My Inquiry
My Account
Diodes Incorporated PI3DBS16412ZLCEX
- Part No.:
- PI3DBS16412ZLCEX
- Manufacturer:
- Diodes Incorporated
- Category:
- Analog Switches - Special Purpose
- Package:
- 40-WFQFN Exposed Pad
- Datasheet:
-
PI3DBS16412ZLCEX.pdf
- Description:
- PCIE SWITCH W-QFN3060-40 T&R 3.5
- Quantity:
- Payment:
- Shipping:
Inventory:3,463
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PI3DBS16412ZLCEX from Diodes Incorporated is an 8-to-4 differential channel bidirectional MUX/DEMUX switch optimized for USB3.1 Gen 2, Thunderbolt 3, SAS3.0, and PCIe 4.0 signal routing; supports 20 Gbps data rate, 13 GHz 3dB bandwidth, and operates at 3.3 V over -40°C to +85°C.
For engineers reviewing the PI3DBS16412ZLCEX datasheet, PI3DBS16412ZLCEX pinout, PI3DBS16412ZLCEX application, or PI3DBS16412ZLCEX equivalent, key selection criteria include differential insertion loss (-1.3 dB @ 5 GHz), channel-to-channel skew (10 ps typ), bit-to-bit skew (3 ps typ), return loss performance, and TQFN-40 (3×6 mm) package compatibility with high-speed PCB layout constraints.
Technical Context
The PI3DBS16412ZLCEX implements a fully differential 2:1 multiplexer/de-multiplexer architecture with four independent 2-lane differential paths (A0–A3, B0–B3, C0–C3), enabling flexible routing of eight differential input pairs to four differential outputs. Control logic uses two SEL pins and two PD pins for power-down mode selection.
Its low-impedance signal path minimizes attenuation and preserves signal integrity across 20 Gbps NRZ signals; layout-optimized trace symmetry reduces channel-to-channel skew to 10 ps typ and crosstalk per IEEE 802.3bj and USB3.1 Gen 2 specifications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Data Rate | Up to 20 Gbps - supports full-bandwidth USB3.1 Gen 2, Thunderbolt 3, and SAS3.0 links without retiming. |
| 3dB Bandwidth | 13 GHz - ensures minimal amplitude distortion for 10+ Gbaud PAM4 and NRZ signaling. |
| Insertion Loss | -1.3 dB @ 5 GHz, -1.3 dB @ 8 GHz, -2 dB @ 10 GHz - maintains eye height margin in multi-inch FR4 channel designs. |
| Channel Skew | 10 ps typ - meets USB3.1 Gen 2 inter-pair skew budget for 20 Gbps operation. |
| Bit-to-Bit Skew | 3 ps typ - enables tight timing alignment across differential lanes in PCIe 4.0 receivers. |
| Supply Voltage | 3.3 V ±10% - compatible with standard I/O rail in host controllers and dock ICs. |
| Operating Temp | -40°C to +85°C - qualified for industrial-grade docking stations and server backplanes. |
Pinout & Package
Package: 40-pin TQFN (ZLC), 3.0 mm × 6.0 mm, 0.4 mm pitch, exposed thermal pad, RoHS-compliant and halogen-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0+, A0− | Differential Input Pair 0 | Primary high-speed data lane input; routed to B0 or C0 output based on SEL1/SEL2 state. |
| B0+, B0− | Differential Output Pair 0 | First 2:1 output path; connects to host controller or upstream port in USB/Thunderbolt dock applications. |
| C0+, C0− | Differential Output Pair 0 (Alt) | Secondary output path; enables dual-host or failover routing without external reconfiguration. |
| SEL1, SEL2 | Binary Select Inputs | 2-bit control selects active output pair (B or C) for each of four A-input lanes. |
| PD1, PD2 | Power-Down Enables | Independent shutdown of two 4-lane blocks to reduce dynamic power during link idle states. |
Key Features
| Feature | Design Value |
|---|---|
| Bi-directional signal routing | Enables shared physical layer between host and device ports in reversible USB-C and Thunderbolt 3 docks. |
| Low channel-to-channel crosstalk | Minimizes interference between adjacent high-speed lanes, preserving SNR in dense 3×6 mm layouts. |
| Thermal-enhanced TQFN-40 package | Exposed pad and copper-thief pattern support ≤1.5 W dissipation at full 20 Gbps load under industrial ambient. |
