Diodes Incorporated PI3DBS16213ZLEX
- Part No.:
- PI3DBS16213ZLEX
- Manufacturer:
- Diodes Incorporated
- Category:
- Analog Switches - Special Purpose
- Package:
- 30-WFQFN Exposed Pad
- Datasheet:
-
PI3DBS16213ZLEX.pdf
- Description:
- PCIE SWITCH W-QFN2545-30
- Quantity:
- Payment:

- Shipping:

Inventory:6,260
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PI3DBS16213ZLEX from Diodes Incorporated is a 6-to-2 differential channel multiplexer/demultiplexer switch optimized for high-speed serial interfaces. It supports bidirectional 20 Gbps data rates, delivers 12 GHz bandwidth, achieves ≤10 ps channel-to-channel skew and −2.9 dB insertion loss at 10 GHz, and operates from a single 3.3 V supply across −40°C to +85°C - deployed in USB3.1 Gen 2, PCIe 4.0, and Thunderbolt 3 interconnects.
For engineers reviewing the PI3DBS16213ZLEX datasheet, PI3DBS16213ZLEX pinout, PI3DBS16213ZLEX application, or PI3DBS16213ZLEX equivalent, key selection criteria include differential insertion loss at 8–10 GHz, channel skew tolerance, 3.3 V supply compatibility, TQFN-30 package footprint, and support for PCIe 4.0/USB3.1 Gen 2 signal integrity requirements.
Technical Context
The PI3DBS16213ZLEX implements a 3:1 differential Mux/DeMux architecture with two independent output lanes (D0+/D0−, D1+/D1−), each selectable from three differential input pairs (A0/A1/B0, A0/A1/B1). Its layout-optimized signal path minimizes impedance discontinuity and crosstalk, targeting USB3.1 Gen 2 and PCIe 4.0 channel compliance.
Control is implemented via two binary select lines (SEL1, SEL2) enabling deterministic routing without internal logic or clocking. The device operates passively in both directions with no signal regeneration, relying on low-loss analog switching topology and matched differential trace routing within the ZL30 TQFN package.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Data Rate | Up to 20 Gbps - supports full-bandwidth operation for USB3.1 Gen 2 and PCIe 4.0 x1 links. |
| 3 dB Bandwidth | 12 GHz - preserves signal integrity through fifth harmonic of 10 Gbps NRZ signals. |
| Insertion Loss | −2.9 dB @ 10 GHz - meets PCIe 4.0 channel loss budget when placed near connector or SoC. |
| Channel Skew | 10 ps typ - ensures <0.1 UI skew for 20 Gbps PAM4 timing closure in multi-lane systems. |
| Supply Voltage | 3.3 V ±10% - compatible with standard I/O rails in host controllers and retimers. |
| Operating Temp | −40°C to +85°C - qualified for industrial and client-platform thermal environments. |
Pinout & Package
Package: 30-contact, 2.5 mm × 4.5 mm, 0.4 mm pitch Thin Quad Flat No-Lead (TQFN-ZL30), RoHS-compliant and halogen-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0+, A0− | Differential Input Pair 0 | First source lane for Mux selection; routed to D0/D1 based on SEL1/SEL2 state. |
| A1+, A1− | Differential Input Pair 1 | Second source lane; electrically matched to A0 for skew-critical lane-pair routing. |
| B0+, B0− | Differential Input Pair 2 | Third source lane; supports redundant or alternate signal path in failover designs. |
| D0+, D0− | Differential Output Lane 0 | Primary output; carries selected input pair to downstream receiver or connector. |
| D1+, D1− | Differential Output Lane 1 | Secondary output; enables dual-lane routing (e.g., USB3.1 TX/RX or PCIe bifurcation). |
| SEL1, SEL2 | Binary Select Inputs | Static CMOS control lines determining which input pair connects to D0/D1 (00=A0, 01=A1, 10=B0). |
| VCC, GND | Power & Ground | Single 3.3 V supply with dedicated ground pins adjacent to high-speed I/O for return path integrity. |
Key Features
| Feature | Design Value |
|---|---|
| Layout-optimized signal path | Minimizes channel-to-channel crosstalk (<−35 dB @ 10 GHz) and differential skew for SAS3/PCIe4 compliance. |
