Diodes Incorporated PI3EQX1064ZTFAEX

Overview

PI3EQX1064ZTFAEX from Diodes Incorporated is a 2-port USB 3.2 Gen 2 (10 Gbps) linear ReDriver IC with pin-adjustable receiver equalization and flat gain, 100 Ω differential CML I/Os, automatic receiver detect, and auto slumber mode for adaptive power management. It operates from a single 3.3 V supply and supports two independent 10 Gbps differential signal pairs for extending USB signals across cables or PCB traces in notebook, tablet, and external storage interfaces.

For engineers reviewing the PI3EQX1064ZTFAEX datasheet, PI3EQX1064ZTFAEX pinout, PI3EQX1064ZTFAEX application, or PI3EQX1064ZTFAEX equivalent, key selection considerations include its linear equalization architecture, 10 Gbps per channel capability, USB 3.2 Gen 2/Gen 1 protocol compliance, CML I/O compatibility, and slumber-mode power state transitions.

Technical Context

The PI3EQX1064 implements a linear analog ReDriver architecture-no retiming or protocol awareness-optimized for USB 3.2 Gen 2's 10 Gbps NRZ signaling. Its equalization compensates for high-frequency loss in PCB traces or passive cables, while flat gain restores signal amplitude without introducing jitter multiplication.

Each of its two channels features independent input detection logic, enabling per-channel activation and slumber entry/exit based on real-time signal presence. The automatic receiver detect loop resets after ≥7.3 ms of channel inactivity, transitioning to unplug or low-power slumber mode depending on load status.

Key Specifications

Pinout & Package

Package: 32-pin U-QFN2143-32 (2.1 mm × 4.3 mm, 0.4 mm pitch, exposed thermal pad).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar USB 3.2 Gen 2 ReDriver applications.

Compared with TI TUSB1002A and Renesas uPD720210, the PI3EQX1064ZTFAEX delivers lower power, simpler integration, and deterministic latency as a linear ReDriver-but lacks clock recovery or protocol intelligence, making it optimal for short-to-mid reach signal extension where jitter remains within USB-IF limits.

Availability

PI3EQX1064ZTFAEX is available at Aetrix Electronics and suitable for notebook docking stations, external SSD enclosures, USB-C cable extension modules, and tablet expansion hubs requiring stable component supply and long-term production continuity.

Supply support for PI3EQX1064ZTFAEX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-performance signal integrity, power management, and interface solutions for consumer, computing, and industrial markets.

The PI3EQX1064 belongs to Diodes' ReDriver™ product line, engineered specifically for high-speed serial protocols-including USB 3.2, PCIe, and DisplayPort-to extend signal reach while maintaining compliance with physical layer specifications.

FAQ

What is the maximum supported trace length for PI3EQX1064ZTFAEX at 10 Gbps?

The PI3EQX1064ZTFAEX supports up to 12 inches (30 cm) of FR-4 PCB trace at 10 Gbps with typical 5-mil trace width and 8-mil spacing, assuming ≤15 dB insertion loss at 5 GHz. Performance depends on actual board stackup and equalization setting; Diodes' application note AP02022 provides measured eye diagrams for common configurations.

Does PI3EQX1064ZTFAEX require configuration via I²C or other digital interface?

No. The PI3EQX1064ZTFAEX uses hardware pin strapping (EQ0–EQ2 and FG0–FG1) for equalization and flat gain selection. It has no digital control interface, eliminating firmware dependencies and ensuring deterministic startup behavior without initialization sequences.

Can PI3EQX1064ZTFAEX operate with USB 3.2 Gen 1 (5 Gbps) signals only?

Yes. The device automatically detects and conditions 5 Gbps signals without reconfiguration. Its linear equalization and flat gain remain effective at Gen 1 speeds, and auto slumber mode functions identically-making it fully backward compatible with legacy USB 3.0/3.1 Gen 1 designs.

Is the exposed thermal pad (EP) on the ZTFA package required to be soldered to PCB ground?

Yes. The exposed pad must be soldered to a solid copper thermal pad connected to ≥4 internal ground planes for proper thermal dissipation and electrical stability. Diodes' packaging specification ZTFA-AN-01 mandates minimum 90% solder coverage and recommends thermal vias spaced at ≤1 mm intervals beneath the pad.