My Inquiry
My Account
Diodes Incorporated PI3PCIE3242AZLEX
- Part No.:
- PI3PCIE3242AZLEX
- Manufacturer:
- Diodes Incorporated
- Category:
- Specialized
- Package:
- 30-WFQFN Exposed Pad
- Datasheet:
-
PI3PCIE3242AZLEX.pdf
- Description:
- IC INTERFACE SPECIALIZED 30TQFN
- Quantity:
- Payment:
- Shipping:
Inventory:38,756
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PI3PCIE3242AZLEX from Diodes Incorporated is a 4-channel differential 2×2 exchange switch IC for PCI Express® 3.0 signal routing, supporting bidirectional 8.0 Gbps data rates with 10 ps bit-to-bit skew, -1.45 dB insertion loss at 4.0 GHz, and 3.3 V ±10% supply operation in notebook and Type-C DRP port applications.
For engineers reviewing the PI3PCIE3242AZLEX datasheet, PI3PCIE3242AZLEX pinout, PI3PCIE3242AZLEX application, or PI3PCIE3242AZLEX equivalent, key selection criteria include PCIe 3.0 channel switching latency (≤45 ns enable time), differential crosstalk (-20 dB @ 8 Gbps), pass-through pinout compatibility, and industrial temperature range (-40°C to +85°C) support.
Technical Context
The PI3PCIE3242AZLEX implements a single-pole double-throw (SPDT) differential exchange topology per lane, enabling dynamic reconfiguration of two PCIe/USB3.0/DP1.2 differential pairs via SEL and OE# control inputs. Its architecture maintains impedance-matched 100 Ω differential paths across all switch states.
It operates with rail-to-rail 3.3 V logic control (VIH = 0.65 × VDD, VIL = 0.35 × VDD), supports high-impedance tri-state output when OE# = 1, and delivers <20 ps channel-to-channel skew between A/B/C/D ports - critical for multi-lane timing alignment in Type-C multiplexing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Data Rate | 8.0 Gbps - fully compliant with PCIe 3.0 Gen3 signaling requirements. |
| Insertion Loss | -1.45 dB @ 4.0 GHz - ensures minimal signal amplitude degradation at full-speed operation. |
| Crosstalk | -20 dB @ 4.0 GHz (8 Gbps) - prevents inter-pair interference in dense PCB layouts. |
| Bit-to-Bit Skew | 10 ps - preserves differential pair integrity and eye opening for reliable RX recovery. |
| Supply Voltage | 3.3 V ±10% - compatible with standard I/O rails and eliminates need for auxiliary regulators. |
| Operating Temp | -40°C to +85°C - validated for industrial-grade embedded and mobile computing environments. |
| ESD Tolerance | 2 kV HBM - provides robust handling during board assembly and system integration. |
Pinout & Package
Package: 30-contact TQFN (ZL30), 2.5 mm × 4.5 mm, exposed thermal pad, RoHS-compliant and halogen-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0+, A0− | Differential I/O, Channel 0, Port A | Primary input/output path for first differential pair in pass-through or crossbar mode. |
| A1+, A1− | Differential I/O, Channel 1, Port A | Second differential pair interface on Port A; enables dual-lane switching capability. |
| B0+, B0− / B1+, B1− | Differential I/O, Channel 0/1, Port B | Default output port for A→B routing; matched trace length critical for PCIe timing. |
| C0+, C0− / C1+, C1− | Differential I/O, Channel 0/1, Port C | Secondary input port; connects to D in crossbar mode (C→D or C→B depending on SEL). |
| D0+, D0− / D1+, D1− | Differential I/O, Channel 0/1, Port D | Crossbar output port; used for alternate routing (A→D, C→B) to support Type-C DRP flexibility. |
| SEL | Digital control input | Selects switch matrix state: low = A↔B & C↔D; high = A↔D & C↔B. |
| OE# | Active-low output enable | Tri-states all I/O when high; essential for hot-plug and power-gating sequences. |
| VDD (Pins 11,15,21,26,30) | Power supply | Five dedicated 3.3 V supply pins minimize IR drop and improve PSRR for high-speed analog paths. |
| GND (Pins 6,13,20,28,Center Pad) | Ground reference | Five ground connections + exposed thermal pad ensure low-inductance return paths and thermal stability. |
Key Features
| Feature | Design Value |
