Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Logic > Signal Switches, Multiplexers, Decoders

Diodes Incorporated PI3B3257WEX

Name: PI3B3257WEX
Brand: Diodes Incorporated
SKU: PI3B3257WEX
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: PI3B3257WEX

Manufacturer:: Diodes Incorporated

Category:: Signal Switches, Multiplexers, Decoders

Package:: 16-SOIC (0.154", 3.90mm Width)

Datasheet:: PI3B3257WEX.pdf

Description:: IC MUX/DEMUX 4 X 2:1 16SOIC

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:1,244

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

PI3B3257WEX from Diodes Incorporated is a 3.3 V quad 2:1 multiplexer/demultiplexer with three-state outputs, pinout- and function-compatible with 74F257, 74ALS257, and PI74FCT257T logic families. It features 5 Ω switch on-resistance, 4.8 ns max propagation delay, and 0.1 µA typical quiescent current, enabling low-noise signal routing in notebook and portable computing I/O paths.

For engineers reviewing the PI3B3257WEX datasheet, PI3B3257WEX pinout, PI3B3257WEX application, or PI3B3257WEX equivalent, key selection criteria include guaranteed 3.3 V operation, rail-to-rail input tolerance up to +3.6 V, ultra-low ICC, and compatibility with legacy 74-series logic footprints in SOIC-16 packaging.

Technical Context

The PI3B3257WEX implements four independent bidirectional analog/digital bus switches controlled by a shared enable (E) and select (S) line. Each switch exhibits near-zero propagation delay due to its low R_ON–C_OFF time constant (~0.25 ns for 50 pF load), and operates without ground bounce noise under full-swing TTL-level control.

It supports hot-plug operation with rail-to-rail input drive capability (0 V to +3.6 V independent of V_CC), and maintains high-impedance outputs when disabled. The device uses CMOS process technology optimized for low static power and fast switching in space-constrained embedded interfaces.

Key Specifications

Parameter	Value and Actual Design Meaning
V_CC Supply Voltage	3.3 V ±10% - Fixed single-supply operation; no dual-rail or level-shifting required
R_ON (Switch On-Resistance)	5 Ω typ. - Enables minimal voltage drop and signal distortion across I/Y paths at ≤120 mA load
t_IY Propagation Delay	0.25 ns typ. - Near-transparent signal pass-through; system timing dominated by driver/load, not switch
t_PZL/t_PHZ Disable Time	4.8 ns max. - Fast output isolation critical for glitch-free bus arbitration and dynamic reconfiguration
I_CC Quiescent Current	0.1 µA typ. - Supports always-on I/O muxing in battery-powered systems without measurable drain
Input Voltage Range	–0.5 V to +4.6 V - Allows interfacing with 3.3 V, 5 V, or mixed-voltage logic without external clamping
Operating Temperature	–40°C to +85°C - Qualified for industrial-grade embedded and portable computing environments

Pinout & Package

PI3B3257WEX is packaged in 16-pin SOIC (W), with 1.27 mm pitch, 10.3 mm × 7.5 mm body size, and Pb-free/Green compliance. Pin 1 is marked by a beveled corner or notch; exposed pad is absent (unlike UQFN variant).

Pin/Terminal	Circuit Role	Design Meaning
1, 2, 3, 4, 5, 6, 7, 8	Data Inputs (IA0–ID1)	Eight bidirectional analog/digital inputs grouped as four pairs (IA0/IA1, IB0/IB1, etc.)
9, 10, 11, 12	Data Outputs (YA–YD)	Four bidirectional outputs, each connected to one input pair via internal switch matrix
13	Select (S)	Common control selecting IAx/IBx/ICx/IDx source (0 = x0, 1 = x1) for all four channels
14	Enable (E)	Active-low global enable; drives all YA–YD into high-impedance when high
15	V_CC	3.3 V supply pin; decoupling capacitor required within 1 cm for stable switching
16	GND	Digital ground reference; must be low-impedance connection to minimize noise coupling

Key Features

Feature	Design Value
Quad 2:1 Mux/Demux Architecture	Four independent, bidirectional switches sharing one S and one E control line - reduces PCB routing complexity vs. discrete solutions
5 Ω Low On-Resistance	Minimizes insertion loss and signal attenuation in high-speed digital and analog signal paths (e.g., USB 1.1, LPC, SMBus)
Rail-to-Rail Input Tolerance	Supports 0 V to +3.6 V logic drive regardless of V_CC - eliminates need for level shifters when interfacing with 5 V controllers
0.1 µA Typical I_CC	Enables persistent I/O path configuration in sleep-mode systems without compromising battery life
SOIC-16 Pin Compatibility	Direct replacement for legacy 74-series 257 devices - enables drop-in upgrade without layout change

Applications

USB 1.1 Signal Switching

LPC Bus Multiplexing

Use Scenario: Selecting between two USB 1.1 upstream ports in a docking station or multi-host peripheral.

IC Role / Device Role / Timing Role: Bidirectional analog switch routing D+ and D− lines with sub-nanosecond delay and <5 Ω channel resistance.

Use Value: Preserves signal integrity and eye diagram margin while enabling host port arbitration without protocol-aware logic.

Use Scenario: Sharing a single LPC interface among multiple firmware components (e.g., EC, BIOS, TPM) in a laptop motherboard.

IC Role / Device Role / Timing Role: Enabling/disabling LPC data/address/control lines using E and S signals synchronized to system reset and boot sequence.

Use Value: Eliminates contention and bus lockup during firmware handoff, with zero added setup/hold timing burden.