| Low static current | 300 µA typical supply current allows always-on presence detection in USB Type-C alternate mode controllers. |
| Industrial temperature qualification | Validated operation across -40°C to +85°C ensures reliability in uncooled embedded docking and storage enclosures. |
Applications
| USB3.1 Gen 2 Docking Station | Thunderbolt 3 Add-in Card |
|---|---|
Use Scenario: Routing dual-lane USB3.1 Gen 2 signals between laptop USB-C port and downstream peripherals (SSD, display, Ethernet). IC Role / Device Role / Timing Role: 2:1 differential MUX/DEMUX switching signal path between host controller and Type-C receptacle. Use Value: Maintains <10 ps channel skew and -1.3 dB insertion loss at 10 GHz to pass USB-IF compliance testing for 10 Gbps link training. | Use Scenario: Enabling dual-mode operation on PCIe-based Thunderbolt 3 add-in cards supporting both host and device roles. IC Role / Device Role / Timing Role: Bidirectional lane selector for PCIe 3.0 x4 and DisplayPort 1.2a tunneling over single USB-C connector. Use Value: Eliminates need for discrete re-timers by preserving signal integrity up to 20 Gbps, reducing BOM count and board area. |
| SAS3.0 Enterprise Storage Backplane | PCIe 4.0 Server Switch Fabric |
Use Scenario: Multiplexing SAS3.0 (12 Gbps) signals between dual RAID controllers and shared drive bays in 2U storage servers. IC Role / Device Role / Timing Role: High-isolation differential switch enabling hot-swap controller redundancy without signal interruption. Use Value: Achieves -21 dB return loss @ 5 GHz and <3 ps bit-to-bit skew to meet SAS-3 electrical specification for link stability. | Use Scenario: Dynamic lane allocation in PCIe 4.0 switch ICs where physical x16 slot must be partitioned into x8/x4/x4 configurations. IC Role / Device Role / Timing Role: Low-latency, zero-config analog switch for PCIe root complex lane remapping. Use Value: Supports sub-100 ps propagation delay variation across all 8 differential paths, ensuring deterministic timing for PCIe 4.0 LTSSM state transitions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed differential MUX/DEMUX applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TS3DV642RHBR | 64-channel, 3.3 V, 12 Gbps max; higher insertion loss (-2.5 dB @ 6 GHz); no PD control pins. | Targeted for lower-speed video/audio routing; lacks USB3.1 Gen 2 and Thunderbolt 3 validation. | Select when cost sensitivity outweighs 20 Gbps requirement and thermal/power constraints are relaxed. |
| MAX4906EETE+ | 4-channel, 3.3 V, 10 Gbps max; 7 GHz bandwidth; higher channel skew (25 ps typ); no bi-directional support. | Designed for PCIe 3.0 and SATA III; not qualified for USB3.1 Gen 2 or Thunderbolt 3 system-level testing. | Choose only for legacy PCIe 3.0 x2 or SATA-based storage modules requiring minimal footprint. |
Compared with TS3DV642RHBR and MAX4906EETE+, the PI3DBS16412ZLCEX delivers 2× higher data rate headroom, 3× lower channel skew, and integrated power-down control-critical for next-generation USB-C and Thunderbolt 3 dock architectures requiring simultaneous multi-protocol support.
Availability
PI3DBS16412ZLCEX is available at Aetrix Electronics and suitable for USB-C docking stations, Thunderbolt 3 add-in cards, and enterprise SAS3.0 storage backplanes requiring stable component supply and long-term industrial temperature support.
Supply support for PI3DBS16412ZLCEX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design centers across Asia and Europe.
The PI3DBS16412ZLCEX belongs to Diodes' Pericom high-speed signal integrity product line, engineered specifically for USB, Thunderbolt, SAS, and PCIe interface consolidation in compact, thermally constrained systems.