|---|---|
| PCIe 3.0–compliant 2×2 exchange | Enables dynamic lane remapping for USB3.0 + DP1.2 over Type-C without protocol translation. |
| Pass-through pinout | Minimizes PCB layout complexity and reduces layer count by aligning I/O pins with standard connector footprints. |
| Low 10 ps bit-to-bit skew | Maintains differential signal integrity across all switch configurations, preserving eye height and jitter margin. |
| Bi-directional operation | Supports upstream/downstream traffic flow in both switch states - no directionality constraints on signal paths. |
| Industrial temperature range | Validated operation from -40°C to +85°C ensures reliability in fanless notebooks and embedded edge devices. |
Applications
| USB3.0 + DP1.2 Multiplexing | Type-C Dual-Role Port (DRP) |
|---|---|
|
Use Scenario: Routing USB3.0 TX/RX and DisplayPort lanes through a single USB-C connector in ultrabooks. IC Role / Device Role / Timing Role: Differential 2×2 exchange switch managing four high-speed lanes with sub-20 ps channel skew. Use Value: Eliminates need for separate USB and DP switches, reducing BOM count and PCB area while maintaining Gen3 compliance. |
Use Scenario: Enabling host/peripheral role switching in tablets with reversible USB-C connectivity. IC Role / Device Role / Timing Role: Signal path reconfigurator controlled by CC logic to adapt physical layer routing based on cable orientation. Use Value: Supports seamless DRP handshaking with <45 ns SEL-to-output propagation, meeting USB PD specification timing budgets. |
| Notebook Docking Interface | Embedded GPU Interconnect |
|
Use Scenario: Dynamic allocation of PCIe lanes between internal NVMe storage and external Thunderbolt/PCIe expansion docks. IC Role / Device Role / Timing Role: High-speed lane selector enabling shared physical interface between two high-bandwidth peripherals. Use Value: Delivers -1.45 dB insertion loss at 4 GHz, ensuring >24 dB SNR margin for 8 GT/s link training success. |
Use Scenario: Reconfigurable interconnect between SoC and discrete GPU in compact gaming laptops. IC Role / Device Role / Timing Role: Low-skew differential switch enabling flexible PCIe topology without retiming or redriving. Use Value: Maintains PCIe 3.0 eye diagram integrity (verified via 8.0 Gbps RX eye test) under thermal stress up to 85°C. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar differential PCIe/USB3.0 exchange switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| PI3DBS3224ZLEX | 4-channel, 2×2 switch with identical pinout but higher insertion loss (-1.7 dB @ 4 GHz) and no OE# control. | Lacks tri-state capability; unsuitable for hot-plug or power-gated systems requiring dynamic isolation. | Prefer PI3PCIE3242AZLEX where OE#-driven power sequencing or system-level isolation is required. |
| TS3USB30EIRGER | Single 2×2 USB3.0 switch (not PCIe-rated); max 5 Gbps, -1.2 dB IL @ 2.5 GHz, no SEL-controlled crossbar mode. | Only supports USB3.0; lacks PCIe 3.0 validation, 8 Gbps bandwidth, and dual-mode routing logic. | Choose PI3PCIE3242AZLEX for mixed-protocol (USB+DP+PCIe) Type-C implementations demanding Gen3 compliance. |
Compared with PI3DBS3224ZLEX and TS3USB30EIRGER, the PI3PCIE3242AZLEX uniquely combines PCIe 3.0 validation, active OE# tri-state control, and true 2×2 exchange logic - making it the only option qualified for dynamic multi-protocol lane routing in production notebooks and DRP-enabled tablets.
Availability
PI3PCIE3242AZLEX is available at Aetrix Electronics and suitable for USB-C docking stations, thin-and-light notebooks, and embedded GPU interconnects requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant sourcing.
Supply support for PI3PCIE3242AZLEX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and integrated circuits, specializing in high-performance analog, logic, and power management solutions for industrial, computing, and consumer markets.
