Diodes Incorporated PI2EQX638XUBEX
- Part No.:
- PI2EQX638XUBEX
- Manufacturer:
- Diodes Incorporated
- Category:
- Signal Buffers, Repeaters, Splitters
- Package:
- 18-XFQFN Exposed Pad
- Datasheet:
-
PI2EQX638XUBEX.pdf
- Description:
- USB3 EQX X2-QFN2020-18 T&R 3.5K
- Quantity:
- Payment:

- Shipping:

Inventory:2,339
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PI2EQX638XUBEX from Diodes Incorporated is a 5.0 Gbps, 2-port USB 3.0 Mux/DeMux ReDriver™ with programmable equalization (3–9 dB), output swing (1.0–1.1 V), and de-emphasis (0 to –3.5 dB), operating from a single 1.8 V supply and consuming only 14 mA typical in U1 mode. It supports independent bidirectional signal conditioning between application processor and Type-C connector sides for mobile device interconnects.
For engineers reviewing the PI2EQX638XUBEX datasheet, PI2EQX638XUBEX pinout, PI2EQX638XUBEX application, or PI2EQX638XUBEX equivalent, key selection criteria include differential CML I/O compatibility (100 Ω), adaptive power management across U1/U2/U3/no-connection states, and per-channel input-level detection with squelch - all critical for USB 3.0 signal integrity in space-constrained portable designs.
Technical Context
The PI2EQX638XUBEX implements two fully independent differential signal paths: one from TX_AP+/– to RX_CON1+/– (Channel 1) and another to RX_CON2+/– (Channel 2), each supporting 100 Ω CML I/O with selectable input termination (50 Ω to VbiasRx or 67 kΩ to GND) and output termination (50 Ω bias, 2 kΩ to GND, or Hi-Z). Mode selection is controlled by the 3-level SEL pin.
Its adaptive power management operates without decoding USB link commands; instead, it uses real-time electrical idle detection, internal timers, and state machines to enter U1 (14 mA), U2/U3 (0.3 mA), unplug (0.3 mA), or power-down (0.1 mA) states - enabling battery life optimization in smartphones and tablets.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Data Rate | 5.0 Gbps - supports full USB 3.0 SuperSpeed signaling with compliance test pattern operation |
| Supply Voltage | 1.8 V ±0.1 V - single-supply operation compatible with mobile SoC I/O domains |
| Power Consumption | 0.1 mA typ in power-down - enables ultra-low standby current when both channels are inactive |
| Differential Impedance | 70–120 Ω - matches standard 100 Ω differential PCB trace routing requirements |
| Equalization Range | 3–9 dB - compensates channel loss up to ~15 dB at 2.5 GHz for FR4 traces |
| De-emphasis | 0 to –3.5 dB - reduces high-frequency overshoot and ISI in long or lossy interconnects |
| Input Sensitivity | 50–150 mVppd in U0/U1 - ensures reliable receiver detect under low-swing USB 3.0 conditions |
Pinout & Package
PI2EQX638XUBEX is housed in an 18-pin X2QFN (XUB) package measuring 2 mm × 2 mm with 0.4 mm pitch and exposed thermal pad (HGND). The package supports high-density layout in mobile form factors and provides low-inductance grounding via the center pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2 | TX_AP−, TX_AP+ | Differential CML input from application processor side; 50 Ω or 67 kΩ to GND selectable termination |
| 4, 5 | RX_AP−, RX_AP+ | Differential CML output to application processor side; 50 Ω bias, 2 kΩ to GND, or Hi-Z selectable |
| 6, 9 | CON_SET1, CON_SET2 | 3-level control inputs setting DE2/OS2/EQ2 on connector side (internal 150 kΩ pull-up/down) |
| 7, 8, 13, 14 | RX_CON1+, RX_CON1−, RX_CON2+, RX_CON2− | Differential CML inputs from Type-C connector side; independent channel enable via SEL |
| 10, 11, 16, 17 | TX_CON1+, TX_CON1−, TX_CON2+, TX_CON2− | Differential CML outputs to Type-C connector side; path selected by SEL logic state |
| 12 | VDD | 1.8 V power supply pin with ±0.1 V tolerance; decoupling required per layout guidelines |
| 3, 19 | GND, HGND | Signal and thermal ground pins; HGND is exposed pad requiring solder connection for thermal dissipation |
| 15 | AP_SET | 3-level input configuring DE1/OS1/EQ1 on application processor side (internal 150 kΩ pull-up/down) |
| 18 | SEL | 3-level mode select: High = Channel 1 active, Low = Channel 2 active, Float = both powered down |
Key Features
| Feature | Design Value |
