Diodes Incorporated PI3CH480ZHDEX

Overview

PI3CH480ZHDEX from Diodes Incorporated is a 4-channel, 2:1 analog multiplexer/demultiplexer with tri-state outputs, designed for high-bandwidth signal routing in 1.8V/2.5V/3.3V systems. It delivers 500 MHz bandwidth, <0.3 ns propagation delay, 4–6 Ω on-resistance, and rail-to-rail switching (0–5 V with 3.3 V supply), enabling low-distortion video, USB 2.0, and PCIe Gen1 signal path management.

For engineers reviewing the PI3CH480ZHDEX datasheet, PI3CH480ZHDEX pinout, PI3CH480ZHDEX application, or PI3CH480ZHDEX equivalent, key selection criteria include hot-plug capability, 8 kV HBM ESD rating, 5 V I/O tolerance across all supply states, and UQFN3x3-16 (ZHD) package compatibility with high-density PCB layouts.

Technical Context

The PI3CH480ZHDEX implements four independent bidirectional 2:1 analog switches controlled by a single select (S) and active-low enable (EN) input per channel group. Each switch supports rail-to-rail analog voltage ranges up to 5 V with 3.3 V supply, and maintains 5 V I/O tolerance regardless of VCC state - critical for backplane hot-insertion scenarios.

Its architecture eliminates ground bounce and adds no measurable propagation delay beyond RC time constant (~0.3 ns for 10 pF load), while achieving –60 dB crosstalk and off-isolation. Switching is fully characterized at 1.8 V, 2.5 V, and 3.3 V supplies with monotonic on-resistance behavior across input voltage range.

Key Specifications

Pinout & Package

PI3CH480ZHDEX is housed in a 16-pin UQFN3x3 mm package (ZHD) with exposed thermal pad connected to GND. Pin 1 is marked by a dot; center pad is internally tied to GND and must be soldered for thermal and electrical performance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar analog multiplexer applications.

Compared with TS3USB30E and MAX4994E, PI3CH480ZHDEX uniquely combines quad-channel integration, 500 MHz bandwidth, sub-0.3 ns delay, and true 5 V I/O tolerance across all supply states - making it optimal for high-reliability, multi-signal, mixed-voltage routing in industrial and telecom infrastructure.

Availability

PI3CH480ZHDEX is available at Aetrix Electronics and suitable for USB 2.0 interface design, PCIe Gen1 lane sharing, and industrial sensor signal aggregation requiring stable component supply across extended temperature and mixed-voltage environments.

Supply support for PI3CH480ZHDEX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and integrated circuits, specializing in high-performance analog, logic, and power management solutions for industrial, computing, and communications markets.

The PI3CH480ZHDEX belongs to Diodes' Pericom analog switch product line, engineered specifically for high-bandwidth, low-distortion signal routing in hot-pluggable, mixed-voltage systems such as telecom backplanes and portable docking stations.

FAQ

What is the maximum allowable input voltage when VCC = 0 V?

The PI3CH480ZHDEX guarantees 5 V I/O tolerance in both ON and OFF states - meaning inputs and outputs remain protected up to +6.0 V DC even with VCC unpowered. This enables safe connection to live backplane traces during hot insertion without risk of latch-up or permanent damage, provided transient duration stays within JEDEC stress limits.

Does the device support 1.8 V logic control with 3.3 V analog signal routing?

Yes. The control inputs (S and EN) accept 1.8 V logic levels while VCC = 3.3 V, and the analog path supports 0–5 V signals. VIH is guaranteed ≥2.0 V and VIL ≤0.8 V at 3.3 V supply, ensuring reliable switching with 1.8 V CMOS drivers - eliminating need for level translators in mixed-voltage FPGA or SoC interfaces.

How does the UQFN3x3-16 (ZHD) package affect thermal performance?

The ZHD package features an exposed thermal pad tied to GND, enabling direct PCB copper pour connection for enhanced heat dissipation. With 0.5 W maximum power dissipation and junction-to-board thermal resistance of ~40 °C/W (typical), it sustains continuous operation at full load in industrial ambient temperatures when properly mounted on ≥2 oz copper with ≥4 thermal vias under the pad.

Can PI3CH480ZHDEX replace PI3CH480LEX in existing TSSOP-based designs?

No - the ZHD (UQFN) and LEX (TSSOP) packages are physically incompatible due to different footprint, pitch (0.4 mm vs. 0.65 mm), and soldering requirements. While electrically identical, migration requires PCB redesign, stencil revision, and requalification of thermal and signal-integrity performance - especially for high-frequency traces routed near the smaller ZHD body.