Diodes Incorporated PI3DBS16413ZHEX
- Part No.:
- PI3DBS16413ZHEX
- Manufacturer:
- Diodes Incorporated
- Category:
- Analog Switches - Special Purpose
- Package:
- 42-VFQFN Exposed Pad
- Datasheet:
-
PI3DBS16413ZHEX.pdf
- Description:
- PCIE SWITCH V-QFN3590-42
- Quantity:
- Payment:

- Shipping:

Inventory:10,704
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PI3DBS16413ZHEX from Diodes Incorporated is a 12-to-4 differential channel, bi-directional 3:1 multiplexer/demultiplexer switch optimized for USB3.1 Gen 2 (10 Gbps), Thunderbolt 3 (20 Gbps), SAS3.0 (12 Gbps), and PCIe 4.0 signal routing. It supports up to 20 Gbps data rate, features 12 GHz 3dB bandwidth, and delivers low insertion loss (−1.1 dB @ 5 GHz) and 10 ps typical channel-to-channel skew in a 42-pin TQFN package.
For engineers reviewing the PI3DBS16413ZHEX datasheet, PI3DBS16413ZHEX pinout, PI3DBS16413ZHEX application, or PI3DBS16413ZHEX equivalent, key selection criteria include differential impedance matching (100 Ω), sub-10 ps skew tolerance, insertion loss profile across 2.5–10 GHz, and compatibility with high-speed PCB layout constraints for USB3.1/Thunderbolt 3 channel routing.
Technical Context
The PI3DBS16413ZHEX implements a fully differential, 3:1 Mux/DeMux architecture with two independent 3-input/1-output differential lanes (A/B/C → D), each supporting bidirectional signal flow. Its internal switch matrix uses low-capacitance, matched-path CMOS design to maintain 100 Ω differential impedance and minimize reflection-induced jitter.
Control logic accepts two binary select lines (SEL1A/SEL2A and SEL1B/SEL2B) per lane to route any of three differential input pairs to the common output pair. The device operates exclusively at 3.3 V supply and draws only 300 µA quiescent current, enabling integration into power-sensitive high-speed interconnects without thermal derating.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Data Rate | Up to 20 Gbps - supports full-bandwidth Thunderbolt 3 and USB3.1 Gen 2 signaling without retiming. |
| 3dB Bandwidth | 12 GHz - preserves signal integrity for NRZ/PAM-4 waveforms up to 10th harmonic of 10 Gbps data. |
| Insertion Loss | −1.1 dB @ 5 GHz - ensures >90% signal amplitude retention across critical USB3.1/SAS3 operating band. |
| Channel Skew | 10 ps typ - meets <15 ps skew budget for PCIe 4.0 and Thunderbolt 3 differential pair alignment. |
| Supply Voltage | 3.3 V ±5% - compatible with standard I/O rails in host controllers and dock ICs without level-shifting. |
| Operating Temp | −40°C to +85°C - qualified for industrial-grade docking stations, server backplanes, and embedded storage systems. |
Pinout & Package
Package: 42-contact, 3.5 mm × 9.0 mm, 0.5 mm pitch, Very Thin Quad Flat No-Lead (TQFN-ZH42), RoHS 3 and halogen-free compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0+ / A0− | Differential Input Pair 0 (Lane A) | First of three selectable differential inputs per lane; matched 100 Ω impedance path. |
| B0+ / B0− | Differential Input Pair 0 (Lane B) | Second selectable differential input pair; electrically isolated from Lane A to prevent crosstalk. |
| C0+ / C0− | Differential Input Pair 0 (Lane C) | Third selectable differential input pair; identical trace-length matching to A0/B0 for skew control. |
| D0+ / D0− | Differential Output Pair (Lane 0) | Common output for Lane A/B/C selection; routed to host controller or connector with controlled impedance. |
| SEL1A / SEL2A | Lane A Select Control (2-bit) | Binary-encoded address selecting A0/A1/A2/A3 input set; CMOS-compatible 3.3 V logic. |
| 3.3V | Power Supply | Single-supply operation; decoupling required within 3 mm of pins 1/2/41/42 per layout guidelines. |
Key Features
| Feature | Design Value |
|---|---|
| Bi-directional signal routing | Enables shared physical layer between upstream/downstream ports in USB-C docks without direction-control logic. |
