Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Logic > Signal Switches, Multiplexers, Decoders

Diodes Incorporated PI3B16210A

Name: PI3B16210A
Brand: Diodes Incorporated
SKU: PI3B16210A
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: PI3B16210A

Manufacturer:: Diodes Incorporated

Category:: Signal Switches, Multiplexers, Decoders

Package:: 48-TFSOP (0.240", 6.10mm Width)

Datasheet:: PI3B16210A.pdf

Description:: IC BUS SWITCH 10 X 1:1 48TSSOP

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:4,195

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

PI3B16210A from Pericom Semiconductor is a 3.3V, 20-bit, 2-port bus switch with 5Ω on-resistance, 4.5ns max switching speed, and flow-through pinout in a 48-pin TSSOP package. It enables bidirectional signal routing between two independent 10-bit buses (Port A and Port B) with dual active-low bus enable controls (1OE, 2OE), used in high-speed memory and data-path isolation in telecom backplanes.

For engineers reviewing the PI3B16210A datasheet, PI3B16210A pinout, PI3B16210A application, or PI3B16210A equivalent, key selection criteria include on-resistance matching, propagation delay contribution, VCC operating range (3.0–3.6V), industrial temperature support (–40°C to +85°C), and TSSOP-48 mechanical compatibility.

Technical Context

The PI3B16210A implements two independent 10-bit analog bus switches, each controlled by a dedicated OE input. Each switch channel connects A-side and B-side pins via low-R_ON CMOS transmission gates without added logic delay-only RC delay from 5Ω R_ON and load capacitance.

Logic inputs accept rail-to-rail voltages up to +3.6V regardless of VCC, supporting mixed-voltage interface bridging. Power sequencing requires VCC/GND applied before control or data signals to prevent latch-up.

Key Specifications

Parameter	Value and Actual Design Meaning
VCC Range	3.0V to 3.6V - Ensures stable operation across standard 3.3V system rails with ±0.3V tolerance.
On-Resistance (R_ON)	5Ω max - Enables minimal voltage drop (<50mV at 10mA) and preserves signal integrity for 3.3V LVTTL/LVCMOS interfaces.
Switching Speed (t_PHL/t_PLH)	4.5ns max - Supports >200MHz data rates in point-to-point or stubbed bus topologies.
Propagation Delay	Near-zero - Adds only RC delay (≈0.25ns for 50pF load); no gate-level latency, preserving timing-critical paths.
Operating Temperature	–40°C to +85°C - Qualified for industrial-grade embedded systems including base station I/O modules and network processors.
Input Voltage Range	–0.5V to +4.6V - Allows safe interfacing with 5V-tolerant drivers while powered from 3.3V supply.
Max Output Current	±120mA per pin - Sustains drive capability for fanout-4 LVCMOS loads without external buffering.

Pinout & Package

Package: 48-pin TSSOP (Thin Shrink Small Outline Package), 240-mil body width, 0.5mm pitch, Pb-free & RoHS-compliant (PI3B16210AE variant available).

Pin/Terminal	Circuit Role	Design Meaning
1OE, 2OE	Active-Low Bus Enable Control	Each independently enables/disables its associated 10-bit port; pulled high via 10kΩ to VCC disables switch, reducing leakage and noise coupling.
1A1–1A10, 2A1–2A10	Port A Input/Output Terminals	First 10-bit bus side; bidirectional, no internal direction control-signal flow determined by external driver/receiver placement.
1B1–1B10, 2B1–2B10	Port B Input/Output Terminals	Second 10-bit bus side; electrically identical to A-side, enabling mirrored or cross-connected data paths.
VCC, GND (Pins 13, 24, 36, 47)	Power and Ground Distribution	Four dedicated VCC/GND pairs minimize IR drop and ground bounce across high-speed switching events.

Key Features

Feature	Design Value
Flow-through pinout	Ports A/B mapped linearly across package edges-simplifies PCB trace routing and reduces layer count in dense backplane designs.
5Ω on-resistance	Matches impedance of typical FR4 traces (50–75Ω), minimizing reflections and ensuring clean edge fidelity for DDR-like burst transfers.
Rail-to-rail input tolerance	Accepts 0–3.6V logic levels on OE pins even at VCC = 3.0V-enables interoperability with higher-voltage control logic without level shifters.
Zero added propagation delay	Eliminates need for timing budget allocation to switch latency-critical for synchronous bus multiplexing in FPGA-to-ASIC interconnects.

Applications

Memory Interleaving

FPGA I/O Expansion

Use Scenario: Dynamically routing address/data lines between two DDR2 memory banks sharing a single controller.

IC Role / Device Role / Timing Role: Bidirectional 20-bit bus switch isolating memory banks during refresh cycles to prevent contention.

Use Value: Enables bank interleaving without adding setup/hold timing margin-preserves full 400MT/s throughput under real-time constraints.

Use Scenario: Expanding FPGA GPIO count by connecting secondary peripheral clusters (I²C, SPI, UART) through time-shared pins.

IC Role / Device Role / Timing Role: Signal path selector enabling one FPGA pin to serve multiple peripherals via software-controlled OE activation.

Use Value: Reduces FPGA pin count requirement by 20+ pins while maintaining deterministic latency (<5ns) for time-sensitive serial protocols.

Hot-Plug Backplane Interface

LVCMOS Bus Isolation

Use Scenario: Isolating add-in card data lanes from motherboard bus during insertion/removal in telecom chassis.

