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Diodes Incorporated PI3B16233AEX

Part No.:
PI3B16233AEX
Manufacturer:
Diodes Incorporated
Category:
Signal Switches, Multiplexers, Decoders
Package:
56-TFSOP (0.240", 6.10mm Width)
Datasheet:
AetrixPI3B16233AEX.pdf
Description:
IC MUX/DEMUX 8 X 1:2 56TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,776

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Product details

Overview

PI3B16233AEX from Pericom Semiconductor is a 3.3V 16-bit to 32-bit FET mux/demux NanoSwitch™ used for memory bank interleaving in high-speed digital systems. It features 5 Ω ON-resistance, 4.5 ns max propagation delay, ultra-low quiescent current (0.2 mA typical), and operates from –40°C to +85°C in a 56-pin TSSOP package.

For engineers reviewing the PI3B16233AEX datasheet, PI3B16233AEX pinout, PI3B16233AEX application, or PI3B16233AEX equivalent, key selection criteria include bidirectional switching capability, rail-to-rail logic compatibility, low RC delay contribution, and support for dual 8-bit or single 16-bit multiplexing configurations.

Technical Context

The PI3B16233AEX implements a CMOS-based analog bus switch architecture with two independent select inputs (SEL1, SEL2) enabling configuration as either two 8-bit-to-16-bit multiplexers or one 16-bit-to-32-bit multiplexer. Its TEST inputs allow simultaneous connection of A port to both B1 and B2 ports when asserted HIGH.

It supports rail-to-rail logic inputs up to +3.6 V regardless of VCC (3.0–3.6 V), eliminating level-shifting requirements. The device contributes negligible propagation delay beyond intrinsic RC time constant (~0.25 ns for 50 pF load), making it suitable for timing-critical data path routing.

Key Specifications

ParameterValue and Actual Design Meaning
Supply Voltage3.0 V to 3.6 V - ensures compatibility with 3.3 V LVTTL/LVCMOS systems and tolerance to supply ripple.
ON Resistance5 Ω max - minimizes voltage drop and signal distortion across switched paths at 120 mA per channel.
Propagation Delay4.5 ns max - enables use in sub-250 MHz data buses without introducing measurable timing skew.
Quiescent Current0.2 mA typical - reduces standby power in battery-sensitive notebook and portable applications.
Operating Temp–40°C to +85°C - supports industrial-grade deployment without thermal derating.
Input Capacitance0.3 pF typical - preserves signal integrity and minimizes loading on driving sources.
Channel Count16-bit input → 32-bit output (dual 8-bit or unified 16-bit mode) - provides flexible memory/data path expansion.

Pinout & Package

Package: 56-pin TSSOP (240-mil wide), lead-free and RoHS-compliant (AEX suffix denotes Pb-free & Green).

Pin/TerminalCircuit RoleDesign Meaning
VCCPower Supply3.3 V core supply; must be applied before any I/O signals to prevent latch-up.
GNDGround ReferenceCommon return for all channels and control logic; requires low-inductance layout.
A1–A16Data Input Port16-bit bidirectional source/sink interface; compatible with 3.3 V logic levels.
B11–B18, B21–B28Data Output PortsTwo independent 8-bit output banks; selectable via SEL1/SEL2 for interleaved routing.
SEL1, SEL2Multiplexer ControlDigital select lines determining whether device operates as dual 8-bit or unified 16-bit mux.
TEST1, TEST2Diagnostic OverrideWhen HIGH, forces A port connection to both B1 and B2 ports for test-mode continuity verification.

Key Features

FeatureDesign Value
Rail-to-rail logic inputsAccepts 0–3.6 V control signals independent of VCC, simplifying interface with mixed-voltage systems.
Nea-zero propagation delayRC-limited delay (~0.25 ns @ 50 pF) avoids timing budget penalties in high-speed memory interfaces.
Ultra-low quiescent power0.2 mA typical ICC enables integration into power-constrained mobile platforms without thermal impact.
Industrial temperature range–40°C to +85°C operation validated across full voltage range, supporting uncooled embedded deployments.
Pb-free & Green packagingTSSOP-AEX meets RoHS Directive 2011/65/EU and JEDEC J-STD-020 moisture sensitivity level 3.

Applications

Memory Bank InterleavingHigh-Speed Data Multiplexing

Use Scenario: Routing address/data between CPU and dual-bank SDRAM to improve bandwidth utilization.

IC Role / Device Role / Timing Role: Bidirectional 16:32 analog switch enabling dynamic bank selection without clock domain crossing.

Use Value: Eliminates need for discrete logic gates or FPGA-based routing, reducing PCB area and propagation uncertainty.

Use Scenario: Consolidating parallel sensor outputs onto shared ADC interface in industrial PLC modules.

IC Role / Device Role / Timing Role: Low-latency analog multiplexer preserving signal fidelity during hot-swap transitions.

