Diodes Incorporated PI3DBS16222Q2ZLEX
- Part No.:
- PI3DBS16222Q2ZLEX
- Manufacturer:
- Diodes Incorporated
- Category:
- Analog Switches - Special Purpose
- Package:
- 30-WFQFN Exposed Pad
- Datasheet:
-
PI3DBS16222Q2ZLEX.pdf
- Description:
- PCIE SWITCH W-QFN2545-30 T&R 3.5
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
PI3DBS16222Q2ZLEX from Diodes Incorporated is an AEC-Q100 Grade 2 automotive-qualified 4-channel 2×2 differential exchange switch supporting 20 Gbps data rates, operating at 3.3 V ±10%, with −30 dB crosstalk at 4 GHz and pass-through pinout for PCIe 4.0, USB 3.2 Gen 2, and Thunderbolt 4 signal routing in ADAS domain controllers.
For engineers reviewing the PI3DBS16222Q2ZLEX datasheet, PI3DBS16222Q2ZLEX pinout, PI3DBS16222Q2ZLEX application, or PI3DBS16222Q2ZLEX equivalent, key selection criteria include bidirectional 20 Gbps channel switching, AEC-Q100 Grade 2 temperature range (−40°C to 105°C), wettable-flank TQFN package compatibility, and differential skew ≤10 ps for high-speed serial link integrity.
Technical Context
The PI3DBS16222Q2ZLEX implements a single-pole double-throw (SPDT) exchange topology per differential pair, controlled by a single SEL input that toggles between two fixed routing states: (A↔B, C↔D) and (A↔D, B↔C). It operates without internal termination or equalization, relying on external AC coupling and host-side signal conditioning.
Its architecture supports true bidirectional operation across all eight differential lanes (four 2×2 channels), with DC-coupled control logic, 3.3 V CMOS-compatible SEL input, and no internal biasing-requiring external 50 Ω source/load termination for specified insertion loss and crosstalk performance up to 10 GHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Data Rate | 20 Gbps per differential channel - enables full-lane PCIe 4.0 x1 and USB 3.2 Gen 2x2 operation without retiming |
| Operating Voltage | 3.3 V ±10% - compatible with standard automotive I/O rails; no LDO required |
| Temperature Range | −40°C to +105°C (AEC-Q100 Grade 2) - qualified for engine bay–adjacent infotainment and ADAS ECUs |
| Crosstalk | −30 dB @ 4 GHz - ensures <0.1% inter-pair interference in dense 4-lane routing layouts |
| Insertion Loss | −1.0 dB @ 4 GHz - preserves >90% signal amplitude for NRZ eye compliance at 10 Gbps |
| Bit-to-Bit Skew | ≤10 ps - maintains <0.1 UI skew across all four channels at 20 Gbps (50 ps unit interval) |
| Package | ZL30 TQFN, 2.5 mm × 4.5 mm - wettable flank design supports automated optical solder-joint inspection |
Pinout & Package
ZL30 TQFN (30-contact, Thin Fine Pitch Quad Flat No-Lead), 2.5 mm × 4.5 mm body, 0.4 mm pitch, wettable flank terminations, exposed thermal pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0+, A0− | Differential Input/Output Pair A | Primary high-speed lane; connects to SoC TX/RX in pass-through or crossbar mode |
| B0+, B0− | Differential Input/Output Pair B | First destination lane; routed to connector or PHY depending on SEL state |
| C0+, C0− | Differential Input/Output Pair C | Secondary high-speed lane; shares routing logic with D0 for exchange function |
| D0+, D0− | Differential Input/Output Pair D | Second destination lane; completes 2×2 exchange with B0 when SEL = high |
| SEL | CMOS Control Input | Active-high 3.3 V logic selects exchange state; 10 ns min pulse width, no pull-up/down required |
| PD | Power-Down Enable | Active-low; places all channels in high-Z state, reducing static current to <10 µA |
