Diodes Incorporated PI3B3257ZHDEX
- Part No.:
- PI3B3257ZHDEX
- Manufacturer:
- Diodes Incorporated
- Category:
- Signal Switches, Multiplexers, Decoders
- Package:
- 16-UFQFN Exposed Pad
- Datasheet:
-
PI3B3257ZHDEX.pdf
- Description:
- IC MUX/DEMUX 4 X 2:1 16UQFN
- Quantity:
- Payment:

- Shipping:

Inventory:1,954
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PI3B3257ZHDEX from Diodes Incorporated is a 3.3 V quad 2:1 multiplexer/demultiplexer with three-state outputs, pinout- and function-compatible with 74F257, 74ALS257, and PI74FCT257T. It features 5 Ω on-resistance, 4.8 ns max propagation delay, and 0.1 µA typical quiescent current, enabling low-noise signal routing in notebook and portable logic systems.
For engineers reviewing the PI3B3257ZHDEX datasheet, PI3B3257ZHDEX pinout, PI3B3257ZHDEX application, or PI3B3257ZHDEX equivalent, key selection criteria include its UQFN-16 (ZHD) package, rail-to-rail logic inputs up to +3.6 V, 50 pF load timing performance, and compatibility with legacy TTL/CMOS bus architectures.
Technical Context
The PI3B3257ZHDEX implements four independent bidirectional analog/digital switches controlled by a shared select (S) and enable (E) input. Each switch exhibits near-zero propagation delay due to its low RON–COFF time constant (~0.25 ns for 50 pF), with no added ground bounce noise during switching.
It operates strictly at 3.3 V ±10%, supports logic inputs beyond VCC (up to +3.6 V), and maintains high-impedance outputs when disabled. The UQFN-16 (ZHD) package integrates an exposed thermal pad requiring PCB soldering and thermal vias for reliable operation under continuous 120 mA per channel loads.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Supply | 3.3 V ±10% - fixed single-supply operation; no dual-rail or adjustable bias required |
| RON | 5 Ω typ. - enables low-loss signal pass-through with minimal voltage drop at 48 mA |
| tIY | 0.25 ns typ. - negligible propagation delay ensures timing-critical bus integrity |
| ICC | 0.1 µA typ. - ultra-low static power ideal for battery-backed or always-on subsystems |
| CIN | 3.0 pF - minimal input loading preserves driver rise/fall times in high-speed buses |
| Max Output Current | 120 mA - supports direct connection to standard CMOS/TTL fan-out without buffering |
| Logic Input Range | –0.5 V to +3.6 V - allows interfacing with higher-voltage controllers without level shifters |
Pinout & Package
PI3B3257ZHDEX is housed in a 16-pin UQFN (ZHD) package measuring 3 mm × 3 mm with 0.5 mm pitch and an exposed thermal pad. Pin 1 index is marked via top-side laser marking; GND connects to both pin 12 and the center thermal pad, which must be soldered to PCB ground for electrical stability and thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| E | Global Enable | Active-low control: disables all four Y outputs into high-impedance state when high |
| S | Common Select | Chooses between IA/IB/IC/ID (S = L) or IA1/IB1/IC1/ID1 (S = H) for all channels |
| IA0–ID1 | Data Inputs | Eight bidirectional analog/digital inputs; each pair feeds one 2:1 mux path |
| YA–YD | Switched Outputs | Four buffered, three-state outputs; driven only when E = L and S selects active input pair |
| VCC | Power Supply | 3.3 V supply input; decoupling capacitor required within 1 cm of pin 16 |
| GND | Ground Reference | Pins 12 and exposed pad form low-inductance return path; both must connect to system ground |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail logic inputs | Accepts 0 V to +3.6 V regardless of VCC, eliminating need for external level translators |
| 5 Ω analog switch RON | Minimizes insertion loss and distortion for analog signals up to 100 MHz bandwidth |
| 0.1 µA quiescent current | Reduces standby power in portable systems; enables >10-year battery life in always-on monitoring nodes |
| UQFN-16 (ZHD) footprint | 3×3 mm size saves >60% board area vs. SOIC-16; thermal pad improves power handling by 2.5× |
| Pin compatibility with 74-series 257 | Enables drop-in replacement in legacy designs without layout or firmware changes |
Applications
| USB 2.0 Data Switching | Notebook Display Multiplexing |
|---|---|
Use Scenario: Routing USB D+/D− signals between two upstream hosts and one downstream device. IC Role / Device Role / Timing Role: Bidirectional analog switch providing transparent, low-latency signal path with no protocol awareness. Use Value: 5 Ω RON and <0.3 ns tIY preserve signal integrity up to 480 Mbps without equalization. | Use Scenario: Selecting between integrated GPU and discrete GPU video outputs to a single LVDS/eDP panel. IC Role / Device Role / Timing Role: High-speed digital bus switch enabling real-time display source arbitration. Use Value: 4.8 ns max disable time allows glitch-free output blanking during source transitions. |
| PCIe Lane Sharing | Industrial I/O Module Signal Routing |