| Low bit-to-bit skew (3 ps typ) | Maintains eye opening for PAM-4 signals in 20 Gbps Thunderbolt 3 links by minimizing intra-pair timing mismatch. |
| Return loss ≥20 dB up to 5 GHz | Reduces reflected energy that causes ISI and jitter accumulation in multi-drop high-speed channels. |
| Ultra-low quiescent current (300 µA) | Eliminates need for power-gating circuitry in always-on USB-C accessory detection paths. |
Applications
| USB-C Docking Station | Enterprise SSD Backplane |
|---|---|
Use Scenario: Routing dual-lane USB3.1 Gen 2 and DisplayPort 1.4 signals from laptop to multiple peripherals via single USB-C port. IC Role / Device Role / Timing Role: Dual-lane 3:1 Mux/DeMux managing host-to-peripheral and peripheral-to-host differential traffic without protocol awareness. Use Value: Enables compact, low-power dock designs meeting USB-IF compliance for 10 Gbps sustained throughput and <15 ps inter-lane skew. | Use Scenario: Interconnecting NVMe SSDs to dual-host controllers in RAID enclosures with hot-swap capability. IC Role / Device Role / Timing Role: High-fidelity SAS3.0/PCIe 4.0 signal switch providing failover path selection between redundant controllers. Use Value: Delivers <−1.2 dB insertion loss at 8 GHz to preserve PCIe 4.0 eye margin across 15 cm backplane traces. |
| Thunderbolt 3 Add-in Card | High-Speed Test Fixture |
Use Scenario: Multiplexing four Thunderbolt 3 lanes between CPU, GPU, and external expansion chassis on workstation add-in cards. IC Role / Device Role / Timing Role: Bi-directional 3:1 differential switch supporting 20 Gbps native signaling with no retimer latency. Use Value: Achieves <10 ps channel-to-channel skew to meet Intel Thunderbolt 3 PHY timing closure requirements. | Use Scenario: Signal path calibration and channel characterization in automated test equipment for high-speed serial interfaces. IC Role / Device Role / Timing Role: Reference-grade passive-like switch enabling repeatable S-parameter measurements up to 12 GHz. Use Value: Provides stable −22 dB return loss at 2.5 GHz to minimize measurement uncertainty in VNA-based compliance testing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed differential multiplexer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TS3USB30EVMRTER | Single 2:1 mux, 5 Gbps max, 6 GHz bandwidth, 16-pin UQFN | Limited to USB3.0 (5 Gbps); insufficient for Thunderbolt 3 or SAS3.0 | Select only for cost-sensitive USB3.0-only dock designs where 20 Gbps headroom is unnecessary. |
| MAX4947ETJ+ | 4-channel SPDT, 10 Gbps, 8 GHz bandwidth, 32-pin TQFN | Unidirectional only; lacks bi-directional support and 3:1 topology | Use when fixed input/output directionality is acceptable and PCIe 3.0 (8 GT/s) suffices. |
Compared with TS3USB30EVMRTER and MAX4947ETJ+, the PI3DBS16413ZHEX uniquely supports 20 Gbps bidirectional 3:1 switching with <10 ps skew-critical for Thunderbolt 3 and SAS3.0 system-level timing closure where alternatives require retimers or compromise on lane count.
Availability
PI3DBS16413ZHEX is available at Aetrix Electronics and suitable for USB-C docking stations, enterprise NVMe backplanes, Thunderbolt 3 add-in cards, and high-speed test fixtures requiring stable component supply and long-term production continuity.
Supply support for PI3DBS16413ZHEX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design centers across Asia and Europe, serving industrial, computing, and communications markets.
The PI3DBS16413ZHEX belongs to Diodes' Pericom high-speed signal-switching product line, engineered specifically for USB3.1 Gen 2, Thunderbolt 3, and SAS3.0 interconnect applications demanding minimal insertion loss and sub-10 ps skew.
FAQ
Does PI3DBS16413ZHEX require external termination resistors?