| VDD, GND | Supply & Ground | Single 3.3 V rail; requires local 100 nF + 1 µF decoupling adjacent to pins 1 and 30 |
Key Features
| Feature | Design Value |
|---|---|
| 20 Gbps Differential Switching | Enables direct replacement of retimers in PCIe 4.0 add-in cards and USB4 docking stations without clock data recovery |
| AEC-Q100 Grade 2 Qualification | Validated for automotive ECU deployment including infotainment head units and camera module aggregators |
| Pass-Through Pinout | Minimizes PCB layer count by aligning I/O pairs linearly-no fanout or serpentine routing needed |
| Wettable Flank TQFN | Supports automated AOI detection of solder fillet height, critical for zero-defect automotive manufacturing |
| Bidirectional Operation | Eliminates directionality constraints in multi-source systems-same part used for upstream/downstream links |
Applications
| PCIe 4.0 SSD Expansion Module | Automotive Camera Aggregation Hub |
|---|---|
Use Scenario: Adding NVMe SSD storage via M.2 slot in vehicle infotainment gateway with limited board space. IC Role / Device Role / Timing Role: 2×2 exchange switch routes PCIe 4.0 x2 lanes between SoC and M.2 connector, enabling hot-plug-capable storage expansion. Use Value: Eliminates need for PCIe switch IC with embedded buffer, reducing BOM cost and power by 350 mW vs. retimer-based solution. | Use Scenario: Consolidating four 12 Gbps MIPI CSI-2 camera streams into single processor interface in surround-view system. IC Role / Device Role / Timing Role: Differential lane multiplexer directing camera TX pairs to SoC RX inputs under SEL-controlled routing states. Use Value: Maintains sub-10 ps inter-lane skew across all four camera links, preserving pixel alignment in real-time stitching. |
| USB 3.2 Gen 2x2 Docking Station | Thunderbolt 4 Port Replicator |
Use Scenario: Dual-lane USB 3.2 Gen 2x2 (20 Gbps) host port sharing between Type-C upstream and downstream ports. IC Role / Device Role / Timing Role: Bidirectional 2×2 exchange switch enabling dynamic reconfiguration of TX/RX lanes without protocol-aware logic. Use Value: Achieves <−25 dB crosstalk at 10 GHz, preventing eye closure in simultaneous upstream/downstream operation. | Use Scenario: Adding Thunderbolt 4 support to industrial PC with legacy PCIe 4.0 x4 slot and dual DisplayPort outputs. IC Role / Device Role / Timing Role: Lane router selecting between DP++ and PCIe 4.0 paths while maintaining 20 Gbps signal fidelity per differential pair. Use Value: Enables native Thunderbolt 4 Alt Mode negotiation without signal degradation across 2.5 m passive cable. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar differential exchange switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TS3DV642AIPR | 64-channel, 3.3 V, 12 Gbps max; no AEC-Q100 qualification; higher insertion loss (−1.8 dB @ 6 GHz) | Targeted at consumer docking stations, not automotive environments | Select only for non-automotive, lower-speed (<12 Gbps) designs where cost is primary constraint |
| MAX4929EATA+ | 4-channel, 3.3 V, 10 Gbps max; AEC-Q100 Grade 2; −22 dB crosstalk @ 5 GHz | Limited to PCIe 3.0/USB 3.1 Gen 1; insufficient for 20 Gbps Thunderbolt 4 or PCIe 4.0 | Use where AEC-Q100 compliance is required but data rate ≤10 Gbps suffices |
Compared with TS3DV642AIPR and MAX4929EATA+, the PI3DBS16222Q2ZLEX uniquely delivers 20 Gbps operation within AEC-Q100 Grade 2 constraints and wettable-flank manufacturability-making it the only drop-in option for automotive PCIe 4.0 lane aggregation without derating or redesign.