|---|---|
| Per-channel input-level detection & squelch | Enables automatic output disable when no valid signal is present on xI+/–, preventing false link training |
| Programmable equalization (3–9 dB) | Compensates frequency-dependent loss in PCB traces or flex cables without external components |
| Adaptive U1/U2/U3 power state entry | Reduces current to 14 mA (U1), 0.3 mA (U2/U3), or 0.1 mA (power-down) based on real-time electrical idle detection |
| Independent dual-path architecture | Allows simultaneous or selective routing between AP and either of two Type-C ports - e.g., dock + peripheral |
| 100 Ω differential CML I/O interface | Ensures seamless interoperability with standard USB 3.0 PHYs and controllers without level-shifting circuitry |
Applications
| Smartphone Docking Station | Tablet Dual-Port Hub |
|---|---|
Use Scenario: A smartphone connects via USB Type-C to a docking station that routes video (DP Alt Mode), USB data, and charging simultaneously. IC Role / Device Role / Timing Role: ReDriver™ conditionally regenerates USB 3.0 SuperSpeed lanes between phone SoC and hub controller while maintaining LFPS handshake integrity. Use Value: Enables robust 5 Gbps data transfer over extended internal flex cables (≥10 cm) with <0.5 UI total jitter, meeting USB-IF compliance. |
Use Scenario: A tablet integrates two Type-C ports - one for charging/peripheral attachment, another for display output - sharing a single USB 3.0 controller. IC Role / Device Role / Timing Role: 2:1 Mux selects active data path; 1:2 DeMux routes outbound traffic to correct port based on SEL state. Use Value: Eliminates need for dual USB PHYs; saves BOM cost and PCB area while preserving signal integrity across both paths. |
| USB-C Multi-function Printer | Mobile SSD Enclosure |
Use Scenario: A compact all-in-one printer supports USB 3.0 host-mode scanning and peripheral-mode printing via shared Type-C uplink. IC Role / Device Role / Timing Role: Bidirectional ReDriver™ manages signal regeneration in both directions, adapting equalization per link direction and cable length. Use Value: Maintains <150 mVppd minimum input sensitivity during U2/U3 sleep states, ensuring fast resume from low-power modes. |
Use Scenario: An external SSD enclosure uses USB 3.0 to deliver sustained 400 MB/s read/write performance from NAND flash to host. IC Role / Device Role / Timing Role: Signal conditioner compensates for insertion loss in short (<5 cm) but high-loss FPC cables between controller and connector. Use Value: Achieves >21 dB differential return loss (50 MHz–1.25 GHz) to suppress reflections and preserve eye opening at 5 Gbps. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar USB 3.0 signal conditioning applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| PI2EQX538XUBEX | Single-port variant; identical equalization, swing, and power management features but no Mux/DeMux capability | Suitable only for point-to-point USB 3.0 extension, not multi-port routing | Select when only one fixed data path exists and board space allows simpler layout |
| TS3USB30E | Passive analog switch; no equalization, no adaptive power states, 800 Mbps max data rate | Limited to USB 2.0 or low-speed USB 3.0 applications; cannot regenerate degraded signals | Choose only for cost-sensitive USB 2.0 switching where signal integrity is not compromised |
Compared with PI2EQX538XUBEX, the PI2EQX638XUBEX adds dual-channel Mux/DeMux functionality essential for flexible port routing; versus TS3USB30E, it delivers full 5 Gbps active signal regeneration with adaptive power control - making it uniquely suited for battery-powered USB 3.0 systems requiring both performance and energy efficiency.
Availability
PI2EQX638XUBEX is available at Aetrix Electronics and suitable for smartphone docking stations, tablet dual-port hubs, USB-C multifunction printers, and mobile SSD enclosures requiring stable component supply and long-term lifecycle support.
Supply support for PI2EQX638XUBEX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and integrated circuits, specializing in high-performance analog, logic, and protection devices for consumer, computing, and industrial markets.
