Diodes Incorporated PI2PCIE2412ZHEX

Overview

PI2PCIE2412ZHEX from Pericom Semiconductor is a 4-differential-channel, 2:1 PCIe Gen2-compliant mux/demux switch supporting 5.0 Gbps data rates with ≤7 ps bit-to-bit skew, −23 dB crosstalk at 3 GHz, and 1.5–1.8 V ±10% supply operation. It routes two full PCIe Gen2 lanes between Port A and either Port B or Port C under SEL control, enabling dynamic lane reconfiguration in server backplanes and high-speed I/O expansion cards.

For engineers reviewing the PI2PCIE2412ZHEX datasheet, PI2PCIE2412ZHEX pinout, PI2PCIE2412ZHEX application, or PI2PCIE2412ZHEX equivalent, key selection criteria include differential insertion loss (−2 dB @ 3 GHz), channel-to-channel skew (≤35 ps), off-isolation (−23 dB @ 3 GHz), and TQFN-42 (ZH42) package compatibility with PCIe Gen2 layout constraints.

Technical Context

This device implements a passive analog switch architecture optimized for PCIe Gen2 differential signaling, with matched trace-length routing on-die to minimize inter-pair and intra-pair timing skew. Its impedance-matched signal path ensures negligible attenuation-verified via PCI-SIG compliance eye diagrams at 5 Gbps with 16-inch test cards.

The SEL-controlled 2:1 switching logic operates across all four differential channels simultaneously, with enable/disable times of 0.5–8.0 ns and rail-to-rail input voltage tolerance (−0.5 V to VDD). Power delivery uses eight VDD pins and ten GND pins-including center thermal pad-to maintain signal integrity under 350 µA quiescent current.

Key Specifications

Pinout & Package

PI2PCIE2412ZHEX is housed in a 42-contact, Pb-free, green Thin Fine Pitch Quad Flat No-Lead (TQFN) package designated ZH42, featuring an exposed thermal pad for enhanced power dissipation and signal reference stability.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar PCIe Gen2 mux/demux applications.

Compared with TS3L501ECPG4 and PI3CH401LEX, PI2PCIE2412ZHEX uniquely delivers integrated 4-lane differential switching with PCIe Gen2–validated skew, loss, and isolation-enabling single-package lane consolidation where alternatives require multi-device layouts or fail signal integrity requirements.

Availability

PI2PCIE2412ZHEX is available at Aetrix Electronics and suitable for server backplanes, PCIe slot-sharing systems, embedded vision I/O expansion, and test equipment interposer modules requiring stable component supply and long-term lifecycle support.

Supply support for PI2PCIE2412ZHEX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Pericom Semiconductor was a fabless provider of high-speed interface and timing solutions, acquired by Diodes Incorporated in 2016; its PCIe switch portfolio continues under Diodes' signal-integrity product line.

The PI2PCIE series targets high-bandwidth computing infrastructure, specifically addressing PCIe Gen2 lane multiplexing challenges in space-constrained, thermally demanding environments like 1U/2U servers and modular workstations.

FAQ

Does PI2PCIE2412ZHEX support PCIe Gen3 or higher data rates?

No. The device is characterized and validated exclusively for PCIe Gen2 (5.0 Gbps) operation. Its −2 dB insertion loss at 3 GHz and −23 dB crosstalk meet Gen2 specifications but fall short of Gen3's 8 GT/s requirements, which demand <−3 dB loss at 4 GHz and tighter skew budgets.

Can SEL be driven directly from a 3.3 V GPIO without level shifting?

No. SEL accepts only 0 V to VDD logic levels. With VDD = 1.8 V, applying 3.3 V exceeds the absolute maximum input voltage rating (−0.5 V to VDD), risking latch-up or permanent damage. A 1.8 V-compatible controller or resistive divider is mandatory.

Is the center thermal pad electrically connected to GND internally?

Yes. The exposed pad is internally tied to the substrate ground plane and must be soldered to a PCB GND pour with ≥6 thermal vias to ensure proper thermal dissipation and signal reference stability, as specified in PD-2035 Rev D packaging documentation.

What is the recommended PCB stack-up for minimizing skew between A0+/A0− and B0+/B0− traces?

Use symmetric microstrip layers with identical dielectric thickness and copper weight for all differential pairs. Maintain 100 Ω differential impedance, avoid stubs or vias in active paths, and route A0+/A0− and B0+/B0− on the same layer with matched lengths within ±5 mil to preserve the device's ≤35 ps channel-to-channel skew specification.