Diodes Incorporated PI3EQX7841ZDEX

Overview

PI3EQX7841ZDEX from Diodes Incorporated is a 5.0 Gbps, single-port USB 3.0 ReDriver IC with I²C programmability, 100Ω differential CML I/Os, adjustable equalization/de-emphasis/output swing, and input signal detection with squelch. It operates from a single 3.3V±10% supply, consumes ~330mW, and supports industrial temperature range (–40°C to +85°C). Used in USB 3.0 cable extension and external storage interconnects.

For engineers reviewing the PI3EQX7841ZDEX datasheet, PI3EQX7841ZDEX pinout, PI3EQX7841ZDEX application, or PI3EQX7841ZDEX equivalent, key selection factors include its programmable signal conditioning for USB 3.0 link budget recovery, low-power slumber/standby modes, differential CML interface compatibility, and TQFN-20 (4×4 mm) package integration into high-density PCB layouts.

Technical Context

The PI3EQX7841ZDEX implements a two-stage signal conditioning architecture: a programmable equalizer block compensates for channel loss pre-amplification, followed by a limiting amplifier and de-emphasis driver stage. Its I²C interface (address 0x5A) enables real-time tuning of EQ gain (0–15 dB), output swing (400–800 mVpp), and de-emphasis level (0–9 dB).

Each channel includes autonomous input signal detection with V_th– threshold monitoring and automatic squelch to common-mode voltage when signal falls below threshold. EN# pin enables hardware standby mode, while I2C_EN selects between pin-strapped and I²C-controlled configuration.

Key Specifications

Pinout & Package

Package: 20-pin TQFN (4 mm × 4 mm, 0.5 mm pitch, exposed thermal pad).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar USB 3.0 signal conditioning applications.

Compared with PI3EQX7711ZDE, the PI3EQX7841ZDEX adds I²C configurability and a larger pin count for enhanced tuning, while TS3USB30E serves a fundamentally different function-switching rather than redriving-making it unsuitable for signal integrity restoration tasks.

Availability

PI3EQX7841ZDEX is available at Aetrix Electronics and suitable for USB 3.0 docking stations, external SSD enclosures, and industrial USB hubs requiring stable component supply and guaranteed long-term availability.

Supply support for PI3EQX7841ZDEX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal solutions for power management, signal integrity, and connectivity applications.

The PI3EQX7841ZDEX belongs to Diodes' ReDriver™ product line, engineered specifically to restore USB 3.0 signal integrity in space-constrained, thermally demanding interconnect applications.

FAQ

Does PI3EQX7841ZDEX support USB 3.1 Gen 1 or Gen 2?

No. The PI3EQX7841ZDEX is specified and characterized exclusively for USB 3.0 (5.0 Gbps, Gen 1). It lacks the bandwidth, jitter tolerance, and equalization range required for USB 3.1 Gen 2 (10 Gbps) compliance and is not tested or guaranteed for that standard.

Can PI3EQX7841ZDEX operate without I²C configuration?

Yes. When I2C_EN is pulled low, the device uses pin-strapped default values for equalization (6 dB), output swing (600 mVpp), and de-emphasis (3 dB). No I²C controller is required for basic operation, though full tuning requires I²C_EN = high.

What is the function of the EN# pin during USB link training?

The EN# pin is asynchronous and overrides all internal states. When asserted high, it forces the device into sub-10 µA standby regardless of link activity. During USB link training, EN# must remain low to allow normal signal detection, equalization adaptation, and eye diagram optimization.

Is the exposed thermal pad on the TQFN-20 package required to be soldered?

Yes. The exposed pad is electrically connected to GND and serves as the primary thermal path. Diodes' datasheet specifies mandatory soldering to a minimum 12 mm² copper pour with ≥4 thermal vias to inner ground planes for proper thermal dissipation and electrical stability.