Diodes Incorporated PI3B16210AE

Overview

PI3B16210AE from Pericom Semiconductor is a 3.3V, 20-bit, 2-port bus switch with 5 Ω on-resistance, near-zero propagation delay (≤4.5 ns), and flow-through pinout in a Pb-free 48-pin TSSOP package. It enables bidirectional signal routing between two 10-bit buses (A1–A10/B1–B10) under independent OE control for high-speed digital interconnects in FPGA I/O expansion and memory interface isolation.

For engineers reviewing the PI3B16210AE datasheet, PI3B16210AE pinout, PI3B16210AE application, or PI3B16210AE equivalent, key selection criteria include its 3.0–3.6 V supply range, –40°C to +85°C industrial temperature rating, rail-to-rail logic input tolerance, low RC delay contribution (<0.25 ns with 50 pF load), and dual OE-enabled port isolation capability.

Technical Context

The PI3B16210AE implements a CMOS-based analog bus switch architecture with two independent 10-bit bidirectional channels, each controlled by dedicated OE inputs (1OE and 2OE). Each channel connects A-side and B-side pins via low-R_ON transmission gates without buffering or level translation.

Its rail-to-rail logic inputs accept voltages up to +3.6 V regardless of V_CC, enabling interoperability with mixed-voltage systems. Power sequencing requires V_CC/GND applied before control or data signals to prevent latch-up.

Key Specifications

Pinout & Package

PI3B16210AE is housed in a Pb-free, green-compliant 48-pin TSSOP (Thin Shrink Small Outline Package) with 0.5 mm pitch, 7.6 mm × 12.5 mm body size, and exposed thermal pad-compatible footprint.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 20-bit bidirectional bus switch applications.

Compared with SN74CBT16210DGGR and NB3N16210DTG, PI3B16210AE offers the lowest R_ON and true rail-to-rail input operation, making it optimal for low-voltage, high-fidelity signal routing where minimal voltage drop and mixed-supply flexibility are critical.

Availability

PI3B16210AE is available at Aetrix Electronics and suitable for FPGA I/O expansion, memory interface isolation, and hot-plug backplane interconnect applications requiring stable component supply, RoHS compliance, and long-term industrial lifecycle support.

Supply support for PI3B16210AE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Pericom Semiconductor was a fabless provider of high-speed interface and timing solutions, acquired by Diodes Incorporated in 2016; its legacy portfolio remains widely deployed in industrial and communications infrastructure.

The PI3B16210AE belongs to the NanoSwitch™ family, engineered specifically for low-latency, low-distortion bidirectional signal routing in 3.3 V digital systems requiring zero-additive propagation delay and robust hot-swap capability.

FAQ

What is the maximum capacitive load the PI3B16210AE can drive while maintaining ≤4.5 ns propagation delay?

The PI3B16210AE's propagation delay remains ≤4.5 ns up to 50 pF total load capacitance per pin, as verified by characterization with 500 Ω source resistance and 50 pF load. Beyond 50 pF, RC delay increases linearly (τ ≈ R_ON × C_L), but the device remains functional-system-level timing must be re-validated.

Can PI3B16210AE be used with a 2.5 V supply voltage?

No. The PI3B16210AE is specified only for 3.0 V to 3.6 V operation. At 2.5 V, internal logic thresholds and R_ON performance fall outside guaranteed specifications; functionality is not assured, and DC characteristics like I_CC and leakage are uncharacterized.

Does PI3B16210AE support hot-swap operation without external protection circuitry?

Yes-its absolute maximum ratings include –0.5 V to +4.6 V on all I/O pins and proper power sequencing guidance (V_CC/GND first) enables safe hot-insertion. However, external current-limiting resistors or TVS diodes are recommended for sustained ESD or inrush events per IEC 61000-4-2 Level 4.

How does the flow-through pinout improve PCB layout compared to traditional bus switches?

The flow-through arrangement (e.g., A1–A10 on left edge, B1–B10 on right edge, OE pins at ends) allows straight, non-crossing traces between FPGA and memory/peripheral buses. This reduces layer count, eliminates vias in critical signal paths, and cuts parasitic inductance by up to 30% versus folded layouts-directly improving signal integrity at >100 MHz.