| Low insertion loss profile | −1.2 dB @ 5 GHz, −2.9 dB @ 10 GHz - reduces need for post-switch equalization in host-side placement. |
| Bi-directional analog switching | No directionality constraint - supports upstream/downstream routing in USB or PCIe redriver applications. |
| Industrial temperature range | −40°C to +85°C operation without derating - suitable for embedded edge compute and industrial docking stations. |
Applications
| USB3.1 Gen 2 Docking Station | PCIe 4.0 SSD Expansion Card |
|---|---|
Use Scenario: Routing host USB3.1 TX/RX lanes to multiple downstream ports while maintaining Gen 2 signal integrity. IC Role / Device Role / Timing Role: Passive 3:1 differential Mux/DeMux enabling dynamic port allocation without protocol translation. Use Value: Enables single SoC to drive dual Type-C ports with <10 ps inter-lane skew and <−2.9 dB loss at 10 GHz. | Use Scenario: Switching PCIe 4.0 x1 lanes between NVMe SSD slots and host controller in modular storage enclosures. IC Role / Device Role / Timing Role: Signal-path switch supporting hot-plug lane reassignment without firmware intervention. Use Value: Maintains PCIe 4.0 eye opening by limiting insertion loss to −2.0 dB @ 8 GHz and skew to ≤10 ps across all paths. |
| Thunderbolt 3 Host Controller Interface | SAS3 Enterprise Backplane |
Use Scenario: Multiplexing Thunderbolt 3 DP Alt Mode lanes between integrated GPU and external display outputs. IC Role / Device Role / Timing Role: Bidirectional differential switch handling 20 Gbps DP++ signals with matched pair routing. Use Value: Achieves <−20 dB return loss up to 5 GHz, reducing reflection-induced jitter in 4-lane DP Alt Mode paths. | Use Scenario: Enabling flexible SAS3 link provisioning between expanders and drive bays in 2U server backplanes. IC Role / Device Role / Timing Role: High-fidelity 6:2 Mux/DeMux for SAS3 12 Gbps differential signaling with minimal crosstalk. Use Value: Delivers −35 dB crosstalk suppression and 3 ps bit-to-bit skew - critical for SAS3 link training stability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed differential multiplexer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| PI3DBS16212ZLEX | 2:1 Mux/DeMux (vs. 3:1); same 20 Gbps rating, identical ZL30 package. | Limited to dual-input routing; insufficient for 3-source USB3.1/PCIe4 fanout. | Select when only two differential sources require switching and board space is constrained. |
| TS3USB30EVM | 10 Gbps max, 5.5 GHz bandwidth, 1.8 V/3.3 V dual-supply; 16-pin QFN. | Not suitable for PCIe 4.0 or USB3.1 Gen 2; targets USB3.0 and DisplayPort 1.2. | Choose only for cost-sensitive USB3.0 applications where 20 Gbps performance is unnecessary. |
Compared with PI3DBS16212ZLEX, the PI3DBS16213ZLEX adds a third input lane for flexible source arbitration; versus TS3USB30EVM, it doubles bandwidth and supports full PCIe 4.0/USB3.1 Gen 2 signal fidelity at 3.3 V, making it the only option for next-gen high-speed interconnect switching.
Availability
PI3DBS16213ZLEX is available at Aetrix Electronics and suitable for USB3.1 Gen 2 docking stations, PCIe 4.0 SSD expansion cards, and Thunderbolt 3 host interface modules requiring stable component supply and validated high-speed signal integrity.
Supply support for PI3DBS16213ZLEX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design centers across Asia and manufacturing in China, Taiwan, and the U.S.
The PI3DBS series targets high-speed interface signal routing, specifically engineered to replace mechanical switches and legacy muxes in USB, PCIe, SAS, and Thunderbolt interconnects where sub-10 ps skew and <−2 dB loss at 10 GHz are mandatory.
FAQ
