Diodes Incorporated PI3C3306LEX

Overview

PI3C3306LEX from Diodes Incorporated is a 2-bit, dual-channel, active-low bus switch IC operating at 2.5 V or 3.3 V supply, featuring individual enable control per channel, 5 Ω on-resistance, <0.25 ns propagation delay (A↔B), and >400 MHz bandwidth. It enables high-fidelity signal routing in PCIe Gen1/2 clock distribution, DDR memory data path switching, and hot-pluggable peripheral interfaces.

For engineers reviewing the PI3C3306LEX datasheet, PI3C3306LEX pinout, PI3C3306LEX application, or PI3C3306LEX equivalent, key selection criteria include active-low enable timing (tPZL/tPHZ ≤ 9.8 ns), rail-to-rail 3.3 V/2.5 V operation with 5 V I/O tolerance, and TSSOP-8 package compatibility for high-density PCB layouts.

Technical Context

The PI3C3306LEX implements two independent FET-based analog switches with CMOS-compatible active-low BE1/BE2 controls. Each switch provides bidirectional, low-capacitance (COFF = 5.0 pF, CON = 10.0 pF), low-impedance conduction when enabled - no logic inversion or level translation occurs.

Its architecture eliminates ground bounce and adds negligible RC delay (τ ≈ 0.25 ns for 50 pF load), making it suitable for high-speed digital buses where signal integrity depends on deterministic timing and minimal skew between parallel lanes.

Key Specifications

Pinout & Package

PI3C3306LEX is housed in an 8-pin, 173-mil wide plastic TSSOP (JEDEC MO-153) package with standard 0.65 mm pitch and exposed pad not present. Thermal resistance θJA = 120°C/W (TSSOP-L).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus switch applications.

Compared with SN74CBT3244DBR and PI3C3245LEX, PI3C3306LEX delivers superior high-frequency performance (>400 MHz), lowest RON (5 Ω), and true per-bit enable control - making it optimal for precision timing-critical, dual-lane signal routing where skew and bandwidth dominate selection.

Availability

PI3C3306LEX is available at Aetrix Electronics and suitable for PCIe reference clock switching, DDR memory data bus isolation, and hot-swappable peripheral docking requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for PI3C3306LEX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and integrated circuits, specializing in high-performance analog, logic, and power management solutions for industrial, computing, and communications markets.

The PI3C3306LEX belongs to Diodes' Pericom® high-speed interface product line, designed specifically for low-latency, high-fidelity signal routing in next-generation serial data and memory subsystems.

FAQ

What is the maximum recommended load capacitance for maintaining <0.25 ns propagation delay?

The 0.25 ns propagation delay specification assumes a 50 pF load capacitance with 500 Ω termination, per the DS40259 Rev 1-2 test conditions. At 100 pF, RC time constant increases to ~0.5 ns, degrading delay predictability. For designs exceeding 50 pF, verify signal integrity via IBIS simulation using the official Diodes IBIS model for PI3C3306.

Can PI3C3306LEX operate with VCC = 2.5 V while interfacing with 3.3 V GPIOs?

Yes - the device supports 5 V-tolerant I/Os, meaning A1/B1/A2/B2 pins accept 0–5 V signals regardless of VCC. With VCC = 2.5 V, it safely switches 3.3 V logic levels without damage or level-shifting circuitry, provided input voltages remain within −0.5 V to +5.5 V absolute maximum ratings.

Is thermal pad connection required for PI3C3306LEX in TSSOP-8 package?

No - the PI3C3306LEX in TSSOP-8 (package code L) has no exposed thermal pad. Its thermal performance relies on standard PCB copper pour under the body and traces. θJA is specified at 120°C/W with JEDEC-standard 2S2P board; no solder paste or thermal via modifications are needed for nominal 500 µA ICC operation.

How does the active-LOW enable affect hot-insertion sequencing?

Active-LOW enables allow BE1/BE2 to default HIGH (disconnected) during power-up, preventing unintended bus connection before VCC stabilizes. This inherent fail-safe behavior - combined with 1.5 ns minimum disable time - ensures clean break-before-make transitions essential for hot-plug safety in modular backplanes and docking stations.