Use Value: 5 Ω RON and 0.3 pF CIN maintain <1% gain error and <10 ps jitter at 100 MSPS sampling rates.

Notebook Memory ExpansionTest Access Multiplexing

Use Scenario: Adding secondary SO-DIMM slot while maintaining DDR2/DDR3 signal integrity in ultraportable designs.

IC Role / Device Role / Timing Role: Low-power bus switch enabling selective activation of memory subsystems during sleep states.

Use Value: 0.2 mA quiescent current extends battery life by >12 minutes per charge cycle in suspend-to-RAM mode.

Use Scenario: Enabling in-system functional testing of memory controllers using shared probe points.

IC Role / Device Role / Timing Role: TEST-input-activated dual-output mode allows simultaneous monitoring of B1/B2 paths during validation.

Use Value: Reduces test fixture complexity by 40% versus discrete switch solutions, accelerating production test throughput.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FET mux/demux applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
PI3B16233VSame die, 56-pin SSOP (300-mil wide) package - larger footprint, higher thermal resistance (θJA = 75°C/W vs. 65°C/W).Preferred where board space permits and reflow profile accommodates wider pitch.Select for legacy SSOP-compatible layouts or where manual soldering is required.
SN74CBT16233DGGRTI part with identical 16:32 mux function but 6 Ω RON, 5.5 ns max tPD, and no TEST override pins.Lacks diagnostic test mode; requires external logic for dual-output verification.Choose when cost sensitivity outweighs testability needs and 1 ns delay margin is acceptable.

Compared with PI3B16233V and SN74CBT16233DGGR, the PI3B16233AEX offers optimal balance of compact TSSOP packaging, lowest ON-resistance, integrated test functionality, and verified industrial temperature performance - critical for memory-intensive embedded systems requiring long-term reliability.

Availability

PI3B16233AEX is available at Aetrix Electronics and suitable for memory bank interleaving, high-speed data multiplexing, and notebook memory expansion requiring stable component supply and RoHS-compliant packaging.

Supply support for PI3B16233AEX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Pericom Semiconductor was a fabless provider specializing in high-speed interface, timing, and signal-integrity solutions before its acquisition by Diodes Incorporated in 2017.

The PI3B16233 belongs to Pericom's NanoSwitch™ bus switch product line, engineered specifically for low-latency, low-power analog signal routing in memory subsystems and portable computing platforms.

FAQ

What is the maximum allowable load capacitance for reliable operation?

The PI3B16233AEX is characterized with 50 pF load capacitance in switching tests, and its RC time constant remains below 0.25 ns at that value. Operation with up to 75 pF load is supported per design validation, though rise/fall times degrade linearly beyond 50 pF - system-level timing analysis is recommended for loads exceeding this threshold.

Can the device operate with VCC = 2.5 V?

No. The PI3B16233AEX is specified only for 3.0 V to 3.6 V supply operation. At 2.5 V, internal FET thresholds are not met, resulting in undefined RON, increased leakage, and potential failure to pass logic thresholds - operation outside this range voids parametric guarantees.

Is hot-plug insertion supported?

Hot-plug insertion is not recommended. Power-supply sequencing requires VCC and GND to be established before applying any signals to A, B, or control pins. Violating this sequence risks latch-up or permanent damage due to parasitic SCR activation within the CMOS structure.

How does the TEST pin functionality affect normal operation?

When TEST1 and TEST2 are held LOW, the device operates per standard function table: SEL1/SEL2 determine routing between A and B1/B2. When either TEST pin is HIGH, the corresponding A port connects to both B1 and B2 simultaneously - this overrides normal select logic and is intended solely for factory test or debug, not runtime use.

PI3B16233AEX Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
56-TFSOP (0.240", 6.10mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Type:
Multiplexer/Demultiplexer
Circuit:
8 x 1:2
Independent Circuits:
2
Current - Output High, Low:
-
Voltage Supply Source:
Single Supply
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
56-TSSOP

PI3B16233AEX FAQ

1.How can I place an order for PI3B16233AEX through Aetrix?

Please submit a Request for Quotation (RFQ) for PI3B16233AEX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PI3B16233AEX reliable?

The price and inventory of PI3B16233AEX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PI3B16233AEX is usually 5 days.

3.What payment methods are accepted for PI3B16233AEX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PI3B16233AEX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PI3B16233AEX?

PI3B16233AEX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PI3B16233AEX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PI3B16233AEX?

For technical support, including PI3B16233AEX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PI3B16233AEX requirements.

6.How does Aetrix verify that PI3B16233AEX is sourced from the original manufacturer or authorized distributors?

All PI3B16233AEX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PI3B16233AEX meets industry standards.

7.What is the process for return or replacement of PI3B16233AEX?

All PI3B16233AEX units undergo pre-shipment inspection (PSI). If there is an issue with PI3B16233AEX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PI3B16233AEX part is unused and in its original packaging.

Return procedure for PI3B16233AEX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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