Use Scenario: Sharing PCIe x1 lanes between two peripherals (e.g., NVMe SSD and FPGA) in embedded edge gateways. IC Role / Device Role / Timing Role: Low-capacitance, low-RON analog switch preserving PCIe Gen1/Gen2 eye diagram margins. Use Value: 3.0 pF CIN and 17.0 pF COFF minimize reflection and crosstalk on 100 Ω differential pairs. | Use Scenario: Configurable routing of sensor analog outputs (thermocouple, RTD) or digital I/O lines to ADC or microcontroller pins. IC Role / Device Role / Timing Role: General-purpose signal selector supporting mixed-signal front-end flexibility. Use Value: 120 mA per channel rating allows direct driving of op-amp inputs or optocoupler LEDs without buffers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar quad 2:1 mux applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| PI74FCT257TQE | 5 V operation only; 7 ns max tPZL; 16-pin QSOP only | Requires level shifting for 3.3 V systems; unsuitable for battery-powered designs | Select only if legacy 5 V infrastructure mandates pin-compatible replacement |
| SN74CBT3257PWR | 3.3 V compatible; 6 Ω RON; 16-pin TSSOP; 1 µA ICC | Higher quiescent current reduces battery life; larger TSSOP footprint increases board cost | Prefer when existing PCB uses TSSOP land pattern and 1 µA ICC meets system budget |
Compared with PI74FCT257TQE and SN74CBT3257PWR, PI3B3257ZHDEX delivers superior low-power performance (0.1 µA vs. ≥1 µA), smallest footprint (UQFN-16), and lowest RON, making it optimal for space-constrained, energy-sensitive portable and embedded platforms.
Availability
PI3B3257ZHDEX is available at Aetrix Electronics and suitable for USB switching, notebook display arbitration, PCIe lane sharing, and industrial I/O routing requiring stable component supply across production lifecycles.
Supply support for PI3B3257ZHDEX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and integrated circuits, specializing in high-performance, energy-efficient solutions for consumer, computing, industrial, and communications markets.
The PI3B3257 belongs to Diodes' NanoSwitch™ bus-switch family, engineered for low-latency, low-power signal routing in portable and space-constrained electronics where board area and battery life are critical constraints.
FAQ
Is PI3B3257ZHDEX compatible with 5 V logic inputs?
No - its logic inputs tolerate up to +3.6 V regardless of VCC, but it is not rated for 5 V operation. Applying 5 V to any pin exceeds the absolute maximum rating of –0.5 V to +4.6 V and risks permanent damage. For 5 V systems, use PI74FCT257TQE instead.
What is the role of the exposed thermal pad on the ZHD package?
The exposed pad serves as both an electrical ground connection and primary thermal path. It must be soldered to a dedicated PCB ground plane with ≥4 thermal vias (0.3 mm diameter) to ensure proper device operation, prevent latch-up, and maintain junction temperature below 125°C at 120 mA per channel.
Can PI3B3257ZHDEX be used for analog signal switching?
Yes - its 5 Ω RON, 25 pF CON, and rail-to-rail input capability support analog signals up to 100 MHz. However, THD and crosstalk are not characterized in the datasheet; for precision analog paths, verify performance with actual signal levels and source/load impedances.
Does PI3B3257ZHDEX require external pull-up or pull-down resistors on control pins?
No - the E and S inputs have internal clamp diodes and specified VIH/VIL thresholds (2.0 V/0.8 V). With clean 3.3 V logic drivers, external biasing is unnecessary. Pull-ups are only needed if driving from open-drain sources or when floating states must be avoided during power-up sequencing.
PI3B3257ZHDEX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 16-UFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Multiplexer/Demultiplexer
- Circuit:
- 4 x 2:1
- Independent Circuits:
- 1
- Current - Output High, Low:
- -
- Voltage Supply Source:
- Single Supply
- Voltage - Supply:
- 2.97V ~ 3.63V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-UQFN (3x3)
PI3B3257ZHDEX FAQ
1.How can I place an order for PI3B3257ZHDEX through Aetrix?
Please submit a Request for Quotation (RFQ) for PI3B3257ZHDEX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PI3B3257ZHDEX reliable?
The price and inventory of PI3B3257ZHDEX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PI3B3257ZHDEX is usually 5 days.
3.What payment methods are accepted for PI3B3257ZHDEX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PI3B3257ZHDEX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PI3B3257ZHDEX?
PI3B3257ZHDEX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PI3B3257ZHDEX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PI3B3257ZHDEX?
For technical support, including PI3B3257ZHDEX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PI3B3257ZHDEX requirements.
6.How does Aetrix verify that PI3B3257ZHDEX is sourced from the original manufacturer or authorized distributors?
All PI3B3257ZHDEX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PI3B3257ZHDEX meets industry standards.
7.What is the process for return or replacement of PI3B3257ZHDEX?
All PI3B3257ZHDEX units undergo pre-shipment inspection (PSI). If there is an issue with PI3B3257ZHDEX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PI3B3257ZHDEX part is unused and in its original packaging.
Return procedure for PI3B3257ZHDEX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PI3B3257ZHDEX Tags
-
SN74HC138DR
Texas Instruments

-
TC7SB3157CFU,LF(CT
Toshiba Semiconductor and Storage

-
74CBTLV3257PW,118
Nexperia USA Inc.
-
SN74CBTLV3257PWR
Texas Instruments

-
74CBTLV3257GUX
Nexperia USA Inc.

-
74HC154BQ,118
Nexperia USA Inc.

-
P3S0200GMX
NXP USA Inc.

-
SN74CB3Q3245PWR
Texas Instruments
-
SN74CB3Q3257RGYR
Texas Instruments

-
TCA9543APWR
Texas Instruments
-
TCA9546APWR
Texas Instruments

-
SN74HC138N
Texas Instruments
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

