Diodes Incorporated PI3A114-AZLEX

Overview

PI3A114-AZLEX from Diodes Incorporated is a low-voltage, bidirectional 4:1 analog multiplexer/demultiplexer with CMOS technology for signal routing in portable audio and data interfaces. It features 1.8V–3.3V supply operation, 5Ω typical on-resistance at 3.3V, -95dB off-isolation at 100kHz, rail-to-rail signal range, and near-zero propagation delay (0.25ns). It enables 1.8V logic control of 3.3V analog channels in space-constrained mobile applications.

For engineers reviewing the PI3A114-AZLEX datasheet, PI3A114-AZLEX pinout, PI3A114-AZLEX application, or PI3A114-AZLEX equivalent, key selection criteria include low-swing control compatibility, channel crosstalk rejection (-90dB), THD (0.03%), on-resistance matching (0.2Ω ΔRON), and TQFN-10 package thermal performance (θJA = 350°C/W).

Technical Context

The PI3A114-AZLEX implements a break-before-make switching architecture with three digital control inputs (EN, S0, S1) selecting one of four bidirectional analog channels (A0–A3) to connect to common I/O Y. Its low-swing input thresholds (VIH = 1.5V, VIL ≤ 0.8V) allow direct interfacing with 1.8V GPIO while passing full 3.3V rail-to-rail analog signals.

It delivers high-fidelity analog switching with 250MHz 3dB bandwidth, ultra-low charge injection (15pC), and minimal signal distortion-enabled by matched on-resistance flatness (0.6Ω RONF) and <0.03% total harmonic distortion across 20Hz–20kHz under 100kΩ load.

Key Specifications

Pinout & Package

PI3A114-AZLEX is packaged in a Pb-free, green 10-pin Thin Quad Flat No-Lead (TQFN) measuring 1.6mm × 1.3mm with 0.4mm pitch and exposed thermal pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar analog multiplexer applications.

Compared with TMUX1574RTER and ADG714BRUZ, PI3A114-AZLEX provides the lowest on-resistance and THD in its class, fastest switching, and smallest footprint-making it optimal for space- and fidelity-critical portable analog routing where parallel control and 1.8V–3.3V compatibility are mandatory.

Availability

PI3A114-AZLEX is available at Aetrix Electronics and suitable for smartphone audio routing, portable medical sensor hubs, USB-C alternate mode switching, and wearable biometric front-ends requiring stable component supply and consistent TQFN-10 sourcing.

Supply support for PI3A114-AZLEX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-performance, energy-efficient components for consumer, computing, industrial, and automotive markets.

The PI3A114-AZLEX belongs to Diodes' analog switch/multiplexer product line, designed specifically for low-voltage, high-fidelity signal routing in portable electronics where size, power, and signal integrity are co-constrained.

FAQ

What is the maximum allowable signal voltage range for PI3A114-AZLEX?

The device supports analog signal voltages from -0.3V to VDD across the full operating supply range (1.8V–3.3V). At VDD = 3.3V, this translates to -0.3V to +3.3V, enabling true rail-to-rail operation including slight negative headroom for AC-coupled signals. Exceeding these limits risks latch-up or damage per absolute maximum ratings.

Can PI3A114-AZLEX be used with 1.2V logic control inputs?

No. The guaranteed logic HIGH threshold (VIH) is 1.5V minimum, and the device requires VDD ≥ 1.8V to operate. Inputs below 1.5V may result in undefined switching behavior or increased ICC. For 1.2V systems, a level shifter or alternative part like TMUX1574 is required.

Does PI3A114-AZLEX support break-before-make switching?

Yes. The internal architecture enforces break-before-make timing during channel transitions, verified by test circuit Figure 3 in DS40219. This prevents momentary shorting between A0–A3 channels during selection changes, critical for avoiding signal glitches or DC shorts in mixed-signal systems.

Is thermal pad connection required for reliable operation?

Yes. The exposed thermal pad (Pin 10 is GND; pad is electrically connected to GND) must be soldered to a PCB thermal land for thermal dissipation. With θJA = 350°C/W, failure to connect the pad increases junction temperature significantly-especially above 50mW power dissipation-and risks exceeding the 150°C TJ limit under continuous 100mA load.