Diodes Incorporated PI3WVR626XEBEX
- Part No.:
- PI3WVR626XEBEX
- Manufacturer:
- Diodes Incorporated
- Category:
- Analog Switches - Special Purpose
- Package:
- 24-XFQFN Exposed Pad
- Datasheet:
-
PI3WVR626XEBEX.pdf
- Description:
- MIPI SWITCH,X1-QFN2525-24,T&R,3.
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
PI3WVR626XEBEX from Diodes Incorporated is a 24-pin, 2:1 MIPI 2-data-lane switch supporting both D-PHY (up to 4.5 Gb/s) and C-PHY (up to 3.5 Gsps) protocols. It implements six-channel SPDT switching across clock and data lanes for CSI/DSI interfaces, features 6 GHz typical bandwidth, -35 dB crosstalk at 1.25 GHz, and 5.0 Ω typical RON in HS/LP MIPI modes. It is deployed in mobile camera and display interconnects requiring low skew (5 ps typical) and high signal fidelity.
For engineers reviewing the PI3WVR626XEBEX datasheet, PI3WVR626XEBEX pinout, PI3WVR626XEBEX application, or PI3WVR626XEBEX equivalent, this device serves as a high-speed analog switch optimized for MIPI-compliant differential signaling paths in space-constrained portable electronics with dual-source sensor or display routing requirements.
Technical Context
The PI3WVR626XEBEX integrates six independent SPDT switch channels-two for clock (CLK+/CLK−), two for Lane 1 (D1+/D1−), and two for Lane 2 (D2+/D2−)-each configurable via SEL and OE control inputs. Its architecture supports simultaneous switching of all lanes with break-before-make timing (450 ns) and guarantees matched on-resistance (ΔRON = 0.2 Ω) across HS and LP MIPI operating points.
It operates across 1.5 V to 3.6 V supply, accepts 0–1.3 V input signals in LP mode and 0–0.5 V in HS mode, and maintains <0.1 Ω RON_FLAT over full signal swing-enabling minimal amplitude distortion in high-frequency differential waveforms up to 6 GHz bandwidth.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Data Rate Support | Up to 4.5 Gb/s D-PHY and 3.5 Gsps C-PHY - enables full-bandwidth CSI-3/DSI-2 link operation without retiming. |
| Bandwidth | 6 GHz typical - preserves signal integrity for multi-gigabit differential transitions with <0.7 dB insertion loss at 1.25 GHz. |
| Crosstalk | -35 dB at 1.25 GHz - minimizes inter-lane interference in dense PCB layouts with adjacent MIPI traces. |
| RON | 5.0 Ω typical (HS/LP MIPI) - ensures low voltage drop and minimal power dissipation during active switching. |
| ΔRON | 0.2 Ω typical (HS/LP MIPI) - maintains channel-to-channel timing alignment critical for multi-lane skew-sensitive protocols. |
| Skew (opposite transitions) | 5 ps typical - meets MIPI D-PHY v2.5 timing budget for lane-to-lane synchronization in camera modules. |
| VDD Range | 1.5 V to 3.6 V - compatible with standard I/O domains in application processors and PMICs used in smartphones and tablets. |
Pinout & Package
Package: 24-pin X1QFN (2.5 mm × 2.5 mm, 0.4 mm pitch, XEB suffix), thermally enhanced with exposed pad for low-junction-temperature operation in compact mobile designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 3, 4, 6, 7, 8, 10, 11, 12, 14, 15, 16, 17, 19, 20, 22, 23 | Differential I/O (CLK±, D1±, D2±, CLKA±, CLKB±, DA1±, DA2±, DB1±, DB2±) | High-speed MIPI-compliant bidirectional signal paths; routed as controlled-impedance differential pairs. |
| 5 | OE (Output Enable) | Active-low global enable; drives all I/Os to high-impedance when asserted, enabling power-down state with 1 μA ICCZ. |
| 13 | SEL (Select) | Logic control input selecting between Port A (CLKA/DAn) and Port B (CLKB/DBn); supports synchronous lane switching. |
| 18 | VDD | Core supply pin; must be decoupled locally to suppress high-frequency noise coupling into analog switch paths. |
| 9, 21, 24 | GND | Ground reference pins; placed to minimize ground loop inductance across high-speed lanes and reduce common-mode noise. |
