Diodes Incorporated PI2PCIE2212ZHEX

Overview

PI2PCIE2212ZHEX from Pericom Semiconductor is a 4-to-2 differential, bi-directional PCI Express® 2.0 1-lane 2:1 multiplexer/demultiplexer switch with 5.0 Gbps data rate support, 7 ps bit-to-bit skew, and -38 dB crosstalk at 2.5 GHz, deployed in PCIe lane switching between host and dual endpoint devices.

For engineers reviewing the PI2PCIE2212ZHEX datasheet, PI2PCIE2212ZHEX pinout, PI2PCIE2212ZHEX application, or PI2PCIE2212ZHEX equivalent, key selection criteria include differential insertion loss (-2.0 dB at 2.5 GHz), off-isolation (-25 dB), VDD operating range (1.5–1.8 V ±10%), SEL logic thresholds, and TQFN-28 thermal and routing constraints.

Technical Context

This device implements a single-control, bidirectional differential analog switch architecture optimized for PCIe 2.0 signaling integrity. It supports two independent differential channel paths (A→B/C) with shared SEL input, enabling dynamic reconfiguration of PCIe lane routing without protocol layer intervention.

The switch operates across full PCIe 2.0 frequency spectrum (up to 2.5 GHz fundamental, 4.0 GHz with 3 dB IL limit), maintains sub-20 ps channel-to-channel skew, and meets PCIe jitter and return loss requirements via matched internal trace lengths and low-capacitance switch FETs.

Key Specifications

Pinout & Package

Package: 28-contact Very Thin Quad Flat No-Lead (TQFN), 3.5 × 5.5 mm, ZH footprint, exposed thermal pad, RoHS-compliant and Pb-free (E suffix).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar PCIe 2.0 signal switching applications.

Compared with TS3USB221ERGER and PI3DBS16412ZHEX, PI2PCIE2212ZHEX delivers optimal balance of PCIe 2.0 compliance, minimal pin count (1 SEL), compact 28-pin TQFN, and proven 5.0 Gbps performance-making it ideal for cost- and space-constrained PCIe lane sharing without overengineering.

Availability

PI2PCIE2212ZHEX is available at Aetrix Electronics and suitable for PCIe lane sharing, hot-pluggable peripheral switching, embedded GPU multiplexing, and automated test equipment signal routing requiring stable component supply and long-term industrial availability.

Supply support for PI2PCIE2212ZHEX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Pericom Semiconductor was a fabless provider of high-speed interface and signal integrity solutions, acquired by Diodes Incorporated in 2016; known for PCIe, USB, HDMI, and Ethernet signal switches and repeaters.

The PI2PCIE series targets PCIe 2.0 infrastructure applications-including motherboard lane expansion, docking station arbitration, and embedded SoC peripheral consolidation-with emphasis on low skew, high isolation, and drop-in compatibility with standard PCIe layout rules.

FAQ

What is the maximum recommended trace length for differential pairs routed through PI2PCIE2212ZHEX?

Pericom's design guidelines specify ≤15 mm total trace length (source-to-switch-to-load) for each differential pair to maintain PCIe 2.0 eye margin. This accounts for 0.25 UI budget allocation to the switch's 7 ps skew and -2.0 dB insertion loss at 2.5 GHz, assuming FR-4 substrate and 100 Ω controlled impedance.

Does PI2PCIE2212ZHEX require external termination resistors on its differential I/O ports?

No. The device is designed for direct connection to 100 Ω differential PCB traces without external termination. Its internal switch FETs present matched 100 Ω on-resistance and are characterized with 50 Ω source/load terminations in test circuits-external resistors would degrade insertion loss and increase reflections.

Can SEL be driven directly from a 3.3 V GPIO without level shifting?

No. SEL input thresholds are referenced to VDD (1.5–1.8 V), with VIH = 0.65×VDD (max 1.17 V) and VIL = 0.35×VDD (min 0.525 V). A 3.3 V GPIO exceeds absolute max rating (–0.5 V to VDD) and will damage the pin; a level shifter or resistor divider is mandatory.

Is the exposed thermal pad on the ZH package required to be soldered to PCB ground?

Yes. The exposed pad is electrically connected to internal GND planes and serves as primary thermal and electrical reference. Pericom's mechanical drawing PD-2034 specifies soldering the pad to a minimum 10 mm² copper pour with ≥4 thermal vias (0.3 mm diameter) to inner ground layers to meet 0.5 W power dissipation and ensure signal return path integrity.