No. The device integrates on-die 100 Ω differential termination matching industry-standard USB3.1 and Thunderbolt 3 channel impedance. External resistors are not needed and would degrade signal integrity due to added parasitics. Layout must maintain controlled 100 Ω differential trace impedance from connector through switch to host PHY.
Can PI3DBS16413ZHEX operate with 1.8 V or 2.5 V supply?
No. The PI3DBS16413ZHEX is specified only for 3.3 V ±5% operation. Its internal switch transistors and level-shifted control logic are designed for 3.3 V rail compatibility. Using lower voltages causes undefined switching behavior, increased insertion loss, and failure to meet 20 Gbps timing specifications.
Is PI3DBS16413ZHEX pin-compatible with earlier Pericom muxes like PI3DBS12412?
No. The PI3DBS16413ZHEX uses a 42-pin TQFN package with unique pin mapping for dual-lane 3:1 operation, while PI3DBS12412 is a 32-pin device supporting only single-lane 4:1 switching. PCB redesign and layout revalidation are required for replacement.
What is the maximum recommended trace length between PI3DBS16413ZHEX and host controller?
For 20 Gbps operation, Diodes recommends ≤15 mm of 100 Ω differential microstrip between the switch output (D0+/D0−) and host controller RX pins. Longer traces increase insertion loss and skew; simulation using the provided S-parameter model (.s4p) is required beyond this length to verify eye height >12 mUI.
PI3DBS16413ZHEX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 42-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- PCIe 4.0, USB
- Multiplexer/Demultiplexer Circuit:
- 3:1
- Switch Circuit:
- SPDT
- Number of Channels:
- 4
- On-State Resistance (Max):
- -
- Voltage - Supply, Single (V+):
- 3.3V
- Voltage - Supply, Dual (V±):
- -
- -3db Bandwidth:
- 12GHz
- Features:
- Bi-Directional, USB 3.0, USB 3.1
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 42-TQFN (9x3.5)
PI3DBS16413ZHEX FAQ
1.How can I place an order for PI3DBS16413ZHEX through Aetrix?
Please submit a Request for Quotation (RFQ) for PI3DBS16413ZHEX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PI3DBS16413ZHEX reliable?
The price and inventory of PI3DBS16413ZHEX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PI3DBS16413ZHEX is usually 5 days.
3.What payment methods are accepted for PI3DBS16413ZHEX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PI3DBS16413ZHEX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PI3DBS16413ZHEX?
PI3DBS16413ZHEX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PI3DBS16413ZHEX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PI3DBS16413ZHEX?
For technical support, including PI3DBS16413ZHEX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PI3DBS16413ZHEX requirements.
6.How does Aetrix verify that PI3DBS16413ZHEX is sourced from the original manufacturer or authorized distributors?
All PI3DBS16413ZHEX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PI3DBS16413ZHEX meets industry standards.
7.What is the process for return or replacement of PI3DBS16413ZHEX?
All PI3DBS16413ZHEX units undergo pre-shipment inspection (PSI). If there is an issue with PI3DBS16413ZHEX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PI3DBS16413ZHEX part is unused and in its original packaging.
Return procedure for PI3DBS16413ZHEX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PI3DBS16413ZHEX Tags

-
TS3USB221ARSER
Texas Instruments

-
TS3USB221AQRSERQ1
Texas Instruments

-
NX3DV221GM,115
NXP USA Inc.

-
NX3DV2567GU,115
NXP USA Inc.

-
TS3USB221RSER
Texas Instruments

-
TS3USB221ERSER
Texas Instruments

-
TC7USB40MU,LF(S2E
Toshiba Semiconductor and Storage
-
TS3USB30EDGSR
Texas Instruments

-
PI3USB221AZUAEX
Diodes Incorporated

-
FSUSB42UMX
onsemi

-
CBTL01023GM,115
NXP USA Inc.

-
TS3USB30ERSWR
Texas Instruments
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