IC Role / Device Role / Timing Role: Fail-safe bus disconnect device activated by hot-plug controller before power sequencing begins.

Use Value: Prevents signal contention and ground bounce transients that could reset host controllers-supports IEEE 1101.10 compliance.

Use Scenario: Separating noisy motor-control MCU outputs from sensitive ADC reference and sensor front-end circuitry.

IC Role / Device Role / Timing Role: Low-R_ON analog switch breaking DC and AC coupling paths between domains.

Use Value: Achieves >60dB noise isolation at 10MHz while maintaining sub-10mV offset error-no additional decoupling capacitors required.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 20-bit bus switch applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
SN74CBT16210DGGR	5V-tolerant I/O, 6Ω R_ON, 5.5ns max t_PLH, same 48-TSSOP footprint	Designed for 5V legacy systems; lacks rail-to-rail OE input support at 3.3V VCC	Select when interfacing with 5V control logic or requiring higher ESD robustness (2kV HBM).
PI3CH4830A	Single 24-bit switch, 3.5Ω R_ON, 3.8ns max t_PLH, 56-pin TSSOP	Higher density but non-pin-compatible; requires PCB redesign and layout revalidation	Select when consolidating two 10-bit paths into one wider bus and board space permits larger package.

Compared with SN74CBT16210DGGR and PI3CH4830A, the PI3B16210A offers optimal balance of 3.3V-native performance, flow-through routing, and industrial temperature support-making it preferred for new 3.3V telecom and embedded designs where pin compatibility and timing predictability are critical.

Availability

PI3B16210A is available at Aetrix Electronics and suitable for telecom backplane routing, FPGA I/O expansion, and industrial hot-plug interface applications requiring stable component supply and long-term lifecycle assurance.

Supply support for PI3B16210A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Pericom Semiconductor was a fabless provider of high-speed interface and signal integrity solutions, acquired by Diodes Incorporated in 2016; its timing, switching, and signal conditioning portfolio remains actively supported.

The PI3B16210 belongs to Pericom's NanoSwitch™ family-designed specifically for low-latency, low-R_ON bus isolation in 3.3V data-path architectures where propagation delay and crosstalk must be minimized.

FAQ

What is the maximum capacitive load the PI3B16210A can drive while maintaining 4.5ns switching speed?

The 4.5ns max switching speed is specified with CL = 50pF and RL = 500Ω per test condition. At 50pF, the RC time constant (5Ω × 50pF = 0.25ns) contributes negligibly to total delay. Driving >100pF increases rise/fall times proportionally-designs exceeding 75pF should verify timing margins using IBIS models or bench measurement.

Can PI3B16210A operate with VCC = 2.5V?

No. The device is characterized and guaranteed only for VCC = 3.0V to 3.6V. At 2.5V, R_ON increases significantly (>15Ω), switching speed degrades beyond spec, and logic thresholds become unreliable. Use PI3B3245 or similar 2.5V-optimized switches instead.

Are the A and B pins interchangeable in terms of signal direction?

Yes-both A and B terminals are fully bidirectional with identical electrical characteristics. Signal direction is determined entirely by external drivers: whichever side drives dominates the voltage level. No internal direction control or biasing is present.

Does PI3B16210A require external pull-up or pull-down resistors on OE pins?

Not required but recommended for robustness. OE pins are CMOS inputs with high impedance; leaving them floating risks metastability. A 10kΩ pull-up to VCC ensures default disable state during power-up, preventing unintended bus connection before firmware initialization.

PI3B16210A Specifications

Product attributes: Attribute value

Manufacturer:: Diodes Incorporated

Series:: -

Package/Case:: 48-TFSOP (0.240", 6.10mm Width)

Packaging:: Tube

Product Status:: Obsolete

Type:: Bus Switch

Circuit:: 10 x 1:1

Independent Circuits:: 2

Current - Output High, Low:: -

Voltage Supply Source:: Single Supply

Voltage - Supply:: 3V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 48-TSSOP

PI3B16210A FAQ

1.How can I place an order for PI3B16210A through Aetrix?

Please submit a Request for Quotation (RFQ) for PI3B16210A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PI3B16210A reliable?

The price and inventory of PI3B16210A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PI3B16210A is usually 5 days.

3.What payment methods are accepted for PI3B16210A?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PI3B16210A transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PI3B16210A?

PI3B16210A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PI3B16210A order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PI3B16210A?

For technical support, including PI3B16210A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PI3B16210A requirements.

6.How does Aetrix verify that PI3B16210A is sourced from the original manufacturer or authorized distributors?

All PI3B16210A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PI3B16210A meets industry standards.

7.What is the process for return or replacement of PI3B16210A?

All PI3B16210A units undergo pre-shipment inspection (PSI). If there is an issue with PI3B16210A, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PI3B16210A part is unused and in its original packaging.

Return procedure for PI3B16210A:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

2026-08-11 LDO Regulator: Dropout Voltage, Noise, PSRR and Power Dissipation

LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…

2026-08-06 Conditional Access Module: CAM, CI/CI+ and DVB Security

Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…

2026-08-03 Electronic Component Obsolescence: EOL Risks, Replacement Options and Last-Time Buy Strategy

Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.

2026-07-29 18650 Battery: Voltage, Capacity, Charging and Pack Design

18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

2026-07-27 Hall Effect Sensor: Working Principle, Types, Circuits and Applications

Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…