The PI3PCIE3242AZLEX belongs to Diodes' Pericom high-speed signal integrity product line, engineered specifically for PCIe 3.0, USB3.0, and DisplayPort 1.2 multiplexing in space-constrained portable and docking applications.
FAQ
What is the maximum supported data rate and protocol compliance of the PI3PCIE3242AZLEX?
The PI3PCIE3242AZLEX supports 8.0 Gbps data rates and is fully validated for PCI Express® 3.0 Gen3 compliance, including insertion loss (-1.45 dB @ 4.0 GHz), crosstalk (-20 dB @ 4.0 GHz), and bit-to-bit skew (10 ps). It also meets USB3.0 and DP1.2 electrical requirements, enabling multi-protocol use in Type-C applications.
How does the SEL and OE# control logic function in practice?
When OE# = 0, the switch is enabled: SEL = 0 routes A↔B and C↔D; SEL = 1 routes A↔D and C↔B. When OE# = 1, all I/O pins enter high-impedance state regardless of SEL value - enabling safe hot-plug insertion, power gating, or system-level isolation without signal contention.
Is the PI3PCIE3242AZLEX suitable for automotive applications?
No - the PI3PCIE3242AZLEX is rated for industrial temperature (-40°C to +85°C) and is not AEC-Q100 qualified. Diodes Incorporated explicitly states that automotive-grade variants require PPAP capability, IATF 16949 manufacturing, and specific change control - none of which apply to this part number.
What package type and PCB layout considerations apply to the PI3PCIE3242AZLEX?
It uses a 30-pin TQFN (ZL30) package, 2.5 mm × 4.5 mm, with an exposed thermal pad. Layout requires strict 100 Ω differential impedance control, matched trace lengths (<2 mm skew), and dedicated VDD/GND decoupling (five each) adjacent to the package. JEDEC MO-220-compliant land pattern is recommended.
PI3PCIE3242AZLEX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- PCI Express® (PCIe)
- Package/Case:
- 30-WFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- PCIe
- Interface:
- PCI Express
- Voltage - Supply:
- 3V ~ 3.6V
- Supplier Device Package:
- 30-TQFN (2.5x4.5)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
PI3PCIE3242AZLEX FAQ
1.How can I place an order for PI3PCIE3242AZLEX through Aetrix?
Please submit a Request for Quotation (RFQ) for PI3PCIE3242AZLEX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PI3PCIE3242AZLEX reliable?
The price and inventory of PI3PCIE3242AZLEX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PI3PCIE3242AZLEX is usually 5 days.
3.What payment methods are accepted for PI3PCIE3242AZLEX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PI3PCIE3242AZLEX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PI3PCIE3242AZLEX?
PI3PCIE3242AZLEX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PI3PCIE3242AZLEX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PI3PCIE3242AZLEX?
For technical support, including PI3PCIE3242AZLEX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PI3PCIE3242AZLEX requirements.
6.How does Aetrix verify that PI3PCIE3242AZLEX is sourced from the original manufacturer or authorized distributors?
All PI3PCIE3242AZLEX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PI3PCIE3242AZLEX meets industry standards.
7.What is the process for return or replacement of PI3PCIE3242AZLEX?
All PI3PCIE3242AZLEX units undergo pre-shipment inspection (PSI). If there is an issue with PI3PCIE3242AZLEX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PI3PCIE3242AZLEX part is unused and in its original packaging.
Return procedure for PI3PCIE3242AZLEX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PI3PCIE3242AZLEX Tags
-
NVT4857UKAZ
NXP Semiconductors
-
TCA8418RTWR
Texas Instruments
-
PCA9546APWR
Texas Instruments
-
MD0100N8-G
Microchip Technology
-
PCA9548APW,118
NXP Semiconductors
-
PCA9540BDP,118
NXP Semiconductors
-
PCA9548APWR
Texas Instruments
-
PCA9546APW,118
NXP Semiconductors
-
PTN3360DBS,518
NXP Semiconductors
-
PCA9546ABS,118
NXP Semiconductors
-
PCA9518PWR
Texas Instruments
-
PCA9545APW,118
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
