channels:
- 2
- On-State Resistance (Max):
- -
- Voltage - Supply, Single (V+):
- 1.8V
- Voltage - Supply, Dual (V±):
- -
- -3db Bandwidth:
- 14GHz
- Features:
- -
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TQFN (2.5x2.5)
PI2DBS16212AZREX FAQ
1.How can I place an order for PI2DBS16212AZREX through Aetrix?
Please submit a Request for Quotation (RFQ) for PI2DBS16212AZREX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PI2DBS16212AZREX reliable?
The price and inventory of PI2DBS16212AZREX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PI2DBS16212AZREX is usually 5 days.
3.What payment methods are accepted for PI2DBS16212AZREX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PI2DBS16212AZREX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PI2DBS16212AZREX?
PI2DBS16212AZREX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PI2DBS16212AZREX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PI2DBS16212AZREX?
For technical support, including PI2DBS16212AZREX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PI2DBS16212AZREX requirements.
6.How does Aetrix verify that PI2DBS16212AZREX is sourced from the original manufacturer or authorized distributors?
All PI2DBS16212AZREX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PI2DBS16212AZREX meets industry standards.
7.What is the process for return or replacement of PI2DBS16212AZREX?
All PI2DBS16212AZREX units undergo pre-shipment inspection (PSI). If there is an issue with PI2DBS16212AZREX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PI2DBS16212AZREX part is unused and in its original packaging.
Return procedure for PI2DBS16212AZREX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PI2DBS16212AZREX Tags
-
TS3USB221ARSER
Texas Instruments
-
TS3USB221AQRSERQ1
Texas Instruments
-
NX3DV221GM,115
NXP USA Inc.
-
NX3DV2567GU,115
NXP USA Inc.
-
TS3USB221RSER
Texas Instruments
-
TS3USB221ERSER
Texas Instruments
-
TC7USB40MU,LF(S2E
Toshiba Semiconductor and Storage
-
TS3USB30EDGSR
Texas Instruments
-
PI3USB221AZUAEX
Diodes Incorporated
-
FSUSB42UMX
onsemi
-
CBTL01023GM,115
NXP USA Inc.
-
TS3USB30ERSWR
Texas Instruments
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