SMBus Address Translation

Notebook I/O Expansion Hub

Use Scenario: Dynamically assigning unique SMBus addresses to identical sensors (e.g., thermal diodes) on different daughterboards.

IC Role / Device Role / Timing Role: Isolating SMBus SDA/SCL lines between master and selected slave group using E-controlled high-Z state.

Use Value: Avoids address collision without requiring programmable slave addressing or additional microcontroller resources.

Use Scenario: Routing GPIO, UART, and SPI signals from a baseband processor to multiple expansion modules (e.g., WWAN, Wi-Fi, fingerprint sensor).

IC Role / Device Role / Timing Role: Acting as a configurable signal router with low ICC to maintain standby power budget under 100 µA.

Use Value: Reduces BOM count versus discrete switches and avoids FPGA-based routing overhead in cost-sensitive designs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar quad 2:1 mux/demux applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
SN74CBT3257PWR	Higher R_ON (7 Ω typ.), 5 V tolerant, 3.3 V compatible; 6.5 ns max t_PZL	Requires tighter V_CC regulation (4.5–5.5 V); less suitable for battery-backed 3.3 V domains	Prefer when interfacing with 5 V legacy controllers and higher drive strength is needed
74LVC1G3157GW,125	Single-channel only; 3.3 V only; 6 Ω R_ON; 3.5 ns max t_PZL; SC-70-6 package	Not pin-compatible; requires four units and additional logic for quad functionality	Prefer for ultra-small footprint where board area > channel count in single design

Compared with SN74CBT3257PWR and 74LVC1G3157GW,125, the PI3B3257WEX delivers superior combination of ultra-low ICC (0.1 µA), lowest R_ON (5 Ω), and SOIC-16 pin compatibility-making it optimal for space-constrained, battery-sensitive notebook I/O routing where legacy footprint retention matters.

Availability

PI3B3257WEX is available at Aetrix Electronics and suitable for notebook I/O switching, LPC bus arbitration, SMBus address management, and portable embedded signal routing requiring stable component supply and long-term lifecycle support.

Supply support for PI3B3257WEX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and integrated circuits, specializing in high-performance, energy-efficient solutions for consumer, computing, industrial, and automotive markets.

The PI3B3257 belongs to Diodes' NanoSwitch™ bus switch product line, engineered specifically for low-latency, low-power signal routing in portable and embedded computing platforms where board space and battery life are critical constraints.

FAQ

Can PI3B3257WEX operate with a 5 V supply?

No. The PI3B3257WEX is specified only for 3.3 V ±10% operation (2.97 V to 3.63 V). Its absolute maximum V_CC rating is +4.6 V, and sustained 5 V operation will cause permanent damage. For 5 V systems, consider SN74CBT3257PWR instead.

Is the PI3B3257WEX pinout identical to the 74F257?

Yes. The PI3B3257WEX matches the 74F257 pinout exactly: pins 1–8 are inputs, 9–12 are outputs, 13 is S, 14 is E, 15 is V_CC, and 16 is GND. This allows direct replacement without PCB modification in existing 74F257 designs.

Does PI3B3257WEX support hot-swap insertion?

Yes, when powered sequencing guidelines are followed: apply V_CC and GND before any input/output signals. Its rail-to-rail input tolerance (–0.5 V to +4.6 V) and high-impedance outputs during disable allow safe live insertion into powered backplanes or docking connectors.

What is the thermal performance of the SOIC-16 (W) package?

The SOIC-16 package has a junction-to-ambient thermal resistance (θ_JA) of 110°C/W under standard JEDEC 2-layer board conditions. With 0.5 W max power dissipation and 0.1 µA typical I_CC, self-heating is negligible (<0.1°C rise) in normal operation.

PI3B3257WEX Specifications

Product attributes: Attribute value

Manufacturer:: Diodes Incorporated

Series:: -

Package/Case:: 16-SOIC (0.154", 3.90mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Active

Type:: Multiplexer/Demultiplexer

Circuit:: 4 x 2:1

Independent Circuits:: 1

Current - Output High, Low:: -

Voltage Supply Source:: Single Supply

Voltage - Supply:: 3V ~ 3.6V

Operating Temperature:: -40°C ~ 125°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 16-SOIC

PI3B3257WEX FAQ

1.How can I place an order for PI3B3257WEX through Aetrix?

Please submit a Request for Quotation (RFQ) for PI3B3257WEX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PI3B3257WEX reliable?

The price and inventory of PI3B3257WEX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PI3B3257WEX is usually 5 days.

3.What payment methods are accepted for PI3B3257WEX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PI3B3257WEX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PI3B3257WEX?

PI3B3257WEX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PI3B3257WEX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PI3B3257WEX?

For technical support, including PI3B3257WEX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PI3B3257WEX requirements.

6.How does Aetrix verify that PI3B3257WEX is sourced from the original manufacturer or authorized distributors?

All PI3B3257WEX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PI3B3257WEX meets industry standards.

7.What is the process for return or replacement of PI3B3257WEX?

All PI3B3257WEX units undergo pre-shipment inspection (PSI). If there is an issue with PI3B3257WEX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PI3B3257WEX part is unused and in its original packaging.

Return procedure for PI3B3257WEX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

2026-08-11 LDO Regulator: Dropout Voltage, Noise, PSRR and Power Dissipation

LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…

2026-08-06 Conditional Access Module: CAM, CI/CI+ and DVB Security

Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…

2026-08-03 Electronic Component Obsolescence: EOL Risks, Replacement Options and Last-Time Buy Strategy

Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.

2026-07-29 18650 Battery: Voltage, Capacity, Charging and Pack Design

18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

2026-07-27 Hall Effect Sensor: Working Principle, Types, Circuits and Applications

Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…