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Diodes Incorporated PI2SSD3212NCEX

Part No.:
PI2SSD3212NCEX
Manufacturer:
Diodes Incorporated
Category:
Analog Switches, Multiplexers, Demultiplexers
Package:
48-TFBGA
Datasheet:
AetrixPI2SSD3212NCEX.pdf
Description:
IC SWITCH SPDT X 14 8OHM 48TFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,197

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Product details

Overview

PI2SSD3212NCEX from Diodes Incorporated is a 14-bit, 2:1/1:2 bidirectional SSD switch supporting DDR3 memory bus operation up to 1866 Mbps (5 Gbps), with 1.35V/1.5V/1.8V supply compatibility, SSTL_135/SSTL_15/SSTL_18 signaling, and 3.3 GHz 3dB bandwidth. It enables high-speed flash bank selection in NVDIMM and SSD memory subsystems.

For engineers reviewing the PI2SSD3212NCEX datasheet, PI2SSD3212NCEX pinout, PI2SSD3212NCEX application, or PI2SSD3212NCEX equivalent, key selection criteria include its 8 Ω typical RON, 20 ps max bit-to-bit skew, -25 dB crosstalk (f < 2 GHz), flow-through pinout for signal integrity, and dual-package availability (52-pin TQFN / 48-pin TFBGA).

Technical Context

The PI2SSD3212NCEX implements a single-pole double-throw (SPDT) topology per channel across all 14 bits, controlled by a CMOS-compatible SEL input and global enable. Its architecture supports simultaneous switching of all channels between two ports or full high-impedance disconnect.

Designed specifically for ONFI DDR3 and SSD memory interconnects, it maintains signal fidelity via low insertion loss (-0.7 dB, 0–1 GHz), high off-isolation (-28 dB, 0–1 GHz), and matched propagation delay across lanes-critical for timing-critical DDR3 1866 Mbps and NVDIMM data paths.

Key Specifications

ParameterValue and Actual Design Meaning
Supply Voltage1.35 V / 1.5 V / 1.8 V - supports multi-voltage DDR memory interfaces without level translation
3dB Bandwidth3.3 GHz - ensures full signal integrity for DDR3 1866 Mbps (933 MHz clock) data eye compliance
RON (typ)8 Ω - minimizes voltage drop and timing distortion across 14-bit parallel data paths
Bit-to-bit Skew (max)20 ps - preserves setup/hold timing margins in high-speed parallel memory buses
Crosstalk (typ)-25 dB (f < 2 GHz) - prevents coupling-induced errors between adjacent SSD/DDR data lines
Off-isolation-28 dB (0–1 GHz) - suppresses leakage between unselected flash banks during active read/write
Operating Current (typ)110 µA at 1.35 V - enables low-power standby in always-on SSD controller subsystems

Pinout & Package

PI2SSD3212NCEX is available in two RoHS-compliant, lead-free packages: 52-pin TQFN (3.5 × 9 × 0.4 mm) with exposed thermal pad, and 48-pin TFBGA (4.5 × 4.5 × 0.8 mm). The TQFN variant features flow-through pinout for minimized trace length and impedance discontinuity.

Pin/TerminalCircuit RoleDesign Meaning
VDDPower Supply1.35/1.5/1.8 V core supply for switch logic and analog path biasing
GNDGround ReferenceCommon return for signal integrity and ESD discharge path
SELChannel Select InputCMOS-level control determining port A (SEL = L) or port B (SEL = H) connection
OE#Global Output EnableActive-low input forcing all 14 channels into high-Z state when deasserted
I/O[13:0]Bidirectional Data Lane14-bit parallel interface supporting SSTL_135/15/18 signaling in both directions
PORT_A[13:0], PORT_B[13:0]Switched I/O PortsTwo independent 14-bit ports routed to I/O[13:0] based on SEL/OE# state

Key Features

FeatureDesign Value
Flow-through pinout optionEnables straight PCB trace routing between memory controller and flash banks, reducing stubs and reflections
Low RON (8 Ω typ)Maintains signal amplitude and edge rate across full 14-bit bus under 1.35 V operation
High off-isolation (-28 dB)Prevents signal bleed between active and idle flash banks in multi-bank SSD architectures
20 ps max bit-to-bit skewGuarantees simultaneous sampling of all 14 bits at DDR3 1866 Mbps receiver inputs
ESD robustness (2 kV HBM)Protects against handling damage during NVDIMM module assembly and field replacement

Applications

NVDIMM Memory ModuleSSD Controller Interconnect

Use Scenario: Dual-port flash bank selection in non-volatile dual in-line memory modules with DRAM + NAND persistence.

IC Role / Device Role / Timing Role: 14-bit 2:1 mux/demux enabling dynamic mapping of DRAM traffic to redundant NAND banks with sub-ns timing alignment.

Use Value: Enables atomic write persistence and fast recovery via hardware-controlled flash bank isolation without FPGA glue logic.

Use Scenario: High-speed multiplexing between SSD controller and multiple NAND die in enterprise SSDs.

IC Role / Device Role / Timing Role: Bidirectional signal switch managing shared data/address/control lines between controller and parallel NAND packages.

Use Value: Reduces PCB layer count and eliminates need for discrete bus switches while maintaining DDR3 1866 Mbps timing compliance.

DDR3 Memory Bus ExpansionONFI Compliant Flash Subsystem

Use Scenario: Adding secondary DDR3 memory channel to SoC-based storage accelerators with limited package ballout.