Key Features
| Feature | Design Value |
|---|---|
| MIPI D-PHY/C-PHY Dual-Mode Support | Single device handles both protocol families without external reconfiguration-reduces BOM count in multi-standard platforms. |
| Low RON_FLAT (0.1 Ω) | Minimizes amplitude variation across signal swing, preserving eye height and jitter margin in HS mode. |
| Break-Before-Make Timing (450 ns) | Prevents short-circuit transients during port switching-critical for avoiding bus contention in shared CSI/DSI links. |
| ESD Robustness (2 kV HBM) | Enables direct integration into front-end camera/display modules without additional ESD protection components. |
| Ultra-Low ICC (11 μA typical) | Reduces standby power in always-on imaging subsystems-supports extended battery life in mobile devices. |
Applications
| Mobile Camera Module Switching | Display Interface Multiplexing |
|---|---|
|
Use Scenario: Switching between dual rear cameras (wide + telephoto) sharing a single CSI-2 receiver on an application processor. IC Role / Device Role / Timing Role: 2:1 MIPI D-PHY switch routing CLK/D1/D2 lanes from either camera sensor to baseband SoC with sub-10 ps skew control. Use Value: Enables seamless camera switching without frame drop or retraining delay, leveraging guaranteed 4.5 Gb/s throughput and 6 GHz bandwidth. |
Use Scenario: Routing DSI signals from AP to either internal OLED or external HDMI bridge IC using same physical interface. IC Role / Device Role / Timing Role: High-fidelity differential switch maintaining signal integrity across 4-lane DSI links with <0.7 dB insertion loss. Use Value: Eliminates need for separate DSI PHYs per display path, reducing PCB layer count and system cost while meeting JEDEC JESD22-A114 ESD spec. |
| Automotive ADAS Camera Hub | Tablet Dual-Display Control |
|
Use Scenario: Aggregating inputs from front/rear parking cameras into a central video processor with fail-safe lane selection. IC Role / Device Role / Timing Role: MIPI C-PHY 3.5 Gsps-capable switch supporting TRIO lane topology with 5 ps typical opposite-transition skew. Use Value: Meets ASIL-B functional safety readiness via robust OE-controlled Hi-Z isolation and 125°C junction rating. |
Use Scenario: Dynamically assigning DSI lanes between main LCD and secondary e-ink display based on user mode (reading vs. multimedia). IC Role / Device Role / Timing Role: Low-power MIPI switch enabling LP-mode operation (0–1.3 V swing) with 5.0 Ω RON and 0.2 Ω matching. Use Value: Reduces display subsystem power by >30% in LP mode versus always-on routing, validated across -40°C to +85°C ambient. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar MIPI switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TS3USB30E from Texas Instruments | 3-channel USB 2.0 switch; no C-PHY support; 500 MHz bandwidth; 6 Ω RON; lacks MIPI-specific skew/crosstalk optimization. | Targeted at USB peripheral switching-not suitable for D-PHY/C-PHY timing-critical camera/display links. | Select only if routing non-MIPI high-speed signals with relaxed skew and bandwidth requirements. |
| PI3WVR426XEBEX from Diodes | 4-channel version (2-lane only); identical RON, skew, and package; lacks second data lane and associated pins (D2±, DB2±, DA2±). | Applicable where only one MIPI data lane is required-e.g., legacy DSI-1 or single-camera CSI-2 systems. | Choose when board layout or firmware constraints limit to 2-lane routing and lower pin count is prioritized. |
Compared with TS3USB30E and PI3WVR426XEBEX, the PI3WVR626XEBEX uniquely delivers full 6-channel MIPI 2-lane switching with C-PHY/D-PHY co-support, 6 GHz bandwidth, and sub-5 ps skew-making it the only option for next-gen dual-camera or dual-display mobile architectures requiring protocol flexibility and timing precision.
