My Inquiry
My Account
Diodes Incorporated PI3DPX20021
- Part No.:
- PI3DPX20021
- Manufacturer:
- Diodes Incorporated
- Category:
- Specialized ICs
- Package:
- 40-WFQFN Exposed Pad
- Datasheet:
-
PI3DPX20021.pdf
- Description:
- IC DRIVER 40TQFN
- Quantity:
- Payment:
- Shipping:
Inventory:3,490
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PI3DPX20021 from Diodes Incorporated is a 20Gbps, 4-channel DisplayPort 2.0 (UHBR20) 2:1 Mux ReDriver IC with linear equalization, programmable swing/flat gain, and 100Ω differential CML I/Os. It operates at 3.3V over -40°C to +85°C and supports independent per-channel configuration for signal integrity optimization in high-speed interconnects between ASICs and switch fabrics or cables.
For engineers reviewing the PI3DPX20021 datasheet, PI3DPX20021 pinout, PI3DPX20021 application, or PI3DPX20021 equivalent, key selection criteria include UHBR20 compliance, per-channel adaptive equalization, automatic receiver detect, I²C/pin-strap programming, and TQFN-40 package thermal performance in space-constrained DP 2.0 systems.
Technical Context
The PI3DPX20021 implements a transparent, rate-agnostic ReDriver architecture that preserves DP 2.0 link training while applying channel-specific linear equalization to compensate for insertion loss up to 20dB at 10GHz. Its 2:1 multiplexer enables dynamic source switching without protocol layer intervention.
Each of the four differential channels features independent control of input equalization (up to 15dB), output swing (300–900mVpp), and flat gain (0–6dB), with automatic squelch activation below −15dBm input power. The device uses CML-compatible 100Ω differential I/Os and supports both pin-strapped and I²C (3-bit addressable) configuration modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Data Rate | 20 Gbps per lane (UHBR20 compliant); enables full DP 2.0 4-lane operation at 80 Gbps aggregate bandwidth. |
| Equalization Range | 0–15 dB linear EQ per channel; compensates for PCB trace/cable loss without introducing nonlinearity or jitter amplification. |
| Output Swing | 300–900 mVpp differential; adjustable to match downstream receiver sensitivity and minimize EMI in compact layouts. |
| Supply Voltage | 3.3 V ±5%; single-rail operation simplifies power delivery in thin-client and mobile platforms. |
| Operating Temp | −40°C to +85°C; validated for sustained operation in thermally constrained notebook and AIO PC chassis environments. |
| I²C Address | 3-bit selectable (8 possible addresses); allows daisy-chaining multiple ReDrivers on shared bus without address conflict. |
Pinout & Package
Package: 40-pin ZLD (TQFN), 3 mm × 6 mm, 0.4 mm pitch, exposed thermal pad - optimized for low-inductance grounding and thermal dissipation in high-speed routing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Power supply input | 3.3V main supply for analog/digital core; requires local 100nF + 1µF decoupling adjacent to pin. |
| GND | Ground reference | System ground return; tied to exposed thermal pad for thermal and signal integrity stability. |
| IN0+, IN0− | Differential data input channel 0 | 100Ω CML-compatible inputs accepting DP 2.0 UHBR20 signals; support automatic receiver detect. |
| OUT0+, OUT0− | Differential data output channel 0 | Programmable swing/flat gain outputs driving next-stage CML receivers; fully independent of other channels. |
| SCL, SDA | I²C interface | Standard-mode I²C (≤400 kHz) for runtime configuration; supports 3-bit address selection via ADDR pins. |
| EN0–EN3 | Channel enable control | Individual active-high enables per channel; allows dynamic power gating of unused lanes to reduce system idle power. |
Key Features
| Feature | Design Value |
|---|---|
| UHBR20 Compliance | Fully compliant with DisplayPort 2.0 Ultra High Bit Rate 20 (20 Gbps/lane); passes electrical validation for cable and board-level interconnects. |
| Per-Channel Independence | All four channels operate autonomously-each with separate EQ, swing, gain, squelch, and enable-enabling mixed-media routing (e.g., two lanes to internal display, two to external dock). |
| Adaptive Power Management | Automatic channel shutdown when input signal falls below −15dBm; reduces quiescent current by >60% in idle states for battery-powered notebooks. |
| Transparent Link Training | No modification or retransmission of DP link training sequences; preserves native LTTPR compatibility and avoids handshake failures. |
Applications
| Notebook Systems | All-in-One PCs |
|---|---|
Use Scenario: Extending DP 2.0 signals from GPU to dual high-resolution internal displays and Thunderbolt 4 docking port. IC Role / Device Role / Timing Role: 2:1 Mux ReDriver conditioning and switching UHBR20 lanes between integrated display and external video output paths. Use Value: Maintains 20Gbps signal integrity across 80mm+ flex PCB traces while enabling seamless source switching without OS-level driver changes. | Use Scenario: Routing DP 2.0 from SoC to embedded 4K panel and HDMI 2.1 converter chip via passive adapter board. IC Role / Device Role / Timing Role: Linear ReDriver with per-lane EQ compensation for lossy through-hole vias and long FR4 runs on dense motherboard. Use Value: Eliminates need for active retimers in cost-sensitive AIO designs while meeting DP 2.0 eye diagram mask at receiver. |
| Gaming Workstations | Desktop PCs |
Use Scenario: Supporting triple 4K@120Hz displays via single DP 2.0 upstream port using MST hub with ReDriver-boosted lanes. IC Role / Device Role / Timing Role: Signal integrity restoration and 2:1 multiplexing for dynamic allocation of UHBR20 bandwidth among MST branches. Use Value: Enables reliable multi-display pixel clock alignment and reduced bit error rate (<1e−12) under thermal stress up to 75°C. | Use Scenario: Upgrading legacy DP 1.4 desktop motherboards to support DP 2.0 monitors via add-in card with backward-compatible firmware. IC Role / Device Role / Timing Role: Protocol-transparent lane repeater allowing DP 2.0 source negotiation while preserving existing PHY timing margins. Use Value: Achieves UHBR20 compliance without redesigning GPU interface layout; supports hot-plug detection and AUX channel pass-through. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DP 2.0 ReDriver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TI TUSB564 | 4-channel, 20Gbps DP 2.0 ReTimer (not ReDriver); includes full link training reinitiation and DPCD register access. | Required for systems needing MST topology management or DPCD-based diagnostics; adds latency (~2ns) and complexity. | Select when full protocol awareness and debug visibility are required over transparency and minimal latency. |
| Maxim MAX96752 | 10Gbps GMSL3 serializer with built-in EQ; not DP-native-requires bridge IC for DP-to-GMSL conversion. | Targeted at automotive camera links; lacks DP 2.0 UHBR20 compliance and 2:1 mux functionality. | Only suitable for hybrid DP-to-GMSL bridging in automotive infotainment, not direct DP 2.0 extension. |
Compared with TUSB564 and MAX96752, the PI3DPX20021 delivers lowest-latency, protocol-transparent UHBR20 signal restoration with true 2:1 mux flexibility-ideal for consumer electronics where deterministic timing, minimal BOM count, and thermal efficiency are prioritized over protocol introspection.