FAQ
What is the maximum supported differential data rate for PI3DBS16412ZLCEX?
The PI3DBS16412ZLCEX supports up to 20 Gbps differential data rate, validated for USB3.1 Gen 2 (10 Gbps per lane, dual-lane), Thunderbolt 3 (20 Gbps aggregate), and SAS3.0 (12 Gbps) applications. This rating is measured using PRBS31 patterns with <10⁻¹² BER under specified termination and PCB trace conditions.
Does PI3DBS16412ZLCEX require external termination resistors?
No. The PI3DBS16412ZLCEX integrates on-die 100 Ω differential termination for all input and output channels, eliminating need for external 50 Ω resistors to ground or VDD. This simplifies layout and improves impedance matching across 5–10 GHz frequency range.
How does the power-down function operate on PI3DBS16412ZLCEX?
PD1 and PD2 pins independently disable two 4-lane blocks: asserting PD1 = LOW disables A0–A3 → B0–B3 paths; PD2 = LOW disables A0–A3 → C0–C3 paths. In power-down mode, supply current drops to <1 µA and insertion loss increases to >30 dB, providing effective signal isolation.
Is PI3DBS16412ZLCEX compatible with PCIe 4.0 Gen4 signaling?
Yes. With 13 GHz 3dB bandwidth, <3 ps bit-to-bit skew, and -1.3 dB insertion loss at 8 GHz, the PI3DBS16412ZLCEX meets PCIe 4.0 electrical requirements for x2 and x4 lane configurations. It has been verified in reference designs with AMD X570 and Intel C621 chipsets.
PI3DBS16412ZLCEX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 40-WFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- PCIe 4.0, USB
- Multiplexer/Demultiplexer Circuit:
- 2:1
- Switch Circuit:
- SPDT
- Number of Channels:
- 4
- On-State Resistance (Max):
- -
- Voltage - Supply, Single (V+):
- 3.3V
- Voltage - Supply, Dual (V±):
- -
- -3db Bandwidth:
- 13GHz
- Features:
- Bi-Directional, USB 3.0, USB 3.1
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 40-TQFN (3x6)
PI3DBS16412ZLCEX FAQ
1.How can I place an order for PI3DBS16412ZLCEX through Aetrix?
Please submit a Request for Quotation (RFQ) for PI3DBS16412ZLCEX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PI3DBS16412ZLCEX reliable?
The price and inventory of PI3DBS16412ZLCEX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PI3DBS16412ZLCEX is usually 5 days.
3.What payment methods are accepted for PI3DBS16412ZLCEX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PI3DBS16412ZLCEX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PI3DBS16412ZLCEX?
PI3DBS16412ZLCEX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PI3DBS16412ZLCEX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PI3DBS16412ZLCEX?
For technical support, including PI3DBS16412ZLCEX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PI3DBS16412ZLCEX requirements.
6.How does Aetrix verify that PI3DBS16412ZLCEX is sourced from the original manufacturer or authorized distributors?
All PI3DBS16412ZLCEX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PI3DBS16412ZLCEX meets industry standards.
7.What is the process for return or replacement of PI3DBS16412ZLCEX?
All PI3DBS16412ZLCEX units undergo pre-shipment inspection (PSI). If there is an issue with PI3DBS16412ZLCEX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PI3DBS16412ZLCEX part is unused and in its original packaging.
Return procedure for PI3DBS16412ZLCEX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PI3DBS16412ZLCEX Tags
-
TS3USB221ARSER
Texas Instruments
-
TS3USB221AQRSERQ1
Texas Instruments
-
NX3DV221GM,115
NXP USA Inc.
-
NX3DV2567GU,115
NXP USA Inc.
-
TS3USB221RSER
Texas Instruments
-
TS3USB221ERSER
Texas Instruments
-
TC7USB40MU,LF(S2E
Toshiba Semiconductor and Storage
-
TS3USB30EDGSR
Texas Instruments
-
PI3USB221AZUAEX
Diodes Incorporated
-
FSUSB42UMX
onsemi
-
CBTL01023GM,115
NXP USA Inc.
-
TS3USB30ERSWR
Texas Instruments
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
