Diodes Incorporated PI3CH400ZBEX-13R

Overview

PI3CH400ZBEX-13R from Diodes Incorporated is a 4-bit, low-voltage bus switch with active-low enables, designed for high-bandwidth signal routing in 1.8V/2.5V/3.3V systems. It delivers 500 MHz bandwidth, <0.3 ns propagation delay, 4–8 Ω on-resistance (depending on supply), 5V I/O tolerance, and hot-plug capability - enabling reliable data switching in backplane and docking interfaces.

For engineers reviewing the PI3CH400ZBEX-13R datasheet, PI3CH400ZBEX-13R pinout, PI3CH400ZBEX-13R application, or PI3CH400ZBEX-13R equivalent, key selection criteria include rail-to-rail analog switching range, enable timing (1.5–25 ns disable time), ESD robustness (8 kV HBM), and QFN-14 package compatibility with high-density PCB layouts.

Technical Context

The PI3CH400ZBEX-13R implements four independent bidirectional analog/digital switches controlled by three active-low enables (EN0–EN2), each selecting one of four A/B channel pairs. Its CMOS transmission-gate architecture supports beyond-rail operation: 0–5 V switching at 3.3 V VCC, 0–3.3 V at 2.5 V VCC, and 0–1.8 V at 1.8 V VCC.

It features 5 V-tolerant I/O pins regardless of supply state (ON/OFF), integrated clamp diodes (VIK = –0.7 to –1.8 V), and ultra-low dynamic power consumption (ICC ≤ 0.5 mA). The device avoids ground bounce and adds negligible RC delay (<0.3 ns time constant with 10 pF load), making it suitable for DDR, PCIe, and USB signal path isolation.

Key Specifications

Pinout & Package

The PI3CH400ZBEX-13R is housed in a 14-pin QFN (3.5 mm × 3.5 mm, 0.5 mm pitch) with wettable flank leads and exposed thermal pad. Pin 1 orientation is marked on top surface per ordering code "-13R".

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 4-bit bus switch applications.

Compared with SN74CBT3244PWR and TS3A27518EGET, the PI3CH400ZBEX-13R uniquely combines 500 MHz bandwidth, 5 V I/O tolerance, and beyond-rail analog switching - making it the only option among the three qualified for hot-plug DDR2 and PCIe Gen2 signal routing in industrial backplanes.

Availability

PI3CH400ZBEX-13R is available at Aetrix Electronics and suitable for PCIe Gen2 routing, USB 2.0 hot-docking, and DDR2 memory multiplexing requiring stable component supply across extended temperature and high-reliability production cycles.

Supply support for PI3CH400ZBEX-13R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and ICs, specializing in high-performance analog, logic, and power solutions for industrial, computing, and communications markets.

The PI3CH400 belongs to Diodes' high-speed analog switch product line, engineered specifically for hot-plug-capable, rail-to-rail signal routing in multi-voltage backplane and docking architectures.

FAQ

What is the maximum allowable input voltage on A/B pins when VCC = 0 V?

The PI3CH400ZBEX-13R supports 5 V I/O tolerance in both ON and OFF states. When VCC = 0 V, A/B pins withstand up to 6.0 V DC (absolute maximum rating) without damage or latch-up, enabling safe hot-insertion into powered backplanes before supply stabilization.

Does the device require external pull-up resistors on enable pins?

Yes - the datasheet specifies that a pull-up resistor must be provided on each ENx pin for power-up protection. Without it, enables float during power ramp-up, risking unintended channel conduction and potential bus contention in live systems.

Can PI3CH400ZBEX-13R switch analog video signals like CVBS?

Yes - its rail-to-rail capability (0–5 V at 3.3 V VCC), 500 MHz bandwidth, and low THD support CVBS, S-Video, and component video routing. Measured crosstalk of –60 dB and 7 pF ON capacitance preserve signal fidelity up to 50 MHz without external compensation.

How does the thermal pad on the ZB package connect electrically?

The exposed thermal pad on the PI3CH400ZBEX-13R's QFN package is internally connected to GND (Pin 7). It must be soldered to a PCB ground plane using ≥4 thermal vias to ensure proper heat dissipation and EMI shielding - critical for maintaining <0.3 ns propagation delay stability under continuous 120 mA switching loads.