IC Role / Device Role / Timing Role: Signal-routing switch extending effective DDR3 bus width using time-multiplexed access to two memory ranks.

Use Value: Doubles usable memory bandwidth without increasing SoC pin count or requiring DDR PHY reconfiguration.

Use Scenario: ONFI 2.3/3.0 compliant flash array with multi-die addressing in embedded eMMC/UFS replacement modules.

IC Role / Device Role / Timing Role: Low-skew, low-loss 2:1 switch enabling shared command/data bus between host controller and dual NAND packages.

Use Value: Supports ONFI toggle-mode timing with 20 ps skew margin and -25 dB crosstalk suppression at 200 MHz clock rates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed memory bus switching applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
PI3CH401QE8-bit, 1.8 V only, 2.5 GHz bandwidth, no flow-through pinoutLimited to narrower buses; lacks DDR3 1866 Mbps support and multi-voltage flexibilityUse only where 8-bit width and fixed 1.8 V supply suffice
TS3DV642RHBR64-channel, 3.3 V supply, 2.5 GHz bandwidth, higher RON (12 Ω)Requires level-shifting for DDR3 SSTL interfaces; higher insertion loss impacts 1866 Mbps eye openingPreferable only in 3.3 V industrial systems with relaxed skew requirements

Compared with PI3CH401QE and TS3DV642RHBR, PI2SSD3212NCEX uniquely delivers 14-bit width, 1.35–1.8 V operation, 3.3 GHz bandwidth, and flow-through layout support-making it the only qualified solution for DDR3 1866 Mbps NVDIMM and ONFI SSD bus switching without signal degradation.

Availability

PI2SSD3212NCEX is available at Aetrix Electronics and suitable for NVDIMM modules, enterprise SSD controllers, DDR3 memory expansion subsystems, and ONFI flash array designs requiring stable component supply and long-term lifecycle assurance.

Supply support for PI2SSD3212NCEX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal ICs for power management, signal integrity, and connectivity applications.

The PI2SSD3212 belongs to Diodes' high-speed signal-switching product line, engineered specifically for DDR, ONFI, and SSD memory interconnects where low skew, multi-voltage support, and signal fidelity are critical.

FAQ

Is PI2SSD3212NCEX compatible with DDR4 memory interfaces?

No. PI2SSD3212NCEX is specified for DDR2/DDR3 signaling standards (SSTL_135/SSTL_15/SSTL_18) and validated up to 1866 Mbps. It does not meet DDR4's VDDQ = 1.2 V requirement or 2400+ Mbps timing specifications. DDR4 requires dedicated switches such as PI2EQX512 or SN74CBT3245A variants.

Does PI2SSD3212NCEX require external termination resistors?

No. The device integrates on-die termination matching SSTL standards and operates with standard 50 Ω PCB trace impedance. External termination is unnecessary unless system-level simulations indicate specific stub resonance-verified via Diodes' AN-30002 application note.

Can OE# and SEL be driven directly from a 3.3 V GPIO?

Yes, but only with current-limiting series resistance. SEL and OE# accept 1.35–1.8 V logic thresholds; driving them with 3.3 V violates absolute maximum ratings. A 10 kΩ series resistor plus local 1.8 V LDO decoupling is required to avoid latch-up or accelerated wear-out.

What is the thermal performance of the 52-pin TQFN package?

The 52-pin TQFN (3.5 × 9 × 0.4 mm) has a θJA of 42 °C/W and θJC of 5.2 °C/W when mounted on a 4-layer board with 1-in² 2-oz copper paddle. At 110 µA operating current and ambient ≤ 70 °C, junction temperature remains below 85 °C-well within rated limits for continuous NVDIMM operation.

PI2SSD3212NCEX Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Switch Circuit:
SPDT
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
14
On-State Resistance (Max):
8Ohm (Typ)
Channel-to-Channel Matching (ΔRon):
-
Voltage - Supply, Single (V+):
1.35V, 1.5V, 1.8V
Voltage - Supply, Dual (V±):
-
Switch Time (Ton, Toff) (Max):
-
-3db Bandwidth:
3.3GHz
Charge Injection:
-
Channel Capacitance (CS(off), CD(off)):
-
Current - Leakage (IS(off)) (Max):
-
Crosstalk:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-TFBGA (4.5x4.5)

PI2SSD3212NCEX FAQ

1.How can I place an order for PI2SSD3212NCEX through Aetrix?

Please submit a Request for Quotation (RFQ) for PI2SSD3212NCEX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PI2SSD3212NCEX reliable?

The price and inventory of PI2SSD3212NCEX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PI2SSD3212NCEX is usually 5 days.

3.What payment methods are accepted for PI2SSD3212NCEX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PI2SSD3212NCEX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PI2SSD3212NCEX?

PI2SSD3212NCEX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PI2SSD3212NCEX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PI2SSD3212NCEX?

For technical support, including PI2SSD3212NCEX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PI2SSD3212NCEX requirements.

6.How does Aetrix verify that PI2SSD3212NCEX is sourced from the original manufacturer or authorized distributors?

All PI2SSD3212NCEX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PI2SSD3212NCEX meets industry standards.

7.What is the process for return or replacement of PI2SSD3212NCEX?

All PI2SSD3212NCEX units undergo pre-shipment inspection (PSI). If there is an issue with PI2SSD3212NCEX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PI2SSD3212NCEX part is unused and in its original packaging.

Return procedure for PI2SSD3212NCEX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

PI2SSD3212NCEX Tags

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