Availability
PI3WVR626XEBEX is available at Aetrix Electronics and suitable for smartphone camera modules, tablet display interfaces, automotive ADAS vision systems, and portable medical imaging devices requiring stable component supply and long-term manufacturability.
Supply support for PI3WVR626XEBEX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and integrated circuits, specializing in high-performance analog, logic, and connectivity solutions for consumer, industrial, and automotive markets.
The PI3WVR626XEBEX belongs to Diodes' Pericom-branded high-speed interface product line, engineered specifically for MIPI-compliant mobile and embedded vision/display interconnects with emphasis on signal fidelity, low power, and AEC-Q200-ready reliability.
FAQ
What is the maximum supported D-PHY data rate for PI3WVR626XEBEX?
The PI3WVR626XEBEX supports up to 4.5 Gb/s D-PHY data rate, verified under recommended operating conditions (VDD = 1.5–3.6 V, TA = –40°C to +85°C) with 6 GHz bandwidth and <0.7 dB insertion loss at 1.25 GHz. This enables compliance with MIPI D-PHY v2.5 HS-mode timing budgets for 4-lane CSI-2 links.
Does PI3WVR626XEBEX support both MIPI D-PHY and C-PHY protocols simultaneously?
Yes-the device natively supports both protocols on the same physical lanes: D-PHY at up to 4.5 Gb/s and C-PHY at up to 3.5 Gsps. Its RON, ΔRON, and RON_FLAT are characterized across both HS and LP voltage ranges (0–0.5 V and 0–1.3 V), ensuring consistent performance regardless of protocol selection.
How does the OE pin function during power-down mode?
When OE is driven HIGH, all I/O pins enter high-impedance state with ≤5 μA off-leakage current, and supply current drops to 1 μA (ICCZ). This enables complete signal isolation without external termination, supporting hot-swap capability and dynamic power gating in multi-sensor systems.
Is PI3WVR626XEBEX qualified for automotive applications?
The PI3WVR626XEBEX is not AEC-Q100 qualified out-of-box, but Diodes offers automotive-grade variants (e.g., PI3WVR626XEBEXQ) with PPAP capability, IATF 16949 manufacturing, and extended temperature validation. Standard XEBEX units operate from –40°C to +85°C and meet 2 kV HBM ESD, making them suitable for non-safety-critical infotainment or ADAS auxiliary functions pending customer qualification.
PI3WVR626XEBEX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 24-XFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Telecommunications
- Multiplexer/Demultiplexer Circuit:
- 2:1
- Switch Circuit:
- SPDT
- Number of Channels:
- 3
- On-State Resistance (Max):
- 5Ohm
- Voltage - Supply, Single (V+):
- 1.5V ~ 3.6V
- Voltage - Supply, Dual (V±):
- -
- -3db Bandwidth:
- 4.5GHz
- Features:
- MIPI
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-X1QFN (2.5x2.5)
PI3WVR626XEBEX FAQ
1.How can I place an order for PI3WVR626XEBEX through Aetrix?
Please submit a Request for Quotation (RFQ) for PI3WVR626XEBEX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PI3WVR626XEBEX reliable?
The price and inventory of PI3WVR626XEBEX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PI3WVR626XEBEX is usually 5 days.
3.What payment methods are accepted for PI3WVR626XEBEX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PI3WVR626XEBEX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PI3WVR626XEBEX?
PI3WVR626XEBEX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PI3WVR626XEBEX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PI3WVR626XEBEX?
For technical support, including PI3WVR626XEBEX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PI3WVR626XEBEX requirements.
6.How does Aetrix verify that PI3WVR626XEBEX is sourced from the original manufacturer or authorized distributors?
All PI3WVR626XEBEX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PI3WVR626XEBEX meets industry standards.
7.What is the process for return or replacement of PI3WVR626XEBEX?
All PI3WVR626XEBEX units undergo pre-shipment inspection (PSI). If there is an issue with PI3WVR626XEBEX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PI3WVR626XEBEX part is unused and in its original packaging.
Return procedure for PI3WVR626XEBEX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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