The PI2EQX638XUBEX belongs to Diodes' ReDriver™ family, engineered specifically to extend USB 3.0 reach and reliability in space-constrained, power-sensitive mobile platforms - addressing signal integrity degradation in flex cables, stacked PCBs, and compact connectors.
FAQ
What is the function of the SEL pin in PI2EQX638XUBEX?
The SEL pin is a 3-level input that controls operational mode: logic high activates Channel 1 (AP ↔ CON1), logic low activates Channel 2 (AP ↔ CON2), and floating (Hi-Z) places both channels into power-down state (0.1 mA typical). Internal 150 kΩ pull-up and pull-down resistors ensure defined default behavior without external biasing.
Does PI2EQX638XUBEX support USB Power Delivery (PD) communication?
No - the PI2EQX638XUBEX is a physical-layer signal conditioner for USB 3.0 SuperSpeed data only. It does not process or forward USB PD BMC signaling on the CC line, nor does it interact with PD policy engines. PD negotiation must occur separately via dedicated CC logic outside this device.
How does the adaptive power management determine U1 vs. U2/U3 entry?
The device monitors differential signal activity and electrical idle duration using internal comparators and timers. Entry into U1 occurs after 1.3 ms of electrical idle; U2/U3 entry follows after 330 ms. No USB protocol stack involvement is required - decisions are based solely on analog link-state detection.
Can AP_SET and CON_SET pins be tied directly to VDD or GND?
Yes - AP_SET and CON_SET pins accept direct VDD (logic 1), GND (logic 0), or open-circuit (mid-level "float") to configure equalization, output swing, and de-emphasis settings. Internal 150 kΩ pull-up and pull-down resistors ensure stable mid-level interpretation without external components.
PI2EQX638XUBEX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- ReDriver™
- Package/Case:
- 18-XFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Buffer, ReDriver
- Applications:
- USB 3.0
- Input:
- CML
- Output:
- CML
- Data Rate (Max):
- -
- Number of Channels:
- 2
- Delay Time:
- -
- Signal Conditioning:
- Input Equalization, Output De-Emphasis
- Capacitance - Input:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Current - Supply:
- -
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 18-X2QFN (2x2)
PI2EQX638XUBEX FAQ
1.How can I place an order for PI2EQX638XUBEX through Aetrix?
Please submit a Request for Quotation (RFQ) for PI2EQX638XUBEX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PI2EQX638XUBEX reliable?
The price and inventory of PI2EQX638XUBEX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PI2EQX638XUBEX is usually 5 days.
3.What payment methods are accepted for PI2EQX638XUBEX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PI2EQX638XUBEX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PI2EQX638XUBEX?
PI2EQX638XUBEX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PI2EQX638XUBEX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PI2EQX638XUBEX?
For technical support, including PI2EQX638XUBEX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PI2EQX638XUBEX requirements.
6.How does Aetrix verify that PI2EQX638XUBEX is sourced from the original manufacturer or authorized distributors?
All PI2EQX638XUBEX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PI2EQX638XUBEX meets industry standards.
7.What is the process for return or replacement of PI2EQX638XUBEX?
All PI2EQX638XUBEX units undergo pre-shipment inspection (PSI). If there is an issue with PI2EQX638XUBEX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PI2EQX638XUBEX part is unused and in its original packaging.
Return procedure for PI2EQX638XUBEX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PI2EQX638XUBEX Tags

-
PCA9509GM,125
NXP USA Inc.

-
PCA9617ADPJ
NXP USA Inc.
-
TCA9509DGKR
Texas Instruments
-
PCA9617ATPZ
NXP USA Inc.

-
PCA9517ADP,118
NXP USA Inc.

-
PCA9515ADP,118
NXP USA Inc.

-
PCA9515AD,118
NXP USA Inc.

-
PCA9517DP,118
NXP USA Inc.

-
TUSB211ARWBR
Texas Instruments

-
PCA9517AD,118
NXP USA Inc.
-
PCA9517ATP,147
NXP USA Inc.
-
P82B96PWR
Texas Instruments
Tech Hub
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