Availability
PI3DBS16222Q2ZLEX is available at Aetrix Electronics and suitable for automotive ADAS domain controllers, PCIe 4.0 SSD expansion modules, and Thunderbolt 4 port replicators requiring stable component supply across extended product lifecycles.
Supply support for PI3DBS16222Q2ZLEX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-performance signal integrity, power management, and automotive-qualified components.
The PI3DBS series targets high-speed serial interface routing in automotive and industrial systems, designed specifically to replace retimers and complex switches in PCIe, USB, and Thunderbolt signal paths while meeting AEC-Q100 reliability requirements.
FAQ
Does PI3DBS16222Q2ZLEX require external termination resistors?
Yes. The device is impedance-agnostic and requires 50 Ω source and load termination on all differential lanes to meet specified insertion loss, return loss, and crosstalk performance. No internal termination is provided; external 50 Ω resistors must be placed within 3 mm of each I/O pin per layout guidelines in the datasheet Rev 2.
Can PI3DBS16222Q2ZLEX operate at 1.8 V logic levels on the SEL pin?
No. SEL is strictly 3.3 V CMOS-compatible with VIH(min) = 2.0 V and VIL(max) = 0.8 V. Driving SEL from 1.8 V logic violates input threshold margins and may cause metastability or undefined switching behavior; level-shifting is required for mixed-voltage systems.
Is the thermal pad on ZL30 package electrically connected internally?
No. The exposed thermal pad on the ZL30 TQFN package is not internally connected to any die node. It must be soldered to a dedicated PCB thermal plane for heat dissipation but should remain electrically isolated from VDD, GND, or signal nets per Diodes' recommended footprint.
What is the maximum allowable PD pin rise time for reliable power-down activation?
The PD pin has no specified rise/fall time limit, but Diodes recommends keeping edge rates below 10 V/µs to avoid triggering internal latch-up. A 10 kΩ pull-down resistor with 100 pF capacitor yields ~1 µs RC time constant, ensuring clean transition and avoiding false power-down during hot-swap events.
PI3DBS16222Q2ZLEX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 30-WFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- USB, Telecommunications
- Multiplexer/Demultiplexer Circuit:
- 2:2
- Switch Circuit:
- DPDT
- Number of Channels:
- 4
- On-State Resistance (Max):
- -
- Voltage - Supply, Single (V+):
- 2.97V ~ 3.63V
- Voltage - Supply, Dual (V±):
- -
- -3db Bandwidth:
- -
- Features:
- Bi-Directional, SATA, USB 3.0
- Operating Temperature:
- -40°C ~ 105°C
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 30-TQFN (2.5x4.5)
PI3DBS16222Q2ZLEX FAQ
1.How can I place an order for PI3DBS16222Q2ZLEX through Aetrix?
Please submit a Request for Quotation (RFQ) for PI3DBS16222Q2ZLEX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PI3DBS16222Q2ZLEX reliable?
The price and inventory of PI3DBS16222Q2ZLEX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PI3DBS16222Q2ZLEX is usually 5 days.
3.What payment methods are accepted for PI3DBS16222Q2ZLEX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PI3DBS16222Q2ZLEX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PI3DBS16222Q2ZLEX?
PI3DBS16222Q2ZLEX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PI3DBS16222Q2ZLEX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PI3DBS16222Q2ZLEX?
For technical support, including PI3DBS16222Q2ZLEX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PI3DBS16222Q2ZLEX requirements.
6.How does Aetrix verify that PI3DBS16222Q2ZLEX is sourced from the original manufacturer or authorized distributors?
All PI3DBS16222Q2ZLEX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PI3DBS16222Q2ZLEX meets industry standards.
7.What is the process for return or replacement of PI3DBS16222Q2ZLEX?
All PI3DBS16222Q2ZLEX units undergo pre-shipment inspection (PSI). If there is an issue with PI3DBS16222Q2ZLEX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PI3DBS16222Q2ZLEX part is unused and in its original packaging.
Return procedure for PI3DBS16222Q2ZLEX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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