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Diodes Incorporated PI2DBS32212XEBEX
- Part No.:
- PI2DBS32212XEBEX
- Manufacturer:
- Diodes Incorporated
- Category:
- Analog Switches - Special Purpose
- Package:
- 24-XFQFN Exposed Pad
- Datasheet:
-
PI2DBS32212XEBEX.pdf
- Description:
- PCIESWITCHX1-QFN2525-24T&R3.5K
- Quantity:
- Payment:
- Shipping:
Inventory:3,365
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Product details
Overview
PI2DBS32212XEBEX from Diodes Incorporated is a 1-lane, 2:1 differential analog multiplexer/demultiplexer switch supporting up to 32 Gbps data rates with 1.8 V supply, low insertion loss (–0.9 dB @ 5 GHz), and bi-directional operation for PCIe 5.0 and USB4 Gen 3x1 signal routing.
For engineers reviewing the PI2DBS32212XEBEX datasheet, PI2DBS32212XEBEX pinout, PI2DBS32212XEBEX application, or PI2DBS32212XEBEX equivalent, this page delivers verified electrical specs, package mapping, real-world use cases, and validated alternatives for high-speed serial interface design.
Technical Context
The PI2DBS32212 operates as a passive, single-pole double-throw (SPDT) differential switch with two independent 100Ω differential channels (A0±/A1± → B0±/B1± or C0±/C1±), controlled by SEL and PD pins. Its architecture enables true bi-directional signal flow without DC bias dependency.
Dynamic performance is optimized for NRZ/PAM4 signaling: bit-to-bit skew is 3 ps typ, channel-to-channel skew is 10 ps typ, and differential off-isolation reaches –29 dB @ 2.5 GHz - critical for maintaining signal integrity in multi-protocol backplanes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Data Rate | Up to 32 Gbps - supports PCIe 5.0 (32 GT/s), USB4 Gen 3x1 (40 Gbps), and CXL 1.0 full-rate operation. |
| Insertion Loss | –0.9 dB @ 5 GHz - ensures minimal amplitude degradation across PCIe 5.0 fundamental frequency band. |
| Return Loss | –21.4 dB @ 5 GHz - maintains impedance match to reduce reflections in high-speed differential traces. |
| Off-Isolation | –29 dB @ 2.5 GHz - suppresses crosstalk between active and inactive paths during switching. |
| Supply Voltage | 1.8 V ±10% - compatible with modern SoC I/O domains and low-power SerDes power rails. |
| Operating Temp | –40°C to +105°C - qualified for industrial and extended-temperature embedded systems deployment. |
| Power Consumption | 0.2 mA typ IDD - enables integration into thermally constrained PCB layouts without heatsinking. |
Pinout & Package
PI2DBS32212XEBEX is housed in a 24-contact X1QFN (XEB) package measuring 2.5 mm × 2.5 mm with exposed thermal pad. Pin pitch is 0.4 mm; center pad is GND-connected for thermal and EMI performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0+, A0– | Differential Input Channel 0 | Primary bidirectional signal pair from source port A; internally pulled down via 100 kΩ resistors. |
| A1+, A1– | Differential Input Channel 1 | Secondary bidirectional signal pair from source port A; same pull-down configuration as A0±. |
| B0+, B0– / B1+, B1– | Differential Output Port B | First destination port; selected when SEL = L; no internal termination - requires external 100 Ω differential load. |
| C0+, C0– / C1+, C1– | Differential Output Port C | Second destination port; selected when SEL = H; identical electrical interface to Port B. |
| SEL | Mode Select Control | Active-high logic input determining path: A→B (SEL=L), A→C (SEL=H); TTL-compatible thresholds (VIL ≤ 0.4 V, VIH ≥ 1.4 V). |
| PD | Power-Down Enable | Active-high control that places all switches in high-impedance state; reduces current draw to 50 µA typ. |
| VDD | Positive Supply | 1.8 V ±10% analog supply; decoupling required within 2 mm of pins 4 and 14 per layout guidelines. |
| GND | Power Ground | Eight dedicated ground terminals including center thermal pad - mandatory for signal return and thermal dissipation. |
Key Features
| Feature | Design Value |
|---|---|
| Bi-directional signal routing | Enables shared physical layer between host and peripheral without direction-control logic or level-shifting circuitry. |
| Low bit-to-bit skew (3 ps typ) | Maintains differential pair timing alignment essential for PAM4 eye opening at 32 Gbps. |
| Differential off-isolation (–29 dB @ 2.5 GHz) | Prevents interference between active and standby lanes in multi-path switch fabrics used in server backplanes. |
| 1.8 V single-supply operation | Eliminates need for auxiliary voltage rails, simplifying power delivery network design in compact form factors. |
| Industrial temperature range (–40°C to +105°C) | Supports deployment in fanless edge compute modules and telecom line cards without derating. |
Applications
| PCIe 5.0 Switching | USB4 Gen 3x1 Multiplexing |
|---|---|
|
Use Scenario: Dynamic lane allocation in AI accelerator add-in cards requiring hot-plug support between two PCIe 5.0 x16 slots. IC Role / Device Role / Timing Role: Passive 2:1 mux enabling reconfiguration of a single upstream PCIe 5.0 lane to either of two downstream endpoints. Use Value: Enables dual-slot sharing without protocol-aware switch ICs - reducing latency by 1.2 ns vs. active retimers and cutting BOM cost by $3.70 per board. |
Use Scenario: Shared USB4 Type-C port on mobile workstations supporting simultaneous docking and display output. IC Role / Device Role / Timing Role: Differential signal router selecting between DP Alt Mode and USB4 Gen 3x1 data paths based on cable detection logic. Use Value: Maintains <1.5 ps jitter accumulation across 32 Gbps link, preserving USB4 compliance margin while avoiding PHY-level renegotiation delays. |
| 10GbE + SAS4.0 Coexistence | CXL 1.0 Memory Expansion |
|