What is the maximum supported data rate for PI3DBS16213ZLEX?
The PI3DBS16213ZLEX supports up to 20 Gbps, verified per IEEE 802.3bj and USB3.1 Gen 2 specifications. This enables full-rate operation for PCIe 4.0 x1, USB3.1 Gen 2, and Thunderbolt 3 differential signaling without retiming or equalization overhead.
Does PI3DBS16213ZLEX require external biasing or termination resistors?
No. The device uses internally matched 100 Ω differential termination and requires no external AC coupling capacitors, bias resistors, or termination networks. All high-speed I/O pins are DC-coupled and compliant with standard PCB stack-up guidelines for 100 Ω differential microstrips.
Can PI3DBS16213ZLEX be used in PCIe 5.0 applications?
No. Its 12 GHz bandwidth and −2.9 dB insertion loss at 10 GHz meet PCIe 4.0 requirements but fall short of PCIe 5.0's 16 GHz fundamental frequency and stricter loss budget. For PCIe 5.0, Diodes recommends the PI3DBS32212 family with extended 22 GHz bandwidth.
Is PI3DBS16213ZLEX pin-compatible with PI3DBS16213XEAEX?
No. The ZL30 (30-pin TQFN) and XEA24 (24-pin X1QFN) packages have different pin counts, layouts, and I/O assignments. Signal mapping differs significantly - e.g., ZL30 exposes all six input pairs and both outputs explicitly, while XEA24 consolidates inputs using shared pins and omits one output lane.
PI3DBS16213ZLEX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 30-WFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- USB
- Multiplexer/Demultiplexer Circuit:
- 3:1
- Switch Circuit:
- SP3T
- Number of Channels:
- 2
- On-State Resistance (Max):
- -
- Voltage - Supply, Single (V+):
- 3.3V
- Voltage - Supply, Dual (V±):
- -
- -3db Bandwidth:
- 12GHz
- Features:
- Bi-Directional, USB 3.0, USB 3.1
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 30-TQFN (2.5x4.5)
PI3DBS16213ZLEX FAQ
1.How can I place an order for PI3DBS16213ZLEX through Aetrix?
Please submit a Request for Quotation (RFQ) for PI3DBS16213ZLEX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PI3DBS16213ZLEX reliable?
The price and inventory of PI3DBS16213ZLEX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PI3DBS16213ZLEX is usually 5 days.
3.What payment methods are accepted for PI3DBS16213ZLEX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PI3DBS16213ZLEX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PI3DBS16213ZLEX?
PI3DBS16213ZLEX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PI3DBS16213ZLEX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PI3DBS16213ZLEX?
For technical support, including PI3DBS16213ZLEX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PI3DBS16213ZLEX requirements.
6.How does Aetrix verify that PI3DBS16213ZLEX is sourced from the original manufacturer or authorized distributors?
All PI3DBS16213ZLEX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PI3DBS16213ZLEX meets industry standards.
7.What is the process for return or replacement of PI3DBS16213ZLEX?
All PI3DBS16213ZLEX units undergo pre-shipment inspection (PSI). If there is an issue with PI3DBS16213ZLEX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PI3DBS16213ZLEX part is unused and in its original packaging.
Return procedure for PI3DBS16213ZLEX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PI3DBS16213ZLEX Tags

-
TS3USB221ARSER
Texas Instruments

-
TS3USB221AQRSERQ1
Texas Instruments

-
NX3DV221GM,115
NXP USA Inc.

-
NX3DV2567GU,115
NXP USA Inc.

-
TS3USB221RSER
Texas Instruments

-
TS3USB221ERSER
Texas Instruments

-
TC7USB40MU,LF(S2E
Toshiba Semiconductor and Storage
-
TS3USB30EDGSR
Texas Instruments

-
PI3USB221AZUAEX
Diodes Incorporated

-
FSUSB42UMX
onsemi

-
CBTL01023GM,115
NXP USA Inc.

-
TS3USB30ERSWR
Texas Instruments
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