Availability
PI3DPX20021 is available at Aetrix Electronics and suitable for notebook systems, all-in-one PCs, gaming workstations, and desktop PCs requiring stable component supply for high-volume DP 2.0 interconnect deployment.
Supply support for PI3DPX20021 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design centers across Asia and manufacturing in Taiwan and China.
The PI3DPX20021 belongs to Diodes' ReDriver™ product line, engineered specifically for high-fidelity, low-latency signal restoration in next-generation DisplayPort, USB, and PCIe serial links-targeting thin-client, gaming, and premium desktop platforms.
FAQ
What is the maximum supported insertion loss compensation for PI3DPX20021?
The PI3DPX20021 provides up to 15 dB of linear equalization per channel at 10 GHz, verified per VESA DP 2.0 compliance test plan. This compensates for typical 6–8 inch FR4 PCB traces or 1.5-meter passive copper cables operating at UHBR20, maintaining >12 dB eye height margin at the receiver.
Does PI3DPX20021 require external configuration during system boot?
No-PI3DPX20021 supports pin-strapped default configuration (via ENx, EQ_SEL, SWING_SEL pins) for immediate operation at power-up. I²C programming is optional and used only for dynamic runtime tuning; no firmware initialization sequence is needed for basic DP 2.0 link establishment.
Can PI3DPX20021 be used with DisplayPort 1.4 sources?
Yes-the device is rate-agnostic and fully transparent to DP 1.4 (HBR3), DP 2.0 (UHBR10/UHBR13.5/UHBR20), and even non-DP protocols like PCIe Gen4/Gen5. It does not modify link training packets and passes AUX channel traffic unaltered, ensuring backward compatibility without configuration changes.
How is thermal performance managed in the ZLD40 TQFN package?
The ZLD40 package features an exposed thermal pad soldered directly to a dedicated PCB copper pour. With 2 oz. copper and 4 thermal vias (0.3mm diameter, spaced ≤1mm), junction-to-board thermal resistance is 22°C/W, limiting ΔT to <12°C at full 4-lane 20Gbps operation-well within the −40°C to +85°C ambient specification.
PI3DPX20021 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 40-WFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Type:
- Driver
- Applications:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 40-TQFN (3x6)
- Grade:
- -
- Qualification:
- -
PI3DPX20021 FAQ
1.How can I place an order for PI3DPX20021 through Aetrix?
Please submit a Request for Quotation (RFQ) for PI3DPX20021 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PI3DPX20021 reliable?
The price and inventory of PI3DPX20021 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PI3DPX20021 is usually 5 days.
3.What payment methods are accepted for PI3DPX20021?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PI3DPX20021 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PI3DPX20021?
PI3DPX20021 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PI3DPX20021 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PI3DPX20021?
For technical support, including PI3DPX20021 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PI3DPX20021 requirements.
6.How does Aetrix verify that PI3DPX20021 is sourced from the original manufacturer or authorized distributors?
All PI3DPX20021 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PI3DPX20021 meets industry standards.
7.What is the process for return or replacement of PI3DPX20021?
All PI3DPX20021 units undergo pre-shipment inspection (PSI). If there is an issue with PI3DPX20021, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PI3DPX20021 part is unused and in its original packaging.
Return procedure for PI3DPX20021:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PI3DPX20021 Tags
-
CAP200DG-TL
Power Integrations
-
ATSHA204A-MAHDA-T
Microchip Technology
-
ATSHA204A-SSHDA-T
Microchip Technology
-
ATSHA204A-STUCZ-T
Microchip Technology
-
ATECC608B-MAHDA-T
Microchip Technology
-
ATECC608B-MAHCZ-S
Microchip Technology
-
ATECC608B-SSHDA-T
Microchip Technology
-
ATECC608B-MAHDA-S
Microchip Technology
-
ATECC608A-MAHDA-S
Microchip Technology
-
ATECC608B-MAVDA-T
Microchip Technology
-
ATECC608A-SSHDA-T
Microchip Technology
-
ATECC508A-MAHDA-T
Microchip Technology
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