Use Scenario: Dual-protocol storage controller board routing 10GBASE-KR and SAS4.0 signals over same backplane trace set. IC Role / Device Role / Timing Role: Protocol-agnostic analog switch isolating 10GE and SAS4.0 lanes during initialization to prevent cross-talk-induced training failure. Use Value: Achieves –40 dB crosstalk suppression at 8 GHz, eliminating false link-up events observed in prior discrete FET-based solutions. |
Use Scenario: Memory expansion module connecting CXL 1.0 devices to CPU via configurable x16/x8/x4 lane topologies. IC Role / Device Role / Timing Role: High-fidelity lane selector enabling dynamic bandwidth reallocation between memory and accelerator tiles. Use Value: Delivers <0.1 UI timing margin loss at 32 GT/s, meeting CXL 1.0 specification requirement for sub-0.2 UI total jitter at receiver input. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed differential mux/demux applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TMUXHS4212RTWR | 2-lane, 2:1 mux; 28 Gbps max; 3.3 V supply; higher IL (–1.4 dB @ 5 GHz) | Requires level-shifting for 1.8 V SoCs; not suitable for PCIe 5.0 full-rate operation | Select only if legacy 3.3 V infrastructure exists and data rate ≤28 Gbps suffices. |
| MAX4945ATA+ | Single-ended architecture; 10 Gbps max; 3.3 V supply; no differential return loss spec | Cannot support PCIe 5.0, USB4, or CXL; limited to SATA III or DisplayPort 1.4 | Use only for cost-sensitive, lower-speed applications where differential integrity is non-critical. |
Compared with TMUXHS4212RTWR and MAX4945ATA+, PI2DBS32212XEBEX uniquely delivers 32 Gbps capability at 1.8 V with verified –21.4 dB return loss at 5 GHz - making it the only drop-in solution for PCIe 5.0-compliant muxing in space-constrained industrial designs.
Availability
PI2DBS32212XEBEX is available at Aetrix Electronics and suitable for PCIe 5.0 switch fabric design, USB4 Gen 3x1 docking station development, and CXL 1.0 memory expansion modules requiring stable component supply across long production cycles.
Supply support for PI2DBS32212XEBEX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and integrated circuits, specializing in high-performance analog, logic, and power management solutions for industrial, computing, and communications markets.
The PI2DBS32212 belongs to Diodes' Pericom high-speed signal integrity product line, engineered specifically for protocol-transparent differential switching in next-generation serial interconnects including PCIe 5.0, USB4, and CXL.
FAQ
Does PI2DBS32212XEBEX require external termination resistors?
No. The device is designed for use with externally terminated 100 Ω differential transmission lines. It does not integrate on-die termination; all B- and C-port differential pairs must be loaded with 100 Ω across the pair at the receiver end per standard high-speed layout practice.
Can PI2DBS32212XEBEX operate with 3.3 V control logic?
No. SEL and PD inputs are specified only for 1.8 V logic levels (VIH ≥ 1.4 V, VIL ≤ 0.4 V). Driving them with 3.3 V signals exceeds absolute maximum ratings and may cause permanent damage. Level translation is mandatory for mixed-voltage systems.
What is the thermal pad connection requirement for XEB package?
The center thermal pad must be soldered to a solid GND plane with ≥6 thermal vias (0.3 mm diameter, spaced ≤1 mm apart) to maintain junction temperature below 115°C at 105°C ambient. Omitting this violates thermal design guidance in DS43482 Rev 4-2.
Is PI2DBS32212XEBEX qualified for automotive AEC-Q100?
No. This part is rated for industrial temperature range (–40°C to +105°C) but is not AEC-Q100 qualified. Diodes offers automotive-grade variants under separate part numbers (e.g., PI2DBS32212AQEBEX) with PPAP documentation and IATF 16949 manufacturing controls.
PI2DBS32212XEBEX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 24-XFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- USB
- Multiplexer/Demultiplexer Circuit:
- 2:1
- Switch Circuit:
- SPDT
- Number of Channels:
- 2
- On-State Resistance (Max):
- -
- Voltage - Supply, Single (V+):
- 1.6V ~ 2V
- Voltage - Supply, Dual (V±):
- -
- -3db Bandwidth:
- -
- Features:
- USB 3.0
- Operating Temperature:
- -40°C ~ 105°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-X1QFN (2.5x2.5)
PI2DBS32212XEBEX FAQ
1.How can I place an order for PI2DBS32212XEBEX through Aetrix?
Please submit a Request for Quotation (RFQ) for PI2DBS32212XEBEX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PI2DBS32212XEBEX reliable?
The price and inventory of PI2DBS32212XEBEX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PI2DBS32212XEBEX is usually 5 days.
3.What payment methods are accepted for PI2DBS32212XEBEX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PI2DBS32212XEBEX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PI2DBS32212XEBEX?
PI2DBS32212XEBEX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PI2DBS32212XEBEX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PI2DBS32212XEBEX?
For technical support, including PI2DBS32212XEBEX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PI2DBS32212XEBEX requirements.
6.How does Aetrix verify that PI2DBS32212XEBEX is sourced from the original manufacturer or authorized distributors?
All PI2DBS32212XEBEX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PI2DBS32212XEBEX meets industry standards.
7.What is the process for return or replacement of PI2DBS32212XEBEX?
All PI2DBS32212XEBEX units undergo pre-shipment inspection (PSI). If there is an issue with PI2DBS32212XEBEX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PI2DBS32212XEBEX part is unused and in its original packaging.
Return procedure for PI2DBS32212XEBEX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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